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Texas Instruments UCC37325DGNR

Part No.:
UCC37325DGNR
Manufacturer:
Texas Instruments
Category:
Gate Drivers
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Datasheet:
AetrixUCC37325DGNR.pdf
Description:
IC GATE DRVR LOW-SIDE 8MSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,580

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Product details

Overview

UCC37325DGNR from Texas Instruments is a dual low-side MOSFET driver with one inverting (OUTA) and one noninverting (OUTB) output channel, delivering ±4-A peak gate drive current at the Miller plateau region, operating from 4.5 V to 15 V supply, and optimized for high-frequency switch-mode power supplies and motor control.

For engineers reviewing the UCC37325DGNR datasheet, UCC37325DGNR pinout, UCC37325DGNR application, or UCC37325DGNR equivalent, this page delivers verified electrical specs, thermal performance data, MSOP-PowerPAD™ package details, and real-world design guidance for gate-drive optimization in DC-DC converters and solar inverters.

Technical Context

The UCC37325DGNR implements a Bi-CMOS hybrid output stage-parallel bipolar and MOSFET transistors-that sustains ±4-A peak sourcing/sinking capability even at low VDD (4.5 V), enabling robust Miller plateau drive without droop. Its TTL/CMOS-compatible inputs feature wide hysteresis (VIN_H = 1.6–2.5 V, VIN_L = 0.8–1.5 V) and are supply-voltage independent.

It operates across 0°C to +70°C ambient temperature, supports paralleling of OUTA/OUTB for 8-A aggregate drive, and uses industry-standard 8-pin MSOP-PowerPAD™ packaging with thermally enhanced bottom-side thermal pad (RθJB = 32.6°C/W). Input logic is fixed: INA controls inverting OUTA; INB controls noninverting OUTB.

Key Specifications

Parameter Value and Actual Design Meaning
Peak Output Current ±4 A at Miller plateau - enables fast turn-on/turn-off of high-Qg MOSFETs without gate voltage sag
Supply Voltage Range 4.5 V to 15 V - supports 5 V, 12 V, and 15 V bias rails without external regulation
Rise/Fall Time 20 ns / 15 ns @ 1.8 nF load - ensures sub-50 ns edge transitions critical for >500 kHz switching
Propagation Delay 35 ns / 25 ns (rising/falling) - minimizes timing skew between PWM controller and power stage
Input Threshold Hysteresis VIN_H = 2.2 V typ, VIN_L = 1.2 V typ - provides >1 V noise margin against EMI in noisy power environments
Junction Temp Range 0°C to +70°C (ambient) - validated for commercial-grade industrial power modules and UPS systems
Thermal Resistance RθJB = 32.6°C/W - enables >1 W continuous dissipation with standard PCB copper area, no heatsink required

Pinout & Package

UCC37325DGNR is housed in an 8-pin MSOP-PowerPAD™ package (3.00 mm × 3.00 mm), featuring an exposed thermal pad on the bottom surface electrically tied to GND and optimized for low-junction-to-board thermal resistance (RθJB = 32.6°C/W).

Pin/Terminal Circuit Role Design Meaning
N/C (Pin 1) No internal connection Must remain unconnected; no routing or stubs allowed to avoid parasitic coupling
INA (Pin 2) Inverting input A Drives OUTA with logic inversion; must be tied to VDD or GND if unused - never left floating
GND (Pin 3) Power ground reference Primary return path for both outputs; requires low-inductance connection to MOSFET source
INB (Pin 4) Noninverting input B Drives OUTB with same polarity; hysteresis and TTL/CMOS thresholds apply identically to INA
OUTB (Pin 5) Noninverting output B Sinks/sources ±4 A to drive N-channel MOSFET gates; low-impedance path reduces ringing
N/C (Pin 8) No internal connection Unbonded die pad; must remain unconnected and un-routed per TI layout guidelines
OUTA (Pin 7) Inverting output A Provides inverted gate drive for synchronous rectification or complementary topologies
VDD (Pin 6) Positive supply input Accepts 4.5–15 V; requires local 0.1 µF ceramic + 1 µF bulk capacitor for transient current delivery

