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Texas Instruments UCC27712D

Part No.:
UCC27712D
Manufacturer:
Texas Instruments
Category:
Gate Drivers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixUCC27712D.pdf
Description:
IC GATE DRVR HALF-BRIDGE 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,387

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Product details

Overview

UCC27712 from Texas Instruments is a 620-V high-side/low-side gate driver IC with 1.8-A source / 2.8-A sink peak output current, designed to drive power MOSFETs or IGBTs in half-bridge and full-bridge topologies. It features interlocked dual inputs (HI/LI), 150-ns internal deadtime, 100-ns typical propagation delay, and operates across –40 °C to +125 °C for motor drives and offline AC/DC power supplies.

For engineers reviewing the UCC27712 datasheet, UCC27712 pinout, UCC27712 application, or UCC27712 equivalent, key selection criteria include its 620-V HB withstand capability, dv/dt immunity of 50 V/ns, negative input tolerance down to –5 V, bootstrap-compatible floating HO channel, and SOIC-8 package compatibility with industrial layout constraints.

Technical Context

The UCC27712 integrates one ground-referenced low-side driver (LO) and one floating high-side driver (HO) with independent TTL/CMOS-compatible inputs (HI, LI). Its interlock logic enforces minimum 100–200 ns deadtime between HO and LO transitions, preventing shoot-through even under mismatched input timing.

It employs TI's high-voltage process enabling robust operation up to 600 V on HS node, 700 V absolute max on HB, and supports bootstrap biasing with HB–HS UVLO (7.2–9.2 V turn-on threshold). Input stage includes internal pull-downs to force low outputs during floating conditions and tolerates –11 V on HS and –5 V on HI/LI pins.

Key Specifications

Parameter Value and Actual Design Meaning
Max HB voltage 700 V absolute maximum - enables use in 600-V bus systems with margin against transients
Output current 2.8-A sink / 1.8-A source - sufficient to rapidly charge/discharge 1–3 nF gate capacitances at >100 kHz
Propagation delay 100 ns typical (HI→HO, LI→LO) - minimizes pulse-width distortion in high-frequency SMPS
Delay matching 12 ns typical (tPDFM) - ensures symmetrical switching edges critical for bridge balance and EMI control
VDD range 10–20 V (IGBT), 10–17 V (MOSFET) - aligns with standard isolated bias rails and gate drive requirements
dv/dt immunity 50 V/ns - suppresses false triggering during fast-switching events in hard-switched bridges
Operating temp –40 °C to +125 °C - validated for industrial and automotive under-hood ambient conditions

Pinout & Package

UCC27712 is housed in an industry-standard SOIC-8 package (3.91 mm × 4.90 mm body size), optimized for thermal performance and PCB layout simplicity in high-voltage power stages.

Pin/Terminal Circuit Role Design Meaning
LI (Pin 1) Low-side input TTL/CMOS-compatible logic input; pulls low via internal COM resistor if floating - prevents unintended LO activation
HI (Pin 2) High-side input Independent logic input for HO; same noise-immune thresholds as LI (VINH = 2.0 V typ, VINL = 1.2 V typ)
VDD (Pin 3) Low-side bias supply Powers input logic and LO driver; requires 0.1-µF ceramic bypass to COM; UVLO active below 7.5–9.8 V
COM (Pin 4) Ground reference Common return for VDD, LI, HI, and LO; not connected to power ground in floating configurations
LO (Pin 5) Low-side output Ground-referenced driver output; sinks 2.8 A / sources 1.8 A; connects directly to MOSFET/IGBT gate
HS (Pin 6) High-side source node Switch-node connection point; rated for –11 V to +600 V; defines reference for HB and HO operation
HO (Pin 7) High-side output Floating driver output referenced to HS; matches LO timing within 12 ns; drives gate of high-side switch
HB (Pin 8) High-side bootstrap supply Bias input for HO channel; must be bypassed to HS with capacitor ≥10× gate capacitance; UVLO active below 6.4–9.2 V

Key Features

Feature Design Value
Interlocked HI/LI inputs Guarantees ≥100 ns deadtime between HO and LO - eliminates need for external deadtime circuitry in half-bridge designs
Bootstrap-compatible HO channel Floating architecture supports 100% duty cycle operation when HB–HS remains above UVLO threshold - enables continuous conduction mode
Negative transient SOA on HS Withstands –11 V on HS node - protects against Miller-induced negative spikes during fast turn-off in high-dv/dt environments
Input hysteresis 0.8 V typical - improves noise margin over standard TTL, reducing susceptibility to ground bounce in high-current layouts
UVLO on both supplies Independent VDD and HB–HS UVLO with hysteresis - ensures safe startup and fault recovery without external supervision

Applications

Motor Drive Systems Offline AC/DC Power Supplies

Use Scenario: Driving half-bridge inverters in HVAC blowers, power tools, and robotic joint actuators requiring 40–100 kHz PWM switching.

IC Role / Device Role / Timing Role: High-side/low-side gate driver providing matched, interlocked gate signals to N-channel MOSFETs in H-bridge configuration.

Use Value: 100-ns propagation delay and 12-ns delay matching minimize deadtime uncertainty, improving torque linearity and reducing audible noise.

Use Scenario: Controlling primary-side switches in high-density LLC resonant converters for server PSUs and telecom rectifiers.

IC Role / Device Role / Timing Role: Floating high-side driver enabling bootstrap-based gate control of 600-V GaN or Si MOSFETs in half-bridge topology.

Use Value: 620-V rating and 50 V/ns dv/dt immunity ensure reliable operation during fast ZVS transitions and line surges.

Industrial Inverters High-Density SMPS

Use Scenario: Gate driving in three-phase inverter stages for industrial pumps and compressors operating at 10–20 kHz with 600-V DC bus.

