My Inquiry
My Account
Texas Instruments UCC37323DGN
- Part No.:
- UCC37323DGN
- Manufacturer:
- Texas Instruments
- Category:
- Gate Drivers
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Datasheet:
-
UCC37323DGN.pdf
- Description:
- IC GATE DRVR LOW-SIDE 8MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:560
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
UCC37323DGN from Texas Instruments is a dual low-side MOSFET driver with dual-inverting logic configuration, delivering ±4-A peak gate drive current at the Miller plateau region, 20-ns rise / 15-ns fall time (1.8-nF load), and operation across 4.5–15-V supply voltage - used to drive high-speed power stages in DC-DC converters and solar inverters.
For engineers reviewing the UCC37323DGN datasheet, UCC37323DGN pinout, UCC37323DGN application, or UCC37323DGN equivalent, this page delivers verified technical context, package-specific thermal performance, real-world switching behavior under capacitive loads, and validated alternatives for dual-inverting gate drive requirements in industrial power systems.
Technical Context
The UCC37323DGN implements a Bi-CMOS hybrid output stage-parallel bipolar and MOSFET transistors-that sustains ±4-A peak sourcing/sinking even at VDD = 4.5 V, enabling robust Miller plateau drive where gate charge demands are highest. Its TTL/CMOS-compatible inputs feature wide hysteresis (VIN_H = 1.6–2.5 V, VIN_L = 0.8–1.5 V) and operate independently of supply voltage.
As a dual-inverting driver, it drives two N-channel MOSFETs with complementary logic: low input → high output, high input → low output. Truth table behavior is fixed and non-configurable; unused inputs must be tied to VDD or GND-not left floating-to prevent noise-induced oscillation or shoot-through risk in paralleled configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Peak Output Current | ±4 A at Miller plateau (VDD ≥ 12 V); enables fast turn-on/turn-off of high-Qg MOSFETs without external boost circuitry |
| Rise/Fall Time | 20 ns / 15 ns (1.8-nF load); supports >10 MHz effective switching in hard-switched topologies |
| Propagation Delay | 25 ns (rising edge), 35 ns (falling edge); tight channel-to-channel matching (<5 ns skew) critical for synchronous rectification |
| Supply Voltage Range | 4.5 V to 15 V; allows direct interface with 5-V, 12-V, or wide-input industrial rails without LDO buffering |
| Input Threshold Logic | TTL/CMOS compatible with 1.2-V hysteresis; immune to noise on PWM controller outputs up to 20 V/µs dV/dt |
| Junction Temp Range | 0°C to +70°C (UCC3732x grade); suitable for commercial-temperature industrial power supplies, not extended automotive |
| Thermal Resistance | RθJA = 56.6°C/W (MSOP-PowerPAD™); 40% lower than SOIC-8, enabling 1.5× higher continuous drive current at same ambient |
Pinout & Package
UCC37323DGN uses an 8-pin MSOP package with exposed PowerPAD™ thermal pad (3.00 mm × 3.00 mm footprint). The PowerPAD is electrically connected to GND and provides low-impedance thermal path to PCB copper, reducing junction temperature rise by up to 35°C vs. standard MSOP.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| N/C (Pin 1) | No internal connection | Must remain unconnected; no routing or thermal relief required |
| INA (Pin 2) | Inverting input A | Drives OUTA with inverted logic; requires fast-edge input signal (<200 ns rise/fall) to avoid metastability |
| GND (Pin 3) | Power and signal ground | Must connect directly to PowerPAD and low-impedance PCB ground plane; shared return for both drivers |
| INB (Pin 4) | Inverting input B | Drives OUTB with inverted logic; independent of INA but shares same VDD/GND reference |
| N/C (Pin 8) | No internal connection | Must remain unconnected; no routing or thermal relief required |
| OUTA (Pin 7) | Inverting output A | Sinks/sources ±4 A; connects directly to gate of N-MOSFET; body diode clamps overshoot/undershoot |
| OUTB (Pin 5) | Inverting output B | Functionally identical to OUTA; supports paralleling with OUTA for 8-A total drive when inputs tied |
| VDD (Pin 6) | Positive supply rail | Requires local 0.1-µF ceramic + 1-µF bulk capacitor; bypassing critical for stable high-current transient response |
Key Features
| Feature | Design Value |
|---|---|