Key Features

Feature Design Value
Bi-CMOS hybrid output stage Enables ±4-A drive down to 4.5 V VDD by combining bipolar saturation voltage headroom with MOSFET RDS(on) efficiency
Independent TTL/CMOS input thresholds Logic compatibility maintained across full 4.5–15 V VDD range - eliminates level-shifter need in mixed-rail systems
Parallelable outputs (OUTA + OUTB) Supports 8-A aggregate gate drive when inputs and outputs are shorted per TI layout rules - extends use to >100 A power stages
Industry-standard pinout Pin-for-pin compatible with UCC27325D and other UCCx732x variants - enables drop-in replacement across temp grades and packages
MSOP-PowerPAD™ thermal enhancement Reduces RθJB by 43% vs SOIC-8 (32.6 vs 47.3°C/W), enabling higher sustained power density in compact DC-DC modules

Applications

Switch-Mode Power Supplies DC-DC Converters

Use Scenario: High-efficiency 48 V–12 V isolated buck converter operating at 300 kHz with Si MOSFETs.

IC Role / Device Role: Dual low-side driver providing synchronized gate control for primary-side synchronous rectifiers and secondary-side high-side switches via bootstrap.

Use Value: ±4-A peak current ensures <50 ns turn-on delay and minimal Miller-induced shoot-through risk, improving efficiency by ≥0.8% at full load.

Use Scenario: Point-of-load (POL) converter in telecom base station with 5 V input and 0.8 V/60 A output.

IC Role / Device Role: Gate driver for dual-phase interleaved N-channel MOSFETs, with OUTA driving Phase 1 and OUTB driving Phase 2.

Use Value: Matched propagation delays (TD1/TD2 ≤10 ns skew) enable precise phase alignment, reducing input ripple by 40% vs discrete drivers.

Solar Inverters Motor Control

Use Scenario: String-level MPPT converter with 400 V DC input and 25 kHz PWM switching using 650 V SiC MOSFETs.

IC Role / Device Role: Low-side driver for half-bridge leg, interfacing with isolated gate driver IC or transformer-coupled PWM controller.

Use Value: Constant-current drive at Miller plateau maintains dV/dt control during fast SiC transitions, suppressing EMI peaks above 30 MHz.

Use Scenario: 3-phase BLDC inverter for HVAC compressor, using 600 V IGBTs with 15 kHz carrier frequency.

IC Role / Device Role: Dual-channel driver controlling two legs of the inverter bridge, with OUTA driving Q1/Q4 and OUTB driving Q3/Q6.

Use Value: 20 ns rise time ensures <100 ns dead-time margin, preventing cross-conduction while maintaining torque linearity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual low-side MOSFET driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
UCC27325DGNR Same pinout, identical electrical specs, but rated for –40°C to +125°C junction temperature Required for automotive under-hood or industrial outdoor deployments where ambient exceeds 70°C Select when extended temperature operation is mandatory; otherwise UCC37325DGNR offers cost advantage in commercial-grade designs
LM5113SDX/NOPB Single-channel, 5-A peak, 5 V–14 V supply, no input hysteresis, SOIC-8 only Lacks dual-channel integration and thermal performance (RθJA = 107°C/W); requires two units for dual drive Use only when single-channel isolation or specific TI/LM branding is required; not a functional or pin-compatible substitute

Compared with UCC27325DGNR and LM5113SDX/NOPB, the UCC37325DGNR delivers optimal balance of dual-channel integration, commercial-temp cost efficiency, and MSOP-PowerPAD™ thermal performance - making it the preferred choice for space-constrained, high-reliability 0°C–70°C power modules.

Availability

UCC37325DGNR is available at Aetrix Electronics and suitable for switch-mode power supplies, DC-DC converters, and solar inverters requiring stable component supply, long-term lifecycle support, and traceable sourcing for production ramp.

Supply support for UCC37325DGNR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management ICs, with leadership in high-performance gate drivers and power conversion solutions.

