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Texas Instruments UCC27424MDGNREP
- Part No.:
- UCC27424MDGNREP
- Manufacturer:
- Texas Instruments
- Category:
- Gate Drivers
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Datasheet:
-
UCC27424MDGNREP.pdf
- Description:
- IC GATE DRVR LOW-SIDE 8MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,262
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Product details
Overview
UCC27424MDGNREP from Texas Instruments is a dual-channel, noninverting, low-side MOSFET driver IC designed for high-speed gate driving in power conversion systems. It delivers ±4-A peak output current per channel, operates from 4.5 V to 15 V supply voltage, features independent enable inputs (ENBA/ENBB), and uses a thermally enhanced MSOP-8 PowerPAD™ package (DGN) with 4.7°C/W RθJC. It is used to drive N-channel MOSFETs in synchronous rectification and DC/DC converter half-bridge stages.
For engineers reviewing the UCC27424MDGNREP datasheet, UCC27424MDGNREP pinout, UCC27424MDGNREP application, or UCC27424MDGNREP equivalent, key selection considerations include its ±4-A drive capability at Miller plateau, 20-ns rise / 15-ns fall times (1.8-nF load), dual active-high enables with internal 100-kΩ pullups, TTL/CMOS-compatible inputs independent of supply voltage, and extended product lifecycle support for defense/aerospace/medical applications.
Technical Context
The UCC27424MDGNREP implements a unique bipolar-and-MOSFET hybrid output stage that delivers high peak current precisely during the MOSFET Miller plateau region, minimizing switching losses. Its dual noninverting outputs are optimized for driving N-channel MOSFETs in low-side configurations, with independent enable logic on pins 1 (ENBA) and 8 (ENBB).
Each channel features TTL/CMOS-compatible input thresholds (1.7–2.4 V high, 1.1–1.8 V low) with hysteresis (0.10–0.9 V), and operates across –55°C to +125°C junction temperature. The device minimizes shoot-through risk via inherent design and supports paralleling of outputs for higher drive current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4.5 V to 15 V - Enables compatibility with common 5 V, 12 V, and 15 V bias rails in industrial and aerospace power supplies. |
| Peak Output Current | ±4 A per channel - Sufficient to rapidly charge/discharge large gate capacitances (e.g., >10 nF) and reduce switching transition time. |
| Rise/Fall Time | 20 ns / 15 ns (1.8-nF load) - Supports >1 MHz switching frequencies while maintaining clean edges and low overlap loss. |
| Propagation Delay | 25 ns (falling), 35 ns (rising) - Tight delay matching between channels ensures synchronized gate drive in dual-phase topologies. |
| Enable Inputs | ENBA & ENBB, active-high, internally pulled up to VDD - Allows independent channel control without external bias; open-circuit default enables both drivers. |
| Thermal Resistance | RθJC = 4.7°C/W - Enables high-power operation in compact layouts; requires thermal connection of PowerPAD™ to PCB ground plane. |
| ESD Rating | HBM ±4000 V, CDM ±1000 V - Meets stringent handling requirements for defense and medical manufacturing environments. |
Pinout & Package
The UCC27424MDGNREP is housed in an 8-pin thermally enhanced MSOP PowerPAD™ package (DGN), with the exposed thermal pad electrically connected to GND and requiring solder connection to PCB copper for optimal thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ENBA (Pin 1) | Enable input A | Active-high logic input with hysteresis; pulls up internally to VDD (100 kΩ); forces OUTA low when disabled - enables safe startup sequencing and fault shutdown. |
| INA (Pin 2) | Noninverting input A | TTL/CMOS-compatible digital input; drives OUTA directly; threshold independent of VDD - accepts 3.3 V or 5 V logic without level shifting. |
| GND (Pin 3) | Power ground | Primary return path for output current and thermal reference; must be connected with low-inductance trace to MOSFET source - critical for noise immunity and Miller clamping. |
| INB (Pin 4) | Noninverting input B | Independent digital input for second channel; identical electrical behavior to INA - supports dual-phase or redundant gate drive architectures. |
| ENBB (Pin 8) | Enable input B | Active-high enable for OUTB; functionally identical to ENBA - allows asymmetric channel control (e.g., soft-start sequencing). |
| OUTA (Pin 7) | Output A | Low-side driver output capable of ±4-A peak current; swings rail-to-rail (GND to VDD) - directly interfaces with N-MOSFET gate without external components. |
| VDD (Pin 6) | Supply input | Power input for both channels; requires local 0.1-μF ceramic + 1-μF low-ESR bypass capacitors - suppresses high di/dt noise coupling into control circuitry. |