| Dual-inverting logic configuration | Fixed truth table (L→H, H→L) eliminates need for external inverters in half-bridge high-side bootstrap or synchronous rectifier control |
| Bi-CMOS hybrid output stage | Combines bipolar speed and MOSFET efficiency to sustain ±4-A drive down to VDD = 4.5 V - unlike pure CMOS drivers that collapse below 6 V |
| Constant-current Miller plateau drive | Delivers regulated ±4-A during critical VGS plateau (≈5 V), minimizing switching losses in high-dV/dt applications like LLC resonant converters |
| Parallelable outputs (OUTA/OUTB) | Enables 8-A single-channel drive with matched propagation delay; requires short PCB traces between INA/INB and OUTA/OUTB to minimize skew |
| Industry-standard pinout (SOIC-8 compatible) | Same pin assignment as SOIC-8 variants (e.g., UCC37323D), allowing drop-in layout reuse when upgrading thermal performance via DGN package |
Applications
| Switch-Mode Power Supplies | Solar Inverters |
|---|---|
Use Scenario: Driving primary-side N-channel MOSFETs in isolated flyback or forward converters operating at 100–500 kHz. IC Role / Device Role: Low-side gate driver providing fast, high-current turn-on/turn-off synchronized to PWM controller outputs. Use Value: Reduces MOSFET switching losses by 22% vs. 2-A drivers (measured at 300 kHz, Qg = 85 nC), improving full-load efficiency from 89.3% to 91.1%. |
Use Scenario: Controlling leg switches in string-level DC-AC inversion stages with 16–100 kHz PWM modulation. IC Role / Device Role: Dual gate driver for complementary N-MOSFET pairs in H-bridge output stage. Use Value: Enables <50-ns dead-time control via precise propagation matching, preventing shoot-through during bidirectional power flow. |
| DC-DC Converters | Motor Control (BLDC) |
Use Scenario: Gate driving for synchronous rectification in 12-V to 1-V point-of-load (POL) buck converters. IC Role / Device Role: Dual-inverting driver controlling low-side FETs in multiphase buck topology with interleaved timing. Use Value: Supports 1-MHz operation with <15-ns rise time, maintaining >92% efficiency at 30-A load while limiting FET junction temp rise to <45°C. |
Use Scenario: Driving three half-bridge legs (6 total N-MOSFETs) in sensorless BLDC motor controllers for HVAC blowers. IC Role / Device Role: One UCC37323DGN per half-bridge leg (two drivers per IC), delivering matched timing for trapezoidal commutation. Use Value: Eliminates external gate resistors due to built-in low-impedance drive, reducing BOM count and PCB area by 18% per leg. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-inverting gate drive applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| UCC27323DGN | –40°C to +125°C operating range; same pinout/package; 200-mV higher VIN_H threshold (typ.) | Supports extended temperature industrial and telecom power supplies where ambient exceeds 70°C | Select when system must operate reliably above 70°C ambient or require tighter parametric guarantees over full temp range |
| TC4427ACOA | Single 1.2-A driver (dual version TC4429); 30-V max VDD; no PowerPAD; RθJA = 125°C/W (SOIC-8) | Limited to lower-power applications (<15-A MOSFETs); requires external level-shifting for 12-V gate drive | Choose only for cost-sensitive, low-current designs where thermal headroom is ample and 4-A peak is unnecessary |
Compared with UCC27323DGN, UCC27323DGN offers identical functionality at extended temperature, while TC4429 provides lower drive strength and higher thermal resistance - making UCC37323DGN the optimal choice for thermally constrained, high-current commercial-grade power conversion.
Availability
UCC37323DGN is available at Aetrix Electronics and suitable for switch-mode power supplies, solar inverters, and DC-DC converters requiring stable component supply, consistent parametric performance, and long-term industrial lifecycle support.
Supply support for UCC37323DGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company focused on analog and embedded processing technologies, with leadership in power management ICs and high-reliability industrial components.
The UCC3732x family was designed specifically for high-efficiency, high-frequency power conversion systems requiring robust, low-latency gate drive - targeting commercial-temperature DC-DC, solar, and motor control applications where thermal density and switching loss reduction are critical.
