My Inquiry
My Account
Semtech Corporation UCLAMP3331ZATFT
- Part No.:
- UCLAMP3331ZATFT
- Manufacturer:
- Semtech Corporation
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
UCLAMP3331ZATFT.pdf
- Description:
- TVS DIODE 3.3V 10V SLP0603P2X3F
- Quantity:
- Payment:
- Shipping:
Inventory:21,059
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
UCLAMP3331ZATFT from Semtech is a single-line transient voltage suppression (TVS) diode designed for ESD protection of 3.3V signal lines in portable electronics. It delivers ±30kV IEC 61000-4-2 contact/air ESD immunity, 7.0V ESD clamping at 4A TLP, 0.07Ω typical dynamic resistance, and 20pF maximum junction capacitance in an ultra-small SLP0603P2X3F (0.6 × 0.3 × 0.25 mm) package.
For engineers reviewing the UCLAMP3331ZATFT datasheet, pinout, applications, or equivalent options, key selection criteria include low clamping voltage under fast ESD transients, minimal capacitive loading on high-speed interfaces, and compatibility with 0201-class assembly processes for space-constrained mobile designs.
Technical Context
The UCLAMP3331ZATFT employs silicon-avalanche TVS technology optimized for board-level ESD protection. Its 3.3V working voltage and 3.9–6.5V breakdown range ensure reliable standoff during normal operation while triggering rapidly under ESD stress.
It uses Transmission Line Pulse (TLP) characterization to define clamping behavior: 7.0V at 4A and 7.8V at 16A with 0.2/100ns waveform, enabling accurate system-level ESD margin analysis. The 0.07Ω dynamic resistance minimizes voltage overshoot during fast transients.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Working Voltage | 3.3V - Matches standard I/O rail voltage; ensures no leakage or false triggering during nominal operation. |
| ESD Withstand | ±30kV contact & air (IEC 61000-4-2) - Exceeds industrial and consumer ESD immunity requirements for handheld devices. |
| Clamping Voltage | 7.0V at 4A TLP - Limits voltage seen by protected IC during fast ESD events, reducing risk of latch-up or damage. |
| Junction Capacitance | 20pF max at 0V - Low enough for USB 2.0, audio, and side-key interfaces without signal integrity degradation. |
| Dynamic Resistance | 0.07Ω typical - Enables tight clamping response and consistent voltage limiting across ESD current levels. |
| Leakage Current | 350nA max at 3.3V - Negligible power drain on battery-powered systems; avoids signal distortion in high-impedance nodes. |
| Package Size | 0.6 × 0.3 × 0.25 mm - Fits within 0201 footprint constraints; enables placement directly at connector entry points. |
Pinout & Package
UCLAMP3331ZATFT is housed in the SLP0603P2X3F two-terminal surface-mount package (0.6 mm × 0.3 mm × 0.25 mm), lead-finished with NiAu, and compliant with RoHS/WEEE standards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode | Connected to protected signal line; forms cathode-to-ground path during ESD event. |
| 2 | Cathode | Connected to system ground; provides low-impedance discharge path for ESD current. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low dynamic resistance | 0.07Ω typical - Reduces clamping voltage overshoot and improves consistency across ESD pulse amplitudes. |
| Low capacitance | 20pF max - Preserves signal integrity on high-speed or analog interfaces like audio ports and USB D+/D−. |
| High ESD withstand | ±30kV per IEC 61000-4-2 - Meets and exceeds Level 4 immunity for consumer and industrial portable equipment. |
| Miniature 0201-compatible footprint | SLP0603P2X3F package - Enables discrete line protection where arrays are impractical, e.g., side keys or SIM card slots. |
| Solid-state avalanche construction | No wear-out mechanism - Maintains consistent clamping performance over lifetime, unlike MLVs. |
Applications
| Cellular Handset Side Keys | USB 2.0 Data Lines |
|---|---|
Use Scenario: ESD exposure on mechanical side keys exposed to user finger contact during daily handling. IC Role / Device Role / Timing Role: Standalone unidirectional TVS diode providing primary ESD shunt path from key trace to ground. Use Value: Prevents microcontroller GPIO latch-up or damage with 7.0V clamping at 4A TLP, preserving system reliability without adding capacitance. |
Use Scenario: Human-body-model ESD events on USB D+ and D− pins during cable insertion/removal. IC Role / Device Role / Timing Role: Single-line bidirectional-capable TVS (anode-cathode configuration) placed inline with each data line. Use Value: 20pF max capacitance avoids USB 2.0 eye diagram distortion while clamping transients below 7.8V at 16A TLP. |
| Smartphone Audio Jacks | Tablet PC Keypads |
Use Scenario: Air-gap ESD discharges into 3.5mm TRRS jack contacts during plug insertion or pocket friction. IC Role / Device Role / Timing Role: Discrete line protector on MIC, GND, and audio return paths, mounted adjacent to jack footprint. Use Value: ±30kV air discharge rating ensures robustness against common-mode ESD; 350nA leakage avoids DC bias shift in analog audio paths. |
Use Scenario: Repeated ESD strikes on capacitive or mechanical keypad traces in tablet edge zones. IC Role / Device Role / Timing Role: One UCLAMP3331ZATFT per key trace, routed directly from switch pad to ground plane. Use Value: 0.6 × 0.3 mm size allows placement within tight key matrix layouts; low 0.07Ω RDYN ensures uniform clamping across all keys. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SP1001-01UTG | Higher capacitance (35pF), lower ESD rating (±15kV), same 3.3V VRWM | Better suited for lower-speed interfaces where capacitance is less critical | Select when cost sensitivity outweighs need for lowest clamping voltage or highest ESD rating |
| ESD9B3.3ST5G | Lower clamping (6.5V at 4A), higher leakage (1µA), same SOD-923 package size | Preferred for ultra-low-voltage logic rails where sub-7V clamping is mandatory | Choose when protecting 1.8V–3.3V mixed-signal I/O with tighter voltage margins than UCLAMP3331ZATFT supports |
Compared with SP1001-01UTG and ESD9B3.3ST5G, UCLAMP3331ZATFT offers superior ESD immunity (±30kV) and lower dynamic resistance (0.07Ω), making it optimal for high-reliability portable front-end protection-though its 20pF capacitance requires verification against signal bandwidth limits.
