Texas Instruments UCC27325DGNR

Overview

UCC27325DGNR from Texas Instruments is a dual low-side MOSFET driver with one inverting (OUTA) and one noninverting (OUTB) output channel, delivering ±4-A peak gate drive current at the Miller plateau region, operating from 4.5 V to 15 V supply, and housed in an 8-pin MSOP-PowerPAD™ package for enhanced thermal performance in high-frequency power converters.

For engineers reviewing the UCC27325DGNR datasheet, UCC27325DGNR pinout, UCC27325DGNR application, or UCC27325DGNR equivalent, this page delivers verified electrical specs, validated pin functions, confirmed thermal metrics, real-world switching behavior under 1.8-nF load, and precise alternative part guidance for gate-drive stage selection in SMPS and motor control designs.

Technical Context

The UCC27325DGNR implements a BiPolar–MOSFET hybrid output stage that enables constant-current sourcing and sinking even at low VDD (down to 4.5 V), minimizing shoot-through risk while maintaining fast edge fidelity. Its TTL/CMOS-compatible inputs feature wide hysteresis (VIN_H = 1.6–2.5 V, VIN_L = 0.8–1.5 V) and are fully independent of supply voltage.

Each output drives independently: OUTA is inverting (intended for P-channel MOSFETs), OUTB is noninverting (intended for N-channel MOSFETs); both deliver 20-ns rise / 15-ns fall times into 1.8-nF capacitive loads, with propagation delays of 25 ns (TD1) and 35 ns (TD2) - critical for synchronous rectification and phase-shifted topologies requiring tight timing alignment.

Key Specifications

Pinout & Package

UCC27325DGNR uses an 8-pin MSOP-PowerPAD™ package (3.0 mm × 3.0 mm), with thermally enhanced exposed pad electrically connected to GND for low-junction-to-board resistance (RθJB = 32.6 °C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual low-side gate driver applications.

Compared with UCC27324DGNR and LM5113SDX/NOPB, UCC27325DGNR uniquely provides asymmetric logic (inverting + noninverting) in a thermally superior 3-mm MSOP package - enabling single-chip drive of complementary low-side switches without external inverters or layout compromises.

Availability

UCC27325DGNR is available at Aetrix Electronics and suitable for switch-mode power supplies, solar microinverters, and motor control inverters requiring stable component supply, long-term lifecycle support, and traceable sourcing for industrial OEM programs.

Supply support for UCC27325DGNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of leadership in high-performance gate drivers and power conversion solutions.

The UCC27325DGNR belongs to TI's UCCx732x dual MOSFET driver product line, engineered specifically for high-efficiency, high-frequency power stages where Miller plateau drive strength, thermal resilience, and logic flexibility are critical.

FAQ

What is the maximum operating junction temperature for UCC27325DGNR?

The UCC27325DGNR has a specified operating junction temperature range of –40°C to +125°C. This rating is validated across the full 4.5–15-V supply range and applies to continuous operation with proper PCB thermal design - including soldering the PowerPAD to a 2-layer 1-oz copper ground plane per TI's layout guidelines. Derating is not required within this range when RθJB ≤ 35 °C/W is maintained.

Can UCC27325DGNR drive both N-channel and P-channel MOSFETs simultaneously?

Yes - UCC27325DGNR is specifically configured for this use case: OUTA is inverting and intended for P-channel MOSFET gate drive, while OUTB is noninverting and intended for N-channel MOSFET gate drive. Both outputs deliver ±4-A peak current and share identical timing specs (20-ns rise, 15-ns fall), enabling true complementary low-side control without external logic inversion.

Is UCC27325DGNR pin-compatible with the SOIC-8 version UCC27325DR?

Yes - UCC27325DGNR uses the industry-standard pinout defined for the UCCx732x family. Pin numbering, function mapping (e.g., INA=Pin2, OUTA=Pin7), and logic behavior are identical between the MSOP-PowerPAD (DGN) and SOIC-8 (D/DR) packages. Only the physical footprint and thermal performance differ; no schematic or firmware changes are needed when migrating from D to DGN.

What is the recommended VDD bypassing scheme for UCC27325DGNR?

Texas Instruments specifies two mandatory VDD bypass capacitors for UCC27325DGNR: a 0.1-µF X7R ceramic capacitor placed as close as possible to Pin 6 (VDD) and Pin 3 (GND), plus a ≥1-µF low-ESR aluminum or tantalum capacitor in parallel. This dual-capacitor network maintains low impedance across 100 kHz–100 MHz, preventing supply droop during ±4-A transient current pulses and suppressing high-frequency switching noise coupling.

Does UCC27325DGNR require external pull-up or pull-down resistors on INA/INB inputs?

No - UCC27325DGNR inputs have internally biased TTL/CMOS-compatible thresholds with built-in hysteresis; external resistors are unnecessary. However, unused inputs (INA or INB) must be hard-wired to either VDD or GND - never left floating - to prevent undefined output states, increased IDD, or potential oscillation due to noise coupling on unterminated pins.