Texas Instruments UCC27425DGN

Overview

UCC27425DGN from Texas Instruments is a dual low-side MOSFET driver with one inverting (OUTA) and one non-inverting (OUTB) output channel, ±4-A peak source/sink current, 20-ns rise/15-ns fall time (1.8-nF load), 4–15-V supply range, and integrated enable inputs (ENBA/ENBB) for independent channel control - used in synchronous rectification and half-bridge gate drive stages of high-frequency DC/DC converters.

For engineers reviewing the UCC27425DGN datasheet, UCC27425DGN pinout, UCC27425DGN application, or UCC27425DGN equivalent, key selection criteria include verified Miller-region drive capability, thermal performance in MSOP-PowerPAD™ package, enable-controlled channel isolation, and logic compatibility across 3.3-V/5-V microcontroller interfaces.

Technical Context

The UCC27425DGN implements a unique BiPolar + MOSFET hybrid output stage that delivers ±4 A concurrently during the Miller plateau, minimizing switching losses in N-channel and P-channel MOSFETs driven by OUTB and OUTA respectively. Its dual enable inputs (ENBA/ENBB) are internally pulled up to VDD (100-kΩ) and support active-high logic with 0.15–0.9-V hysteresis for noise immunity.

Input thresholds (VIN_H = 1.6–2.5 V, VIN_L = 0.8–1.5 V) remain stable across 4–15-V VDD, enabling direct interface with 3.3-V and 5-V controllers. Propagation delays are asymmetric: 25 ns (input falling → output) and 35 ns (input rising → output), reflecting optimized internal timing for fast turn-on/controlled turn-off sequencing.

Key Specifications

Pinout & Package

UCC27425DGN uses the thermally enhanced 8-pin MSOP-PowerPAD™ (DGN) package (3.00 mm × 3.00 mm), where the exposed PowerPAD™ is electrically and thermally connected to GND - requiring PCB thermal via array beneath the pad for optimal junction-to-board conduction (R_θJB = 32.6°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual low-side MOSFET driver applications.

Compared with UCC27424DGN and LM5113SDX/NOPB, the UCC27425DGN uniquely provides native complementary output logic in a single IC - reducing component count and PCB area in synchronous rectifier and half-bridge designs while retaining full enable control and thermal performance.

Availability

UCC27425DGN is available at Aetrix Electronics and suitable for switch mode power supplies, DC/DC converters, and motor controllers requiring stable component supply, long-term industrial lifecycle support, and traceable sourcing for production ramp.

Supply support for UCC27425DGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability power IC design.

The UCC2742x family was engineered specifically for high-frequency, high-current gate driving in industrial and automotive power conversion - emphasizing Miller-region current delivery, thermal robustness, and logic flexibility across diverse topologies.

FAQ

What is the function of ENBA and ENBB on the UCC27425DGN?

ENBA (Pin 1) and ENBB (Pin 8) are independent active-high enable inputs for OUTA and OUTB, respectively. Internally pulled up to VDD (100 kΩ), they force the corresponding output low when deasserted - enabling per-channel fault blocking, soft-start sequencing, or phase shedding in multi-phase UCC27425DGN-based designs without external logic.

Can the UCC27425DGN drive both N-channel and P-channel MOSFETs simultaneously?

Yes - the UCC27425DGN's OUTA is inverting and OUTB is non-inverting, allowing direct connection to a P-channel high-side MOSFET (OUTA) and N-channel low-side MOSFET (OUTB) in synchronous rectifier or half-bridge configurations. This eliminates external inverters and reduces propagation skew compared to dual non-inverting drivers like UCC27424DGN.

What is the maximum continuous power dissipation for UCC27425DGN in its MSOP-PowerPAD™ package?

At T_A = 70°C, the UCC27425DGN (DGN package) supports 1.37 W continuous power dissipation before thermal derating begins. This is enabled by its low R_θJA of 56.6°C/W and R_θJB of 32.6°C/W - requiring ≥4 thermal vias under the PowerPAD™ connected to a solid GND plane for full rating compliance.

How does the UCC27425DGN minimize shoot-through risk during MOSFET switching?

The UCC27425DGN inherently minimizes shoot-through via its BiPolar + MOSFET hybrid output stage, which delivers peak ±4-A current precisely at the Miller plateau where dV/dt is highest. Combined with asymmetric propagation delays (25 ns falling, 35 ns rising), it ensures controlled turn-on/turn-off sequencing - verified in TI's SLUS545F datasheet Figure 6-1 and 6-2 waveforms.

Is the UCC27425DGN pin-compatible with older TI drivers like UCC27324?

Yes - the UCC27425DGN retains the industry-standard SOIC-8 pinout and repurposes unused Pins 1 and 8 as ENBA and ENBB, making it a functional upgrade for UCC27324 designs. No PCB changes are required; simply tie ENBA/ENBB to VDD for legacy operation or use them for enhanced control in new UCC27425DGN implementations.