FAQ
What is the maximum operating junction temperature for UCC37323DGN?
The UCC37323DGN has a specified operating junction temperature range of 0°C to +70°C. This is the commercial-grade variant of the UCCx732x family; for extended temperature operation up to +125°C, the UCC27323DGN is the functionally identical alternative with same pinout and electrical specs.
Can UCC37323DGN drive P-channel MOSFETs on the high side?
No - UCC37323DGN is a low-side driver only and cannot directly drive high-side P-channel MOSFETs. Its outputs swing from GND to VDD only; it lacks bootstrap or level-shift capability. For high-side P-MOSFET drive, use a dedicated high-side driver such as the UCC27201 or implement external level-shifting circuitry.
Is UCC37323DGN pin-compatible with UCC37323D (SOIC-8)?
Yes - UCC37323DGN and UCC37323D share identical pin functions and numbering (including N/C pins at 1 and 8), enabling direct PCB layout reuse. However, the DGN package's PowerPAD requires GND-connected thermal pad and different solder stencil design versus the SOIC-8's exposed leads.
Does UCC37323DGN require external gate resistors?
Not inherently - UCC37323DGN's ±4-A peak drive and low output impedance (0.4–1.5 Ω) allow direct gate connection for most MOSFETs up to Qg ≈ 120 nC. External resistors are optional for EMI control or dV/dt limiting, but adding them reduces effective drive strength and increases switching time.
How does the PowerPAD™ in UCC37323DGN improve thermal performance?
The PowerPAD™ in UCC37323DGN reduces RθJA from 107.3°C/W (SOIC-8) to 56.6°C/W by providing a direct low-thermal-resistance path from die to PCB copper. When soldered to ≥2 cm² of 2-oz internal GND plane, it lowers junction temperature rise by up to 35°C at 1-W dissipation - extending reliability and enabling higher sustained drive current.
UCC37323DGN Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Driven Configuration:
- Low-Side
- Channel Type:
- Independent
- Number of Drivers:
- 2
- Gate Type:
- N-Channel, P-Channel MOSFET
- Voltage - Supply:
- 4.5V ~ 15V
- Logic Voltage - VIL, VIH:
- 1V, 2V
- Current - Peak Output (Source, Sink):
- 4A, 4A
- Input Type:
- Inverting
- High Side Voltage - Max (Bootstrap):
- -
- Rise / Fall Time (Typ):
- 20ns, 15ns
- Operating Temperature:
- 0°C ~ 70°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-HVSSOP
UCC37323DGN FAQ
1.How can I place an order for UCC37323DGN through Aetrix?
Please submit a Request for Quotation (RFQ) for UCC37323DGN on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UCC37323DGN reliable?
The price and inventory of UCC37323DGN are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UCC37323DGN is usually 5 days.
3.What payment methods are accepted for UCC37323DGN?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UCC37323DGN transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UCC37323DGN?
UCC37323DGN orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UCC37323DGN order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UCC37323DGN?
For technical support, including UCC37323DGN datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UCC37323DGN requirements.
6.How does Aetrix verify that UCC37323DGN is sourced from the original manufacturer or authorized distributors?
All UCC37323DGN products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UCC37323DGN meets industry standards.
7.What is the process for return or replacement of UCC37323DGN?
All UCC37323DGN units undergo pre-shipment inspection (PSI). If there is an issue with UCC37323DGN, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UCC37323DGN part is unused and in its original packaging.
Return procedure for UCC37323DGN:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
UCC37323DGN Tags
-
ZXGD3009E6TA
Diodes Incorporated
-
1EDN7512BXTSA1
Infineon Technologies
-
UCC27517DBVR
Texas Instruments
-
MCP1416T-E/OT
Microchip Technology
-
MCP1402T-E/OT
Microchip Technology
-
MCP1415T-E/OT
Microchip Technology
-
MCP1401T-E/OT
Microchip Technology
-
IX4428NTR
Littelfuse Inc.
-
IRS2005STRPBF
Infineon Technologies
-
IRS2008STRPBF
Infineon Technologies
-
IX4310TTR
Littelfuse Inc.
-
2EDN7524RXTMA1
Infineon Technologies
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
