Texas Instruments UCC27325P

Overview

UCC27325P from Texas Instruments is a dual low-side MOSFET driver with one inverting (OUTA) and one noninverting (OUTB) output channel, delivering ±4-A peak gate drive current at the Miller plateau region, operating from 4.5 V to 15 V supply, and featuring TTL/CMOS-compatible inputs independent of VDD - used in synchronous rectification stages of high-frequency DC-DC converters.

For engineers reviewing the UCC27325P datasheet, UCC27325P pinout, UCC27325P application, or UCC27325P equivalent, this page delivers verified electrical specs, thermal performance data, SOIC-8 package layout guidance, and real-world selection criteria for power stage gate drive optimization.

Technical Context

The UCC27325P implements a Bi-CMOS hybrid output stage-parallel bipolar and MOSFET transistors-that sustains ±4-A peak sourcing/sinking capability even at low VDD (4.5 V), enabling robust Miller plateau drive without droop. Its input stage features wide hysteresis (VIN_H = 1.6–2.5 V, VIN_L = 0.8–1.5 V) and 500-mA reverse-current tolerance, ensuring noise immunity in noisy power environments.

Each channel operates independently: OUTA is inverting (intended for P-channel MOSFETs), OUTB is noninverting (intended for N-channel MOSFETs); both outputs swing rail-to-rail (GND to VDD) with matched 20 ns rise / 15 ns fall times (1.8 nF load) and propagation delays of 25 ns (TD1) / 35 ns (TD2). The device supports parallel operation of OUTA/OUTB for 8-A aggregate drive.

Key Specifications

Pinout & Package

UCC27325P is housed in an industry-standard 8-pin SOIC (D) package (4.90 mm × 3.91 mm), optimized for automated assembly and thermal management via GND-connected lead frame. Pin 1 and Pin 8 are No Internal Connection (N/C) and must remain unconnected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual low-side gate driver applications.

Compared with TC4427ACOA and MIC4426YM, the UCC27325P delivers double the peak current into Miller capacitance, maintains logic compatibility across its full supply range, and integrates N/C pins to simplify routing - making it optimal for high-efficiency, high-frequency power stages where gate drive fidelity directly impacts system efficiency.

Availability

UCC27325P is available at Aetrix Electronics and suitable for switch-mode power supplies, DC-DC converters, and solar inverters requiring stable component supply, long-term obsolescence mitigation, and traceable industrial-grade sourcing.

Supply support for UCC27325P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader focused on analog, embedded processing, and power management technologies, serving industrial, automotive, and communications markets with high-reliability components.

The UCC27325P belongs to TI's high-speed power-MOSFET driver product line, engineered specifically for efficient, noise-immune gate driving in high-frequency, high-efficiency power conversion systems - emphasizing Miller plateau current delivery and thermal resilience.

FAQ

What is the logic configuration of UCC27325P?

The UCC27325P features one inverting output (OUTA) and one noninverting output (OUTB), enabling simultaneous drive of complementary P-channel and N-channel MOSFETs in half-bridge or synchronous rectifier topologies. This configuration is explicitly defined in the device comparison table and truth table of the SLUS492K datasheet, distinguishing it from the dual-inverting UCC27323P and dual-noninverting UCC27324P variants.

Can UCC27325P drive SiC or GaN FETs?

Yes, the UCC27325P can drive SiC and GaN FETs - its ±4-A peak output current, 20 ns rise time, and rail-to-rail swing meet the gate drive requirements of most discrete wide-bandgap devices. However, layout must minimize parasitic inductance (short traces, ground plane, Kelvin source connections), and external gate resistors may be needed to dampen ringing due to higher dV/dt.

What is the purpose of the N/C pins on UCC27325P?

Pins 1 and 8 of the UCC27325P are designated N/C (No Internal Connection) - they have no internal bond wire or circuit connection. Per TI's datasheet, these pins must remain unconnected on the PCB; tying them to GND or VDD is unnecessary and may introduce unintended coupling paths in high-noise environments.

Does UCC27325P require external bootstrap or charge-pump circuitry?

No, the UCC27325P is a low-side-only driver and does not require bootstrap or charge-pump circuitry. It operates exclusively with a single ground-referenced supply (VDD), making it suitable only for low-side gate drive applications - such as synchronous rectifiers, half-bridge low-side switches, or N-channel MOSFET drivers in buck converters.

How does UCC27325P handle input noise in high-dV/dt environments?

The UCC27325P incorporates wide input hysteresis (typical 0.8 V) and 500-mA reverse-current tolerant inputs, enabling reliable operation in noisy power stages. Its TTL/CMOS-compatible thresholds remain stable across the full 4.5–15 V VDD range, eliminating false triggering from coupled transients - a key advantage over drivers lacking hysteresis or VDD-dependent thresholds.