IC Role / Device Role / Timing Role: Dual-channel driver delivering synchronized, shoot-through-protected gate pulses to IGBT modules.

Use Value: 2.8-A sink current rapidly discharges IGBT gates, reducing conduction losses and enabling <1 µs turn-off times.

Use Scenario: Driving synchronous rectifiers and active clamp FETs in high-efficiency flyback and active-clamp forward converters.

IC Role / Device Role / Timing Role: Low-latency, high-current gate driver supporting precise timing control for zero-voltage switching schemes.

Use Value: Independent HI/LI control allows flexible phase-shifted modulation while interlock prevents overlap during transient faults.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side/low-side gate driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
IRS21844PbF 400-V max HB rating; 2.5-A sink / 2.5-A source; no integrated interlock - requires external deadtime logic Suitable for ≤400-V bus systems; less robust dv/dt immunity (25 V/ns); higher gate drive symmetry but no NTSOA protection Prefer UCC27712 where 600-V operation, shoot-through prevention, or –11 V HS tolerance is required.
LM5113MMX/NOPB 600-V max HB; 1.5-A sink / 1-A source; separate VDD and VBS supplies; no interlock; 150-ns propagation delay Targeted at high-frequency GaN drivers; lower peak current limits gate charge speed; requires external deadtime Choose UCC27712 for higher current drive, tighter delay matching, and built-in safety features in industrial motor and PSU designs.

Compared with IRS21844PbF and LM5113MMX/NOPB, the UCC27712 delivers superior voltage rating, integrated interlock, tighter timing control, and enhanced transient robustness - making it optimal for demanding 600-V bridge applications where reliability and layout simplicity are critical.

Availability

UCC27712 is available at Aetrix Electronics and suitable for motor drives, offline AC/DC power supplies, industrial inverters, and high-density SMPS requiring stable component supply across extended temperature and high-voltage stress conditions.

Supply support for UCC27712 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability power conversion solutions.

The UCC27712 belongs to TI's high-voltage gate driver product line, engineered specifically for robust, high-efficiency switching in 600-V bridge topologies used in industrial motor control and server/telecom power systems.

FAQ

What is the maximum allowable voltage on the HB pin of the UCC27712?

The UCC27712 specifies an absolute maximum HB voltage of 700 V with respect to COM. This rating provides design margin for transient overvoltage events in 600-V bus applications. Continuous operation is supported up to 620 V on HB, and the device maintains functional integrity across –40 °C to +125 °C ambient temperature. The HB–HS UVLO threshold is 7.2–9.2 V, ensuring reliable bootstrap recharge before high-side activation.

Does the UCC27712 require external deadtime circuitry?

No, the UCC27712 includes internal interlock logic that guarantees a minimum 100–200 ns deadtime between HO and LO transitions when HI and LI are driven complementarily. This eliminates the need for external deadtime generators or RC networks. The interlock activates automatically - no configuration or external components are required - simplifying PCB layout and improving system reliability in half-bridge and full-bridge topologies.

Can the UCC27712 drive both MOSFETs and IGBTs?

Yes, the UCC27712 is qualified to drive both power MOSFETs and IGBTs. Its 1.8-A source / 2.8-A sink peak output current supports fast gate charging/discharging for devices with gate charges up to ~50 nC. Recommended VDD is 10–17 V for MOSFETs and 10–20 V for IGBTs; HB–HS bias follows the same ranges. The device's –11 V HS tolerance and large NTSOA further enhance robustness with IGBTs during Miller-induced voltage excursions.

What is the purpose of the COM pin on the UCC27712?

The COM pin serves as the ground reference for the low-side driver (LO), input logic (HI/LI), and VDD supply. It is not tied to power system ground in floating configurations - instead, it forms the local return path for the low-side channel. All input thresholds and output voltages are defined relative to COM. Proper decoupling of VDD to COM with ≥0.1 µF ceramic capacitance is mandatory to maintain noise immunity and UVLO stability.

How does the UCC27712 handle floating input pins?

The UCC27712 incorporates internal pull-down resistors on both HI and LI inputs, forcing LO and HO low respectively when either input is left unconnected or floating. This fail-safe behavior prevents unintended power device activation during startup, controller reset, or signal loss. The feature is intrinsic to the IC's input stage design and requires no external components - enhancing system safety in motor drive and power supply applications.

UCC27712D Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Driven Configuration:
Half-Bridge
Channel Type:
Independent
Number of Drivers:
2
Gate Type:
IGBT, N-Channel, P-Channel MOSFET
Voltage - Supply:
10V ~ 20V
Logic Voltage - VIL, VIH:
0.8V, 2.4V
Current - Peak Output (Source, Sink):
1.8A, 2.8A
Input Type:
-
High Side Voltage - Max (Bootstrap):
600 V
Rise / Fall Time (Typ):
16ns, 10ns
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

UCC27712D FAQ

1.How can I place an order for UCC27712D through Aetrix?

Please submit a Request for Quotation (RFQ) for UCC27712D on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UCC27712D reliable?

The price and inventory of UCC27712D are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UCC27712D is usually 5 days.

3.What payment methods are accepted for UCC27712D?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UCC27712D transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UCC27712D?

UCC27712D orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UCC27712D order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UCC27712D?

For technical support, including UCC27712D datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UCC27712D requirements.

6.How does Aetrix verify that UCC27712D is sourced from the original manufacturer or authorized distributors?

All UCC27712D products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UCC27712D meets industry standards.

7.What is the process for return or replacement of UCC27712D?

All UCC27712D units undergo pre-shipment inspection (PSI). If there is an issue with UCC27712D, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UCC27712D part is unused and in its original packaging.

Return procedure for UCC27712D:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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