| OUTB (Pin 5) | Output B | Second low-side driver output; matched timing and drive strength to OUTA - enables precise interleaved or parallel operation. |
Key Features
| Feature | Design Value |
|---|---|
| Bipolar-CMOS True-Drive output stage | Delivers ±4-A peak current specifically during Miller plateau region, reducing gate charge time and conduction losses in high-frequency MOSFETs. |
| Dual independent enable inputs (ENBA/ENBB) | Supports per-channel power-up sequencing, fault isolation, and dynamic duty-cycle control without external logic or microcontroller intervention. |
| Industry-standard pinout with enhanced functionality | Maintains SOIC-8/DGN footprint compatibility while repurposing unused pins (1 and 8) for enables - simplifies migration from legacy drivers. |
| Thermally enhanced MSOP PowerPAD™ package | 4.7°C/W RθJC enables 3 W continuous power dissipation at 70°C ambient - extends reliability in sealed or convection-limited aerospace enclosures. |
| Extended Product (EP) qualification | Controlled baseline, single assembly/test/fab site, full traceability, and 10-year life modeling at 105°C - meets MIL-PRF-38535 Class V and DO-254 requirements. |
Applications
| Motor Control Systems | Industrial DC/DC Converters |
|---|---|
|
Use Scenario: Driving N-channel MOSFETs in three-phase inverter half-bridges for servo motor drives operating at 20–100 kHz. IC Role / Device Role / Timing Role: Low-side gate driver providing synchronized, high-current turn-on/turn-off signals to power switches, with independent ENB control enabling regenerative braking sequencing. Use Value: ±4-A drive reduces gate resistance requirements, enabling faster transitions and lower switching losses; thermal robustness sustains 125°C junction operation in enclosed motor control cabinets. |
Use Scenario: Gate driving in isolated forward or push-pull DC/DC converters for programmable logic controller (PLC) power modules. IC Role / Device Role / Timing Role: Dual noninverting driver delivering matched propagation delays (<10 ns skew) to primary-side switches, with ENBA/ENBB supporting soft-start and overcurrent shutdown. Use Value: 20-ns rise time supports >500 kHz operation; 4.5–15 V supply range accommodates wide-input 24 V/48 V industrial bus voltages without auxiliary regulation. |
| Aerospace Power Distribution Units | Medical Imaging Power Supplies |
|
Use Scenario: Controlling solid-state relays and bus switches in avionics power distribution units requiring radiation-tolerant, long-life components. IC Role / Device Role / Timing Role: High-reliability low-side driver enabling fast, glitch-free switching of 100 V-rated SiC MOSFETs under transient load conditions. Use Value: EP qualification ensures controlled manufacturing, full traceability, and 10-year life modeling; ±4000 V HBM ESD rating withstands harsh aircraft EMI environments. |
Use Scenario: Gate driving in X-ray generator high-voltage DC/DC supplies where silent, predictable switching is required for image fidelity. IC Role / Device Role / Timing Role: Precision dual driver delivering low-jitter, low-overshoot gate waveforms to minimize EMI-induced artifacts in analog signal chains. Use Value: Bipolar-CMOS output stage eliminates need for external Schottky clamps; low propagation delay variation (<5 ns) ensures consistent pulse width across temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual low-side gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| UCC27423MDGNREP | Inverting output configuration (vs. UCC27424MDGNREP's noninverting); otherwise identical pinout, drive strength, and EP qualification. | Requires inverted PWM signals or external inverters to drive N-MOSFETs; suitable for P-MOSFET low-side or complementary high-side use cases. | Select UCC27423MDGNREP only when inverting logic is native to the controller or system-level signal inversion is already present. |
| LM5113SDX/NOPB | Single-channel, 5-A peak drive, 12-V max supply, no integrated enable pins; uses 8-pin WSON package with different pinout and thermal characteristics. | Lacks dual-channel integration and independent enables; requires two devices and additional logic for equivalent functionality. | Choose LM5113SDX/NOPB only for space-constrained single-channel designs where 5-A drive or 12-V operation is mandatory and dual-channel consolidation is not required. |
Compared with UCC27423MDGNREP, the UCC27424MDGNREP provides native noninverting logic for direct N-MOSFET control, eliminating external inverters. Compared with LM5113SDX/NOPB, it offers integrated dual-channel operation, per-channel enables, and superior thermal performance in the DGN package - reducing component count and improving system-level reliability in mission-critical power stages.
