Texas Instruments UCC37325DR

Overview

UCC37325DR from Texas Instruments is a dual low-side MOSFET driver with one inverting (OUTA) and one noninverting (OUTB) output channel, delivering ±4-A peak gate drive current at the Miller plateau region, operating from 4.5 V to 15 V supply, and optimized for high-frequency switch-mode power supplies driving N- and P-channel MOSFETs.

For engineers reviewing the UCC37325DR datasheet, UCC37325DR pinout, UCC37325DR application, or UCC37325DR equivalent, this page delivers verified electrical specs, thermal performance data, SOIC-8 package layout guidance, and real-world selection criteria for gate driver integration in DC-DC converters and solar inverters.

Technical Context

The UCC37325DR implements a Bi-CMOS hybrid output stage-parallel bipolar and MOSFET transistors-that sustains ±4-A peak sourcing/sinking capability even at low VDD (4.5 V), enabling robust Miller plateau drive without droop. Its TTL/CMOS-compatible inputs feature wide hysteresis (VIN_H = 1.6–2.5 V, VIN_L = 0.8–1.5 V) and are supply-voltage independent.

It operates across 0°C to +70°C ambient temperature, supports paralleling of OUTA/OUTB for 8-A aggregate drive, and uses industry-standard SOIC-8 pinout with two no-connect pins (1 and 8). Propagation delays are tightly specified: TD1 = 25–40 ns (rising edge), TD2 = 35 ns (falling edge) into 1.8-nF load.

Key Specifications

Pinout & Package

UCC37325DR is housed in an 8-pin SOIC (D) package (4.90 mm × 3.91 mm), thermally optimized for surface-mount assembly and board-level heat dissipation. The PowerPAD variant (DGN) is not used in this R-suffixed reel version.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual low-side gate driver applications.

Compared with UCC27325DR, the UCC37325DR trades extended temperature range for lower unit cost in commercial power supplies; versus LM5113SDX/NOPB, it provides true dual-channel flexibility and inverting/noninverting pairing essential for complementary gate drive without external logic inversion.

Availability

UCC37325DR is available at Aetrix Electronics and suitable for switch-mode power supplies, DC-DC converters, and solar inverters requiring stable component supply, consistent SOIC-8 packaging, and guaranteed 4-A peak gate drive performance.

Supply support for UCC37325DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with over 50 years of innovation in high-reliability power conversion solutions.

The UCC37325DR belongs to TI's UCCx732x dual MOSFET driver product line, engineered specifically for high-speed, high-current gate drive in commercial-grade power supplies where cost, thermal performance, and timing precision are critical.

FAQ

What is the maximum gate capacitance UCC37325DR can drive while maintaining 20-ns rise time?

The UCC37325DR achieves 20-ns rise time into a 1.8-nF capacitive load per channel, as measured in production test conditions. For larger gate capacitances (e.g., >5 nF), rise time increases linearly with CLOAD; at 10 nF, typical rise time is ~110 ns. To maintain sub-50 ns transitions with high-Qg MOSFETs, parallel outputs or external gate resistors should be used - UCC37325DR itself does not limit CLOAD, but system-level timing budgets dictate practical limits.

Can UCC37325DR drive both N-channel and P-channel MOSFETs simultaneously?

Yes - UCC37325DR is specifically configured with one inverting output (OUTA) and one noninverting output (OUTB), enabling direct complementary drive of an N-channel low-side and P-channel high-side MOSFET pair in a half-bridge. OUTA sinks current to turn on a P-channel device, while OUTB sources current to turn on an N-channel device, eliminating need for external inverters or level shifters in such topologies.

Does UCC37325DR require external bootstrap components?

No - UCC37325DR is a low-side-only driver with dedicated GND and VDD pins; it does not incorporate high-side floating bias circuitry or bootstrap diodes. It is not intended for high-side N-channel drive. For high-side applications, a separate bootstrap IC (e.g., TPS28225) or isolated gate driver must be used alongside UCC37325DR for the low-side channel.

What is the recommended PCB layout practice for minimizing shoot-through risk with UCC37325DR?

To minimize shoot-through, route INA and INB traces with matched length and impedance, place 0.1-µF ceramic VDD bypass capacitor within 2 mm of Pin 6, and connect GND (Pin 3) directly to a solid ground plane under the IC. Avoid shared return paths between high-current gate loops and logic inputs. TI specifies <20 V/µs input slew rate tolerance - faster edges improve channel matching but require controlled-impedance routing.

Is UCC37325DR pin-compatible with other UCCx732x variants like UCC27324DR?

Yes - all UCCx732x devices (UCC27323/4/5 and UCC37323/4/5) share identical SOIC-8 pinout, including N/C pins at 1 and 8, GND at 3, VDD at 6, and mirrored IN/OUT assignments. Function differs only in logic configuration (dual inverting, dual noninverting, or mixed), so UCC37325DR can replace UCC27324DR physically, but software/firmware must match the inverting/noninverting channel behavior to avoid inverted gate signals.