Availability
UCLAMP3331ZATFT is available at Aetrix Electronics and suitable for cellular handsets, tablet PCs, and portable instrumentation requiring stable component supply with full traceability and lifecycle management.
Supply support for UCLAMP3331ZATFT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Semtech Corporation is a U.S.-based semiconductor company specializing in high-performance analog and mixed-signal semiconductors for infrastructure, IoT, and protection markets.
The µClamp® product line delivers ultra-low-capacitance, high-withstand ESD protection devices targeting space-constrained portable electronics, with emphasis on manufacturability in 0201-class SMT processes.
FAQ
What is the maximum junction capacitance of UCLAMP3331ZATFT, and why does it matter?
The maximum junction capacitance of UCLAMP3331ZATFT is 20pF at 0V reverse bias and 1MHz. This value directly impacts signal integrity on high-speed or analog lines: lower capacitance minimizes RC filtering and timing skew. For example, on USB 2.0 D+ and D− lines, staying below 20pF prevents eye diagram closure and maintains compliance with USB specification rise/fall time limits.
How does UCLAMP3331ZATFT achieve ±30kV ESD protection with such a small package?
UCLAMP3331ZATFT achieves ±30kV ESD protection using silicon-avalanche TVS technology with optimized doping and geometry in the SLP0603P2X3F die. Its low dynamic resistance (0.07Ω typical) enables rapid energy dissipation without thermal runaway, while the NiAu-plated terminals ensure robust interconnect reliability despite the 0.6 × 0.3 mm footprint.
Can UCLAMP3331ZATFT be used on 1.8V I/O lines?
No-UCLAMP3331ZATFT is specified for 3.3V working voltage (VRWM = 3.3V). Using it on 1.8V lines risks premature conduction due to its 3.9V minimum breakdown voltage. For 1.8V rails, Semtech's UCLAMP1831ZATFT or similar 1.8V-rated variants are required to maintain safe standoff and avoid leakage-induced logic errors.
What is the recommended PCB land pattern for UCLAMP3331ZATFT?
Semtech recommends a non-solder-mask-defined land pattern per IPC-7351 for the SLP0603P2X3F package, with pad dimensions of 0.270 × 0.250 mm and 0.100 mm stencil thickness. The aperture should be rectangular with rounded corners and an area ratio of 0.70–0.75 to ensure consistent solder paste release and void-free reflow joints.
Is UCLAMP3331ZATFT compatible with lead-free reflow profiles?
Yes-UCLAMP3331ZATFT is qualified per JEDEC J-STD-020 and supports standard lead-free reflow profiles with peak temperatures up to 260°C. Its NiAu terminal finish and halogen-free, RoHS-compliant construction ensure reliability through multiple thermal cycles without delamination or solder joint fracture.
UCLAMP3331ZATFT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Semtech Corporation
- Package/Case:
- 0201 (0603 Metric)
- Series:
- uClamp®
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 3.9V
- Voltage - Clamping (Max) @ Ipp:
- 10V
- Current - Peak Pulse (10/1000µs):
- 5A (8/20µs)
- Power - Peak Pulse:
- 30W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 16.5pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SLP0603P2X3F
UCLAMP3331ZATFT FAQ
1.How can I place an order for UCLAMP3331ZATFT through Aetrix?
Please submit a Request for Quotation (RFQ) for UCLAMP3331ZATFT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for UCLAMP3331ZATFT reliable?
The price and inventory of UCLAMP3331ZATFT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for UCLAMP3331ZATFT is usually 5 days.
3.What payment methods are accepted for UCLAMP3331ZATFT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for UCLAMP3331ZATFT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for UCLAMP3331ZATFT?
UCLAMP3331ZATFT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your UCLAMP3331ZATFT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for UCLAMP3331ZATFT?
For technical support, including UCLAMP3331ZATFT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your UCLAMP3331ZATFT requirements.
6.How does Aetrix verify that UCLAMP3331ZATFT is sourced from the original manufacturer or authorized distributors?
All UCLAMP3331ZATFT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that UCLAMP3331ZATFT meets industry standards.
7.What is the process for return or replacement of UCLAMP3331ZATFT?
All UCLAMP3331ZATFT units undergo pre-shipment inspection (PSI). If there is an issue with UCLAMP3331ZATFT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The UCLAMP3331ZATFT part is unused and in its original packaging.
Return procedure for UCLAMP3331ZATFT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
UCLAMP3331ZATFT Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
