Texas Instruments UCC27524ADR

Overview

UCC27524ADR from Texas Instruments is a dual-channel, non-inverting, low-side gate driver IC designed to drive MOSFETs and IGBTs in high-frequency power stages. It delivers 5A peak source/sink current per channel, features 17ns typical propagation delay, 1ns typical inter-channel delay matching, and operates across 4.5V–18V VDD with –40°C to +150°C junction temperature range-enabling robust GaN and SiC gate drive in DC-DC converters and motor control.

For engineers reviewing the UCC27524ADR datasheet, UCC27524ADR pinout, UCC27524ADR application, or UCC27524ADR equivalent, this page provides verified technical context, SOIC-8/HVSSOP-8 package mapping, real-world timing behavior under load, negative input voltage tolerance (–5V), and validated alternatives for dual-channel low-side drive replacement.

Technical Context

The UCC27524ADR implements two independent, non-inverting gate-drive channels with TTL/CMOS-compatible input thresholds fixed at ~2.0V (high) and ~1.0V (low), independent of VDD. Its hybrid output stage uses parallel N- and P-channel MOSFETs to deliver 5A peak source current during Miller plateau transition while maintaining 0.075V VOH (at –10mA) and 0.01V VOL (at 10mA).

Each channel includes dedicated enable inputs (ENA/ENB) with 200kΩ internal pullup and hysteresis of 0.9–1.1V; inputs feature 120kΩ pulldown to hold outputs low when floating. UVLO activates at 3.8–4.4V rising threshold and holds both outputs low during undervoltage conditions for glitch-free startup/shutdown.

Key Specifications

Pinout & Package

UCC27524ADR is available in SOIC-8 (D) and HVSSOP-8 PowerPAD™ (DGN) packages. Both are surface-mount, thermally enhanced, and pin-compatible. The SOIC-8 body measures 4.90mm × 3.91mm; HVSSOP-8 is 3.00mm × 3.00mm with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual low-side gate driver applications.

Compared with UCC27524D and LM5113SDX, the UCC27524ADR provides superior thermal performance via PowerPAD™, guaranteed –5V input robustness, and per-channel enable control-making it optimal for high-reliability, high-density, and high-temperature power systems.

Availability

UCC27524ADR is available at Aetrix Electronics and suitable for switch-mode power supplies, DC-DC converters, and motor control systems requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.

Supply support for UCC27524ADR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability power conversion solutions.

The UCC27524ADR belongs to TI's UCC2752x family of high-speed gate drivers, engineered specifically for demanding low-side drive applications in high-frequency, high-efficiency power systems including GaN-based designs.

FAQ

What is the maximum negative voltage the UCC27524ADR inputs can tolerate?

The UCC27524ADR inputs (INA, INB, ENA, ENB) are rated for –5V minimum, as specified in Absolute Maximum Ratings. This allows direct connection to gate nodes experiencing negative undershoot without external protection components. The UCC27524ADR maintains functional integrity and does not latch up or degrade under this condition, making it suitable for high-dV/dt GaN and SiC applications where ringing exceeds 0V.

Does the UCC27524ADR support paralleling its two outputs for higher current drive?

Yes, the UCC27524ADR supports safe paralleling of OUTA and OUTB due to its 1ns typical inter-channel delay matching and matched output impedance. When driven by a single input (INA = INB) and enable (ENA = ENB), the combined output delivers up to 10A peak source/sink current. The UCC27524ADR's low output skew ensures simultaneous switching, minimizing circulating currents during transition.

How does the UCC27524ADR behave during VDD undervoltage conditions?

During VDD undervoltage, the UCC27524ADR activates its internal UVLO circuit, holding both OUTA and OUTB LOW regardless of input or enable states. The rising UVLO threshold is 3.8–4.4V (typ 4.1V), with 0.3V hysteresis. This guarantees glitch-free startup and shutdown, preventing partial turn-on of power switches that could cause shoot-through or thermal stress in the UCC27524ADR's target applications.

Is the UCC27524ADR pin-compatible with earlier TI gate drivers like the UCC27324?

Yes, the UCC27524ADR is pin-compatible with the UCC27324 in SOIC-8 (D) package: ENA and ENB map to the same pins as NC pins on UCC27324, and internal 200kΩ pullups allow floating ENx pins without modification. However, the UCC27524ADR adds –5V input tolerance and tighter delay matching-enhancements that do not affect mechanical or electrical compatibility in legacy layouts.

What thermal advantages does the HVSSOP-8 PowerPAD™ package offer for the UCC27524ADR?

The HVSSOP-8 PowerPAD™ package of the UCC27524ADR achieves 48.9°C/W junction-to-ambient thermal resistance (RθJA), nearly 2.6× better than the SOIC-8 variant (126.4°C/W). This enables sustained 5A peak drive at higher ambient temperatures and reduces need for external thermal relief. The exposed thermal pad must be soldered to a large PCB copper area to realize full benefit-critical for compact, high-power-density UCC27524ADR implementations.