Availability
UCC27424MDGNREP is available at Aetrix Electronics and suitable for switch-mode power supplies, motor controllers, and aerospace power distribution units requiring stable component supply across extended product lifecycles.
Supply support for UCC27424MDGNREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of experience in high-reliability aerospace and industrial solutions.
The UCC27424MDGNREP belongs to TI's UCC2742x-EP family of radiation-tolerant, extended-life gate drivers engineered for defense, aerospace, and medical applications demanding guaranteed long-term supply and full process traceability.
FAQ
What is the maximum operating junction temperature for the UCC27424MDGNREP?
The UCC27424MDGNREP has a maximum operating junction temperature of +125°C, as specified in the Recommended Operating Conditions table. Its thermal design - including the 4.7°C/W RθJC and PowerPAD™ package - enables sustained operation at this limit when properly mounted to a thermally adequate PCB. Derating curves in Figure 3 confirm 10-year life expectancy at 105°C junction temperature.
Does the UCC27424MDGNREP require external pull-up resistors on ENBA and ENBB?
No, the UCC27424MDGNREP does not require external pull-up resistors on ENBA and ENBB. Each enable pin is internally pulled up to VDD with a 100-kΩ resistor, establishing an active-high default state. Leaving ENBA and ENBB unconnected results in enabled operation - simplifying design and reducing BOM count. External pull-downs may be added only if active-low control is needed.
Can the two outputs of the UCC27424MDGNREP be paralleled for higher drive current?
Yes, the UCC27424MDGNREP datasheet explicitly states that its dual outputs can be paralleled to achieve higher drive current. This is supported by matched propagation delays (≤10 ns skew), identical output impedance, and rail-to-rail swing capability. When paralleling OUTA and OUTB, connect both outputs together and drive them with the same input (INA = INB) and enable (ENBA = ENBB) signals to ensure simultaneous switching.
What is the purpose of the PowerPAD™ thermal pad on the UCC27424MDGNREP package?
The PowerPAD™ thermal pad on the UCC27424MDGNREP is an exposed copper pad on the underside of the MSOP-8 package, electrically connected to GND and thermally coupled to the silicon die. It must be soldered to a large PCB copper area (preferably a dedicated thermal plane tied to GND) to achieve the rated 4.7°C/W RθJC. This pad is essential for dissipating up to 3 W of power and maintaining junction temperature within specification under high-duty-cycle operation.
How does the UCC27424MDGNREP handle input signals slower than 200 ns rise/fall time?
The UCC27424MDGNREP input stage is optimized for fast digital signals (<200 ns transition time), typical of PWM controllers. Slow-rising inputs may cause multiple output transitions due to noise sensitivity near the logic threshold. The datasheet advises against using slow analog ramps as inputs. For such cases, external Schmitt-trigger buffers should be added before INA/INB to ensure clean, monotonic switching and prevent unintended oscillation at the MOSFET gate.
UCC27424MDGNREP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Driven Configuration:
- Low-Side
- Channel Type:
- Independent
- Number of Drivers:
- 2
- Gate Type:
- N-Channel, P-Channel MOSFET
- Voltage - Supply:
- 4V ~ 15V
- Logic Voltage - VIL, VIH:
- 1V, 2V
- Current - Peak Output (Source, Sink):
- 4A, 4A
- Input Type:
- Non-Inverting
- High Side Voltage - Max (Bootstrap):
- -
- Rise / Fall Time (Typ):
- 20ns, 15ns
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-HVSSOP
UCC27424MDGNREP FAQ
1.How can I place an order for UCC27424MDGNREP through Aetrix?
Please submit a Request for Quotation (RFQ) for UCC27424MDGNREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UCC27424MDGNREP reliable?
The price and inventory of UCC27424MDGNREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UCC27424MDGNREP is usually 5 days.
3.What payment methods are accepted for UCC27424MDGNREP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UCC27424MDGNREP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UCC27424MDGNREP?
UCC27424MDGNREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UCC27424MDGNREP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UCC27424MDGNREP?
For technical support, including UCC27424MDGNREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UCC27424MDGNREP requirements.
6.How does Aetrix verify that UCC27424MDGNREP is sourced from the original manufacturer or authorized distributors?
All UCC27424MDGNREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UCC27424MDGNREP meets industry standards.
7.What is the process for return or replacement of UCC27424MDGNREP?
All UCC27424MDGNREP units undergo pre-shipment inspection (PSI). If there is an issue with UCC27424MDGNREP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UCC27424MDGNREP part is unused and in its original packaging.
Return procedure for UCC27424MDGNREP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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