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Texas Instruments UCC27712DR

Part No.:
UCC27712DR
Manufacturer:
Texas Instruments
Category:
Gate Drivers
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixUCC27712DR.pdf
Description:
IC GATE DRVR HALF-BRIDGE 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,380

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Product details

Overview

UCC27712 from Texas Instruments is a 620-V high-side/low-side gate driver IC with 1.8-A source / 2.8-A sink peak output current, designed to drive power MOSFETs or IGBTs in half-bridge and full-bridge topologies. It features interlocked dual inputs (HI/LI), 150-ns internal deadtime, 100-ns typical propagation delay, and operates across –40 °C to +125 °C for motor drives and offline AC/DC power supplies.

For engineers reviewing the UCC27712 datasheet, UCC27712 pinout, UCC27712 application, or UCC27712 equivalent, key selection considerations include its 620-V HB rating, dv/dt immunity of 50 V/ns, negative input tolerance down to –5 V, bootstrap-compatible floating HO channel, and SOIC-8 package compatibility with industrial layout constraints.

Technical Context

The UCC27712 integrates one ground-referenced low-side driver (LO) and one floating high-side driver (HO) with independent TTL/CMOS-compatible inputs (HI, LI). Its interlock logic enforces minimum 100–200 ns deadtime between HO and LO transitions, preventing shoot-through in bridge configurations.

It employs TI's high-voltage process for robustness: 700-V absolute max on HB pin, –11 V to +600 V operation on HS node, UVLO protection on both VDD (8.9 V turn-on) and HB–HS (8.2 V turn-on), and large NTSOA on the switch node to withstand negative transients during hard switching.

Key Specifications

Parameter Value and Actual Design Meaning
Max HB voltage 620 V - supports 600-V bus applications with 20-V margin for transient spikes
Peak output current 2.8 A sink / 1.8 A source - drives high-Qg MOSFETs at >100 kHz without external buffers
Propagation delay 100 ns typical - enables precise timing control in high-frequency SMPS up to 1 MHz
Delay matching 12 ns typical - minimizes pulse-width distortion between HO and LO channels
dv/dt immunity 50 V/ns - suppresses false triggering during fast-rising HS node transitions
VDD operating range 10 V to 20 V - accommodates both MOSFET (10–17 V) and IGBT (10–20 V) bias requirements
Input voltage range –5 V to 24 V - tolerates negative transients and logic overvoltage without clamping diodes
Operating temperature –40 °C to +125 °C - qualified for industrial and automotive under-hood environments

Pinout & Package

UCC27712 is housed in an industry-standard SOIC-8 package (3.91 mm × 4.90 mm), optimized for thermal performance and PCB layout simplicity in high-voltage power stages.

Pin/Terminal Circuit Role Design Meaning
LI (Pin 1) Low-side input TTL/CMOS-compatible logic input; pulls low if floating, enabling fail-safe LO disable
HI (Pin 2) High-side input Independent logic input for HO; accepts –5 V to 24 V, immune to HS node noise
VDD (Pin 3) Low-side bias supply Powers input logic and LO driver; requires 0.1-µF ceramic bypass to COM
COM (Pin 4) Ground reference Common return for VDD, LI, HI, and LO; must be low-inductance connection
LO (Pin 5) Low-side output Ground-referenced driver output; sinks 2.8 A / sources 1.8 A into MOSFET/IGBT gate
HS (Pin 6) High-side source node Return path for bootstrap capacitor; withstands –11 V to +600 V transients
HO (Pin 7) High-side output Floating driver output referenced to HS; drives gate of high-side switch
HB (Pin 8) High-side bootstrap supply Connects to bootstrap capacitor; UVLO threshold 8.2 V ensures reliable HO enable

Key Features

Feature Design Value
Interlocked dual-input logic Guarantees ≥100 ns deadtime between HO and LO even with overlapping HI/LI pulses
Robust HV process 700-V absolute max HB rating and –11 V to +600 V HS node operation enable 600-V systems
Wide input voltage tolerance –5 V to 24 V input range eliminates need for level-shifting when interfacing with 3.3-V/5-V controllers
Dual UVLO protection Independent VDD and HB–HS UVLO with hysteresis prevents erratic switching during brownout or bootstrap failure
NTSOA on HS node Large negative transient safe operating area protects against Miller-induced turn-on during hard commutation
Low quiescent current 255 µA typical total IQ enables efficient standby operation in always-on power converters

Applications

Motor Drive Systems Offline AC/DC Power Supplies

Use Scenario: Driving half-bridge inverters in HVAC blowers, power tools, and robotic joint actuators.

IC Role / Device Role / Timing Role: High-side/low-side gate driver with interlock, ensuring shoot-through prevention during PWM commutation.

Use Value: 100-ns propagation delay and 12-ns delay matching preserve PWM fidelity at 50–100 kHz, reducing torque ripple and audible noise.

Use Scenario: Controlling primary-side switches in high-density LLC resonant converters for server PSUs.

IC Role / Device Role / Timing Role: Floating HO channel biased via bootstrap, delivering 2.8-A sink current to rapidly discharge high-Ciss GaN FETs.

Use Value: 50 V/ns dv/dt immunity prevents false triggering during fast ZVS transitions, improving reliability in high-efficiency designs.

Industrial Inverters Telecom Rectifiers

Use Scenario: Gate driving in three-phase inverters for solar microinverters and UPS systems.

IC Role / Device Role / Timing Role: Dual-channel driver with independent HI/LI inputs, enabling advanced modulation schemes like SVM and DPWM.

Use Value: –11 V to +600 V HS node rating supports 600-V DC-link operation with margin for line surges and ringing.

Use Scenario: Driving synchronous rectifiers and primary switches in 48-V telecom rectifier modules.

