Texas Instruments UCC27325DGN

Overview

UCC27325DGN from Texas Instruments is a dual low-side MOSFET driver with one inverting and one noninverting output channel, delivering ±4-A peak gate drive current at the Miller plateau region, operating from 4.5 V to 15 V supply, and featuring TTL/CMOS-compatible inputs independent of VDD - used in synchronous rectification stages of high-frequency DC-DC converters.

For engineers reviewing the UCC27325DGN datasheet, UCC27325DGN pinout, UCC27325DGN application, or UCC27325DGN equivalent, key selection criteria include output logic configuration (INVA/OUTA, NONINVA/OUTB), thermal performance in MSOP-PowerPAD™ package, Miller-region drive capability under low-VDD conditions, and parallel-output implementation for 8-A drive.

Technical Context

The UCC27325DGN implements a Bi-CMOS hybrid output stage combining bipolar and MOSFET transistors in parallel to sustain ±4-A peak sourcing/sinking during the Miller plateau, even at VDD = 4.5 V. Its input stage provides wide hysteresis and voltage-independent TTL/CMOS thresholds (VIN_H = 1.6–2.5 V, VIN_L = 0.8–1.5 V), ensuring noise immunity across temperature.

Each channel operates independently: OUTA is inverting (intended for P-channel MOSFETs), OUTB is noninverting (intended for N-channel MOSFETs); both outputs swing rail-to-rail (GND to VDD) with matched 20 ns rise / 15 ns fall times into 1.8-nF load and propagation delays of 25 ns (TD1) / 35 ns (TD2).

Key Specifications

Pinout & Package

UCC27325DGN is housed in an 8-pin MSOP package with exposed PowerPAD™ thermal pad (3.00 mm × 3.00 mm footprint), where the PowerPAD is electrically connected to GND and provides low-impedance thermal path to PCB copper.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual low-side MOSFET driver applications.

Compared with UCC27324DGN, UCC27325DGN enables asymmetric gate drive logic without external inverters; compared with LM5113SDX, it delivers true dual-channel operation with superior thermal performance and lower system component count in half-bridge and synchronous rectifier designs.

Availability

UCC27325DGN is available at Aetrix Electronics and suitable for switch-mode power supplies, DC-DC converters, and motor control systems requiring stable component supply, long-term industrial lifecycle support, and traceable sourcing.

Supply support for UCC27325DGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company designing analog ICs, embedded processors, and power management solutions for industrial, automotive, and communications markets.

The UCC27325DGN belongs to TI's high-speed power-MOSFET driver product line, engineered specifically for efficient, reliable gate driving in high-frequency, high-efficiency power conversion systems.

FAQ

What logic configuration does the UCC27325DGN implement?

The UCC27325DGN implements one inverting channel (INA → OUTA) and one noninverting channel (INB → OUTB). This configuration supports asymmetric drive requirements such as synchronous buck converters where high-side and low-side switches require opposite logic polarity. It differs from UCC27323DGN (dual inverting) and UCC27324DGN (dual noninverting), and is confirmed in TI's Device Comparison Table and truth table (Table 7-1).

Can the UCC27325DGN outputs be paralleled for higher drive current?

Yes, the UCC27325DGN supports paralleling of OUTA and OUTB by connecting INA and INB together and tying OUTA/OUTB directly (or via matched gate resistors). TI specifies this in Section 8.2.2.2 and confirms ±8-A combined peak current capability. Layout best practices - short trace lengths, symmetric routing, and fast input edges (>20 V/µs) - are required to prevent channel mismatch and ensure balanced current sharing.

What is the thermal advantage of the MSOP-PowerPAD™ package used by UCC27325DGN?

The UCC27325DGN's MSOP-PowerPAD™ package achieves RθJA = 56.6°C/W, which is 47% lower than the SOIC-8 variant (107.3°C/W). This reduction is due to the exposed thermal pad soldered to PCB ground plane, lowering junction-to-board resistance to 32.6°C/W. In practice, this allows sustained ±4-A drive at 12 V with ≤2.5 W dissipation without forced air - critical for sealed industrial enclosures.

Does the UCC27325DGN require external pull-up or pull-down resistors on its inputs?

No, the UCC27325DGN does not require external pull-up or pull-down resistors on INA or INB because its inputs feature TTL/CMOS-compatible thresholds with built-in hysteresis and are designed to interface directly with standard logic outputs. However, unused inputs must be tied to either VDD or GND - never left floating - as explicitly stated in Table 5-1 and Section 7.3.1 to prevent undefined output states and potential shoot-through.

How does the UCC27325DGN maintain ±4-A drive capability at low supply voltages?

The UCC27325DGN sustains ±4-A peak current down to VDD = 4.5 V using a Bi-CMOS hybrid output stage: bipolar transistors provide strong low-VCE(sat) sourcing/sinking, while parallel MOSFETs contribute high-current capability at higher VDD. This architecture avoids the sharp current roll-off seen in pure CMOS drivers, enabling consistent Miller-region drive across the full 4.5–15 V operating range - verified in Figure 8-2 and 8-3 test circuits.