Taiwan Semiconductor Corporation UF1D B0G

Overview

UF1D B0G from Taiwan Semiconductor is a 200 V, 1 A glass-passivated ultra-fast recovery rectifier diode in DO-204AL (DO-41) package, featuring 50 ns reverse recovery time, 1.0 V forward voltage at 1 A and 25°C, and 30 A surge current capability - deployed in DC-DC converters and freewheeling paths of switching inverters.

For engineers reviewing the UF1D B0G datasheet, UF1D B0G pinout, UF1D B0G application, or UF1D B0G equivalent, key selection criteria include repetitive peak reverse voltage (200 V), soft recovery behavior, junction temperature range (–55°C to +150°C), thermal resistance (R_θJL = 15°C/W), and AEC-Q101 qualification status (not applicable to B0G variant).

Technical Context

This discrete ultra-fast rectifier uses a single-die silicon PN junction with glass passivation for stable high-temperature operation up to 150°C junction temperature. Its soft recovery characteristic minimizes EMI generation during commutation in high-frequency switching topologies.

The device exhibits 17 pF junction capacitance at 4 V reverse bias and 1 MHz, enabling predictable snubber design. Reverse leakage remains ≤5 µA at 25°C and ≤150 µA at 125°C under rated V_RRM, supporting reliable blocking in low-power SMPS feedback paths.

Key Specifications

Pinout & Package

Package: DO-204AL (DO-41), axial-leaded, epoxy-molded case with cathode band marking. Lead finish: pure tin, solderable per J-STD-002. Weight: 0.330 g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-fast rectifier applications.

Compared with STTH1R02U and ES1D, UF1D B0G offers balanced ultra-fast recovery (50 ns) and low forward drop (1.0 V) in a proven through-hole DO-41 package, making it optimal for cost-sensitive, thermally stable, and serviceable industrial power designs where layout-controlled EMI and manual rework are priorities.

Availability

UF1D B0G is available at Aetrix Electronics and suitable for DC-DC converter output rectification, switching inverter freewheeling paths, and AC-DC adapter auxiliary supplies requiring stable component supply, long-lifecycle availability, and traceable sourcing.

Supply support for UF1D B0G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving industrial, computing, and consumer markets since 1979.

The UF1x series was designed specifically for high-efficiency, high-reliability rectification in switching-mode power supplies and motor drives, emphasizing thermal robustness, soft recovery, and long-term parametric stability under thermal cycling.

FAQ

What is the maximum junction temperature rating for UF1D B0G?

The UF1D B0G has a maximum junction temperature (T_J) of +150°C and a minimum of –55°C. This rating is confirmed in the Absolute Maximum Ratings table of the official TSC datasheet (Version G2104). Operation within this range ensures parametric stability and reliability in industrial and automotive-adjacent environments. Derating curves show usable current decreases linearly above 75°C ambient, and the device must be mounted with appropriate thermal relief to avoid exceeding T_J under full-load conditions. The UF1D B0G achieves this using a glass-passivated die and low R_θJL of 15°C/W.

Is UF1D B0G AEC-Q101 qualified?

No, UF1D B0G is not AEC-Q101 qualified. The "B0G" suffix indicates standard commercial-grade packaging (DO-41, ammo box, green compound), whereas AEC-Q101 qualification requires the "H" suffix (e.g., UF1D H B0G). Per TSC's Ordering Information table, only parts marked with "H" meet AEC-Q101 stress test requirements. The UF1D B0G retains all electrical and thermal specifications of the family but lacks the extended reliability validation required for automotive under-hood applications. For automotive use, specify UF1D H B0G instead of UF1D B0G.

What does the "B0G" suffix mean in UF1D B0G?

The "B0G" suffix in UF1D B0G denotes packaging and environmental attributes: "B" = DO-204AL (DO-41) package, "0" = ammo box packing (3,000 units), and "G" = green (halogen-free) molding compound compliant with IEC 61249-2-21. This coding follows TSC's standardized ordering nomenclature in the datasheet's Ordering Information section. It does not indicate voltage grade (that is defined by "D" = 200 V) or qualification level (no "H" present). The UF1D B0G is functionally identical to UF1D in electrical specs but differs in packaging format and RoHS/halogen-free compliance versus legacy variants.

What is the reverse recovery time (t_rr) of UF1D B0G and how is it measured?

The UF1D B0G has a maximum reverse recovery time (t_rr) of 50 ns, measured under conditions of I_F = 0.5 A, I_R = 1.0 A, and I_rr = 0.25 A, per the Electrical Specifications table. This value applies to the UF1A–UF1G subgroup, which includes UF1D. The test uses a standardized half-sine waveform with specified di/dt and voltage transition rates. Because t_rr directly impacts switching loss and EMI, this 50 ns figure enables reliable operation in converters switching up to 300 kHz. The UF1D B0G achieves this via optimized doping and soft recovery design, distinct from the 75 ns rating of higher-voltage UF1J–UF1M variants.

Can UF1D B0G replace UF1D in existing designs?

Yes, UF1D B0G is a direct replacement for any standard UF1D part in the same DO-41 package, as "B0G" specifies only packing method (ammo box) and compound type (green/halogen-free), not electrical or thermal changes. All key parameters - V_RRM = 200 V, I_F = 1 A, t_rr = 50 ns, V_F = 1.0 V - remain identical to baseline UF1D. The "B0G" variant meets RoHS and halogen-free requirements without altering performance, making it suitable for drop-in substitution in legacy industrial and consumer power designs where environmental compliance is newly mandated. No layout or thermal redesign is needed for UF1D B0G.