IC Role / Device Role / Timing Role: Low-side driver (LO) and bootstrap-enabled high-side driver (HO) managing bidirectional power flow in dual-active-bridge topologies.

Use Value: 1.8-A source current ensures fast turn-on of SiC MOSFETs, minimizing conduction loss in high-frequency (>200 kHz) operation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side/low-side gate driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
IRS2004STRPBF Lower 200-V HB rating; 1.2-A source / 1.4-A sink; no integrated interlock; requires external deadtime circuit Suitable only for ≤200-V bus applications; lacks NTSOA and dv/dt immunity for high-noise environments Select when cost sensitivity outweighs 600-V capability and robustness requirements
LM5109BMAX/NOPB 600-V HB rating; 1-A source / 1.5-A sink; no interlock; separate HO/LO enable pins instead of HI/LI Requires external logic for deadtime control; lower drive strength limits use with high-gate-charge devices Prefer for space-constrained layouts where SOIC-8 footprint is acceptable but higher drive current is not needed

Compared with IRS2004STRPBF and LM5109BMAX/NOPB, the UCC27712 delivers superior system-level robustness through integrated interlock, 2.8-A sink capability, and 50 V/ns dv/dt immunity-enabling simpler, more reliable designs in 600-V industrial and telecom power stages without external protection components.

Availability

UCC27712 is available at Aetrix Electronics and suitable for motor drives, offline AC/DC power supplies, industrial inverters, and telecom rectifiers requiring stable component supply and long-term production continuity.

Supply support for UCC27712 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-reliability power conversion solutions.

The UCC27712 belongs to TI's high-voltage gate driver product line, engineered specifically for robust, high-efficiency bridge-based power systems including motor inverters, server PSUs, and renewable energy converters.

FAQ

What is the maximum allowable voltage on the HB pin of the UCC27712?

The UCC27712 specifies an absolute maximum HB voltage of 700 V, with recommended operation up to 620 V. This 80-V margin accommodates transient overvoltages in 600-V bus applications. Operation beyond 620 V risks exceeding safe operating area limits, especially during fast dv/dt events. The device's 50 V/ns immunity helps maintain stability under such conditions, but sustained voltage above 620 V is not advised per datasheet specifications for UCC27712.

Does the UCC27712 support 100% duty cycle operation?

Yes, the UCC27712 supports 100% duty cycle operation provided the HB–HS bootstrap voltage remains above its 8.2-V UVLO turn-on threshold. This requires careful design of the bootstrap network-including capacitor sizing (typically ≥10× gate capacitance) and diode selection-to sustain voltage during extended high-side conduction. The UCC27712's low 255-µA quiescent current aids in maintaining HB voltage under static conditions, making it viable for applications like PFC pre-regulators where continuous HO activation is required.

How does the interlock function work in the UCC27712?

The UCC27712 implements hardware-based interlock logic that guarantees a minimum 100–200 ns deadtime between HO and LO transitions, regardless of input timing. When both HI and LI are high, both outputs force low. If HI goes high while LI is still high, HO remains off until LI goes low and the internal deadtime timer expires. This prevents shoot-through in bridge circuits without relying on controller-level timing precision. The interlock is intrinsic to UCC27712's silicon design and requires no external components or configuration.

Can the UCC27712 drive SiC MOSFETs or GaN HEMTs?

Yes, the UCC27712 can drive SiC MOSFETs and GaN HEMTs effectively due to its 2.8-A sink / 1.8-A source peak current, 100-ns propagation delay, and 50 V/ns dv/dt immunity-key requirements for fast-switching wide-bandgap devices. Its –5 V to 24 V input range simplifies interface with 3.3-V or 5-V gate drivers or digital controllers. However, layout best practices (minimized loop inductance, Kelvin source connections) remain critical to fully realize switching benefits and avoid oscillation in UCC27712-driven SiC/GaN stages.

What is the purpose of the HS pin on the UCC27712?

The HS (high-side source) pin on the UCC27712 serves as the return path for the floating high-side driver channel and is directly connected to the source/emitter of the high-side power switch. It withstands –11 V to +600 V relative to COM, enabling operation in high dv/dt environments. Unlike ground-referenced pins, HS must be routed with low inductance and serve as the local reference for the HO output and HB bypass capacitor. Its robust NTSOA rating protects against negative transients during hard commutation-a critical feature for reliable UCC27712 deployment in bridge topologies.

UCC27712DR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Driven Configuration:
Half-Bridge
Channel Type:
Independent
Number of Drivers:
2
Gate Type:
IGBT, N-Channel, P-Channel MOSFET
Voltage - Supply:
10V ~ 20V
Logic Voltage - VIL, VIH:
1.5V, 1.6V
Current - Peak Output (Source, Sink):
1.8A, 2.8A
Input Type:
-
High Side Voltage - Max (Bootstrap):
600 V
Rise / Fall Time (Typ):
16ns, 10ns
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

UCC27712DR FAQ

1.How can I place an order for UCC27712DR through Aetrix?

Please submit a Request for Quotation (RFQ) for UCC27712DR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UCC27712DR reliable?

The price and inventory of UCC27712DR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UCC27712DR is usually 5 days.

3.What payment methods are accepted for UCC27712DR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UCC27712DR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UCC27712DR?

UCC27712DR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UCC27712DR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UCC27712DR?

For technical support, including UCC27712DR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UCC27712DR requirements.

6.How does Aetrix verify that UCC27712DR is sourced from the original manufacturer or authorized distributors?

All UCC27712DR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UCC27712DR meets industry standards.

7.What is the process for return or replacement of UCC27712DR?

All UCC27712DR units undergo pre-shipment inspection (PSI). If there is an issue with UCC27712DR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UCC27712DR part is unused and in its original packaging.

Return procedure for UCC27712DR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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