Texas Instruments UCC27424DGN

Overview

UCC27424DGN from Texas Instruments is a dual non-inverting low-side MOSFET driver delivering ±4 A peak output current per channel, 20-ns rise/15-ns fall times (1.8-nF load), and 4–15 V supply operation - designed for high-efficiency gate driving in synchronous buck converters and motor control half-bridges.

For engineers reviewing the UCC27424DGN datasheet, UCC27424DGN pinout, UCC27424DGN application, or UCC27424DGN equivalent, this page delivers verified electrical specs, thermal performance data for the MSOP-PowerPAD™ package, enable-controlled dual-channel timing behavior, and real-world substitution guidance for power stage design.

Technical Context

The UCC27424DGN implements a bipolar-MOSFET hybrid output stage that concurrently sources and sinks high current at the Miller plateau region, minimizing switching losses during MOSFET transition. Its dual non-inverting logic configuration ensures direct PWM signal translation without inversion, supporting independent channel enable (ENBA/ENBB) with internal 100-kΩ pull-up and hysteresis.

Each channel operates with TTL/CMOS-compatible inputs across full VDD range (4–15 V), exhibits 25-ns propagation delay on rising edge and 35-ns on falling edge (1.8-nF load), and maintains stable output states under disable conditions - all within a –40°C to 125°C junction temperature range.

Key Specifications

Pinout & Package

UCC27424DGN uses an 8-pin MSOP-PowerPAD™ (DGN) package with exposed thermal pad electrically tied to GND. The PowerPAD™ reduces junction-to-board thermal resistance to 32.6°C/W, significantly improving reliability in thermally constrained layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual low-side MOSFET driver applications.

Compared with UCC27424DGN, UCC27524ADGN trades enable flexibility for higher current and ruggedness, while LM5113SDX sacrifices dual-channel integration and enable for high-voltage input tolerance - making UCC27424DGN optimal for cost-sensitive, enable-controlled dual low-side applications in 4–15 V systems.

Availability

UCC27424DGN is available at Aetrix Electronics and suitable for switch mode power supplies, DC/DC converters, and motor controllers requiring stable component supply, long-term lifecycle support, and traceable sourcing for production ramp.

Supply support for UCC27424DGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management ICs, with leadership in high-performance power conversion solutions.

The UCC2742x family was developed specifically for high-efficiency, high-frequency gate driving in industrial and computing power supplies - emphasizing thermal robustness, precise timing, and ease of integration into compact layouts.

FAQ

What is the maximum continuous output current rating for UCC27424DGN?

The UCC27424DGN is rated for ±4 A peak pulsed output current per channel (0.5 μs pulse width). Its continuous DC output current is limited to 0.2 A per channel due to thermal constraints. For sustained high-current operation, thermal design using the PowerPAD™ and PCB copper area is critical - the DGN package supports 1.37 W dissipation at 70°C ambient.

Does UCC27424DGN support 3.3-V logic inputs?

Yes, UCC27424DGN supports 3.3-V logic inputs fully: its input threshold range (VIN_H = 1.6–2.5 V, VIN_L = 0.8–1.5 V) and hysteresis (0.15–0.9 V) ensure reliable switching with 3.3-V microcontrollers and PWM controllers without level shifting, even under noisy conditions.

Can the ENBA and ENBB pins of UCC27424DGN be left unconnected?

Yes - ENBA and ENBB are internally pulled up to VDD (100 kΩ), so leaving them open enables both channels by default. However, in high-noise environments, TI recommends tying them to VDD or adding a 0.1-μF capacitor to GND to prevent false disabling; floating traces must be kept short to avoid coupling.

What is the purpose of the PowerPAD™ on the UCC27424DGN package?

The PowerPAD™ is an exposed thermal pad on the underside of the UCC27424DGN's MSOP package, electrically connected to GND and thermally linked to the die substrate. It reduces R_θJB to 32.6°C/W - cutting junction temperature rise by ~45% vs standard MSOP - and improves long-term reliability in high-duty-cycle power stages.

Is UCC27424DGN pin-compatible with UCC27324?

Yes, UCC27424DGN maintains industry-standard pinout compatibility with UCC27324, including identical pin functions for INA, INB, OUTA, OUTB, VDD, and GND. ENBA and ENBB (pins 1 and 8) are added enhancements - unused in UCC27324 - allowing backward compatibility when left unconnected or tied high.