Texas Instruments UCC37325DGN

Overview

UCC37325DGN from Texas Instruments is a dual low-side MOSFET driver with one inverting and one noninverting output channel, delivering ±4-A peak gate drive current at the Miller plateau region, operating from 4.5 V to 15 V supply, with 20 ns/15 ns rise/fall times into 1.8 nF load, used in high-frequency switch-mode power supplies and motor control inverters.

For engineers reviewing the UCC37325DGN datasheet, UCC37325DGN pinout, UCC37325DGN application, or UCC37325DGN equivalent, this page delivers verified electrical specs, thermal performance data, functional truth table mapping, MSOP-PowerPAD package layout guidance, and real-world parallel-output implementation constraints - all specific to the UCC37325DGN variant.

Technical Context

The UCC37325DGN implements a Bi-CMOS hybrid output stage combining bipolar and MOSFET transistors in parallel to sustain ±4-A peak current even at low VDD (4.5 V), enabling robust Miller plateau drive without droop. Its input stage features TTL/CMOS-compatible thresholds (VIN_H = 1.6–2.5 V, VIN_L = 0.8–1.5 V) with wide hysteresis and supply-voltage independence.

It operates across 0°C to +70°C ambient temperature, supports paralleling of OUTA and OUTB for 8-A aggregate drive, and uses industry-standard pinout with two no-connect pins (Pins 1 and 8). The MSOP-8 PowerPAD package provides 56.6°C/W junction-to-ambient thermal resistance and electrically isolated thermal pad tied to GND.

Key Specifications

Pinout & Package

UCC37325DGN uses an 8-pin MSOP package with exposed PowerPAD thermally and electrically connected to GND. The PowerPAD must be soldered to a large PCB copper area for optimal thermal performance and EMI suppression.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual low-side MOSFET driver applications.

Compared with UCC37325DGN, UCC27325DGN extends temperature range without changing footprint or drive capability, while LM5112MG/NOPB trades thermal robustness for higher peak current and control features - making UCC37325DGN optimal for cost-sensitive, thermally demanding 0–70°C industrial power stages.

Availability

UCC37325DGN is available at Aetrix Electronics and suitable for switch-mode power supplies, DC-DC converters, and solar inverters requiring stable component supply, long-term lifecycle assurance, and consistent MSOP-PowerPAD packaging.

Supply support for UCC37325DGN includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management ICs, with leadership in high-reliability industrial and automotive-grade components.

The UCC37325DGN belongs to TI's UCCx732x dual MOSFET driver product line, engineered specifically for high-efficiency, high-frequency power conversion systems where Miller plateau drive strength and thermal resilience are critical design constraints.

FAQ

What is the logic configuration of UCC37325DGN?

The UCC37325DGN features one inverting output (OUTA) and one noninverting output (OUTB), as confirmed by the device comparison table and truth table in the official datasheet. This configuration supports complementary drive in half-bridge topologies without external logic inversion. Input thresholds are TTL/CMOS-compatible and independent of VDD, ensuring reliable operation across 4.5 V to 15 V supply rails. The UCC37325DGN truth table explicitly defines OUTA = NOT(INA) and OUTB = INB under all valid input states.

Can UCC37325DGN drive both N-channel and P-channel MOSFETs?

Yes - the UCC37325DGN's dual-output architecture enables mixed-channel drive: OUTB (noninverting) is optimized for N-channel MOSFETs in low-side or synchronous rectifier positions, while OUTA (inverting) is designed for P-channel MOSFETs in high-side configurations. The datasheet confirms that OUTA of UCC37325 drives external P-channel devices and OUTB drives N-channel devices. Both outputs deliver ±4-A peak current and swing rail-to-rail (GND to VDD), satisfying gate drive requirements for either channel type within the specified 4.5–15 V VDD range.

Does UCC37325DGN support paralleling of its two outputs?

Yes, the UCC37325DGN supports paralleling OUTA and OUTB to achieve up to 8-A aggregate peak drive current, as documented in Section 8.2.2.2 of the datasheet. This requires shorting INA and INB together at the IC pad (not upstream), tying OUTA and OUTB directly, and using matched external gate resistors if present. Critical constraints include maintaining input slew rate >20 V/µs and minimizing PCB trace length mismatch to prevent channel skew. Paralleling is validated for UCC37325DGN and does not require additional external components beyond proper layout.

What is the thermal performance advantage of the MSOP-PowerPAD package in UCC37325DGN?

The MSOP-PowerPAD (DGN) package of the UCC37325DGN achieves 56.6°C/W junction-to-ambient thermal resistance - 47% lower than the SOIC-8 (D) variant's 107.3°C/W. This is enabled by the exposed thermal pad, which must be soldered to a dedicated GND copper pour. As a result, UCC37325DGN sustains 1.2 W continuous power dissipation in standard 1-in² 2-oz copper layouts, versus 0.65 W for SOIC-8. This directly improves long-term reliability in thermally dense power stages like solar microinverters and motor drives.

Is UCC37325DGN pin-compatible with other UCCx732x family members?

Yes - the UCC37325DGN shares identical 8-pin MSOP-PowerPAD (DGN) footprint and pinout with UCC27323DGN, UCC27324DGN, UCC37323DGN, and UCC37324DGN, as verified in the Device Comparison Table and Pin Configuration section. All DGN-packaged UCCx732x variants use the same pin assignments: Pins 1/8 = N/C, Pin 2 = INA, Pin 3 = GND, Pin 4 = INB, Pin 5 = OUTB, Pin 6 = VDD, Pin 7 = OUTA. This allows board-level substitution between logic variants (inverting/noninverting) without layout changes, provided temperature and drive requirements align.