Texas Instruments UCC27423DGN

Overview

UCC27423DGN from Texas Instruments is a dual low-side MOSFET driver with dual inverting outputs, ±4-A peak source/sink current capability, 20-ns rise/15-ns fall time (1.8-nF load), 4–15-V supply range, and integrated enable inputs (ENBA/ENBB) for independent channel control-used to drive high-speed synchronous rectifiers and half-bridge N-channel MOSFETs in DC/DC converters.

For engineers reviewing the UCC27423DGN datasheet, UCC27423DGN pinout, UCC27423DGN application, or UCC27423DGN equivalent, this page delivers verified electrical specs, thermal performance data for the MSOP-PowerPAD™ package, truth-table–based functional behavior, and real-world selection guidance against comparable dual gate drivers.

Technical Context

The UCC27423DGN implements a unique bipolar-MOSFET hybrid output stage that delivers ±4 A precisely at the Miller plateau region during MOSFET switching transitions-minimizing shoot-through risk while maintaining fast edge rates. Its dual inverting logic configuration ensures complementary gate drive for synchronous rectification topologies.

Each channel features independently enabled operation via ENBA (Pin 1) and ENBB (Pin 8), both internally pulled up to VDD (100 kΩ) for active-high default operation. Inputs INA (Pin 2) and INB (Pin 4) are TTL/CMOS-compatible across the full 4–15-V VDD range, with hysteresis (0.15–0.90 V) and −5-V tolerance for noise immunity in power-converter environments.

Key Specifications

Pinout & Package

UCC27423DGN uses the thermally enhanced 8-pin MSOP-PowerPAD™ (DGN) package (3.00 mm × 3.00 mm), with exposed thermal pad electrically and thermally connected to GND-requiring PCB copper pour and vias for optimal heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual low-side MOSFET driver applications.

Compared with UCC27524ADGN and LM5113SD/NOPB, the UCC27423DGN uniquely combines dual inverting logic, per-channel enable, and industry-standard pinout-making it the optimal choice for synchronous rectifier control where timing precision, fault isolation, and layout compatibility are critical.

Availability

UCC27423DGN is available at Aetrix Electronics and suitable for switch mode power supplies, DC/DC converters, and motor controllers requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.

Supply support for UCC27423DGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs-with broad portfolio coverage for industrial, automotive, and communications infrastructure.

The UCC2742x product line was designed specifically for high-efficiency, high-frequency power conversion systems-delivering robust, thermally optimized gate drive for synchronous rectifiers, half-bridges, and multi-phase regulators.

FAQ

What logic configuration does the UCC27423DGN implement?

The UCC27423DGN implements dual inverting logic: OUTA and OUTB are inverted relative to INA and INB, respectively. This matches synchronous rectifier and half-bridge low-side drive requirements without external inverters. The UCC27423DGN is distinct from UCC27424DGN (dual non-inverting) and UCC27425DGN (mixed), and its logic is confirmed in Table 7-2 of the official datasheet.

Can the UCC27423DGN outputs be paralleled for higher current drive?

Yes, the UCC27423DGN outputs (OUTA and OUTB) can be paralleled to deliver up to ±8-A peak current to a single MOSFET gate. This is explicitly supported in the datasheet Features section and enabled by <1-ns typical propagation delay matching between channels-ensuring simultaneous switching and balanced current sharing without external balancing components.

What is the purpose of the ENBA and ENBB pins on the UCC27423DGN?

The ENBA (Pin 1) and ENBB (Pin 8) pins provide independent active-high enable control for each driver channel. When pulled low, they force the corresponding output (OUTA or OUTB) to logic low regardless of input state-enabling precise dead-time insertion, fault shutdown, or phase sequencing. Both pins are internally pulled up to VDD (100 kΩ), allowing standard operation with open-circuit connections.

Is the UCC27423DGN compatible with 3.3-V logic inputs?

Yes, the UCC27423DGN accepts 3.3-V logic inputs reliably: its INA and INB thresholds (V_{IN_H} = 1.6–2.5 V, V_{IN_L} = 0.8–1.5 V) and hysteresis (0.15–0.90 V) ensure noise-immune operation with 3.3-V microcontrollers or PWM controllers-even at minimum 4-V VDD. Input compatibility is explicitly verified across the full operating temperature range (−40°C to +125°C).

How does the PowerPAD™ thermal design of the UCC27423DGN improve reliability?

The UCC27423DGN's MSOP-PowerPAD™ (DGN) package reduces R_θJA to 56.6°C/W-nearly half that of the SOIC-8 variant (107.3°C/W). This allows 1.37 W continuous power dissipation at 70°C ambient, significantly lowering junction temperature during sustained 4-A pulsed operation. The exposed thermal pad must be soldered to a PCB ground plane with ≥4 thermal vias to realize this benefit-documented in TI's SLMA004 application brief.