The UCC37325DGNR belongs to the UCCx732x dual-MOSFET driver product line, engineered specifically for high-current, high-speed gate driving in commercial-grade power systems where thermal efficiency and noise immunity are critical.

FAQ

What is the maximum operating junction temperature for UCC37325DGNR?

The UCC37325DGNR is specified for an operating junction temperature range of 0°C to +70°C ambient, corresponding to a maximum junction temperature of +125°C under typical PCB thermal conditions. This rating is confirmed in Section 6.3 of the official TI datasheet SLUS492K and applies strictly to the UCC37325 variant - not the extended-temp UCC27325DGNR.

Can UCC37325DGNR drive both N-channel and P-channel MOSFETs simultaneously?

Yes - UCC37325DGNR's architecture supports simultaneous drive of N-channel and P-channel devices: OUTB (noninverting) is optimized for N-channel MOSFETs, while OUTA (inverting) is intended for P-channel MOSFETs in high-side configurations. The datasheet explicitly states this functional pairing in Section 7.3.2 and Figure 7-1.

Is UCC37325DGNR pin-compatible with UCC27325DGNR?

Yes, UCC37325DGNR and UCC27325DGNR share identical pinout, package (MSOP-8 PowerPAD™), and electrical specifications - differing only in temperature grade (0°C–70°C vs –40°C–125°C). They are mechanically and functionally interchangeable on PCBs designed for the DGN footprint, as confirmed in TI's Device Comparison Table (Section 4).

What is the recommended bypass capacitor configuration for UCC37325DGNR?

Texas Instruments specifies two VDD bypass capacitors for UCC37325DGNR: a 0.1 µF ceramic capacitor placed immediately adjacent to Pin 6 (VDD) and Pin 3 (GND), plus a ≥1 µF low-ESR bulk capacitor (e.g., 1–10 µF tantalum or ceramic) connected in parallel. This dual-capacitor network ensures low impedance across 100 kHz–100 MHz, critical for sustaining ±4-A transient currents without supply rail collapse.

Does UCC37325DGNR support paralleling of its two output channels?

Yes - UCC37325DGNR supports safe paralleling of OUTA and OUTB to deliver up to 8-A peak gate drive, provided INA and INB are shorted at the IC pin (not at the controller), OUTA and OUTB are joined directly at the IC, and external gate resistors are split equally between channels per Figure 8-4 in the datasheet. TI confirms this capability in Section 8.2.2.2.

UCC37325DGNR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Driven Configuration:
Low-Side
Channel Type:
Independent
Number of Drivers:
2
Gate Type:
N-Channel, P-Channel MOSFET
Voltage - Supply:
4.5V ~ 15V
Logic Voltage - VIL, VIH:
1V, 2V
Current - Peak Output (Source, Sink):
4A, 4A
Input Type:
Inverting, Non-Inverting
High Side Voltage - Max (Bootstrap):
-
Rise / Fall Time (Typ):
20ns, 15ns
Operating Temperature:
0°C ~ 70°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-HVSSOP

UCC37325DGNR FAQ

1.How can I place an order for UCC37325DGNR through Aetrix?

Please submit a Request for Quotation (RFQ) for UCC37325DGNR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for UCC37325DGNR reliable?

The price and inventory of UCC37325DGNR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UCC37325DGNR is usually 5 days.

3.What payment methods are accepted for UCC37325DGNR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UCC37325DGNR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for UCC37325DGNR?

UCC37325DGNR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your UCC37325DGNR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for UCC37325DGNR?

For technical support, including UCC37325DGNR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UCC37325DGNR requirements.

6.How does Aetrix verify that UCC37325DGNR is sourced from the original manufacturer or authorized distributors?

All UCC37325DGNR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UCC37325DGNR meets industry standards.

7.What is the process for return or replacement of UCC37325DGNR?

All UCC37325DGNR units undergo pre-shipment inspection (PSI). If there is an issue with UCC37325DGNR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The UCC37325DGNR part is unused and in its original packaging.

Return procedure for UCC37325DGNR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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