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Toshiba Semiconductor and Storage ULN2004AFWG,N,E
- Part No.:
- ULN2004AFWG,N,E
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Bipolar Transistor Arrays
- Package:
- 16-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
ULN2004AFWG,N,E.pdf
- Description:
- TRANS 7NPN DARL 50V 500MA 16SOL
- Quantity:
- Payment:
- Shipping:
Inventory:2,852
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Product details
Overview
ULN2004AFWG,N,E from Toshiba Electronic Devices & Storage Corporation is a 7-channel sink-type DMOS transistor array designed for driving inductive loads such as relays, solenoids, and stepper motor windings. It integrates clamp diodes per channel, supports 50 V output voltage and 500 mA/channel peak current, and requires minimum 7.0 V input to activate outputs. It is used in industrial PLC output stages and automotive body control modules.
For engineers reviewing the ULN2004AFWG,N,E datasheet, ULN2004AFWG,N,E pinout, ULN2004AFWG,N,E application, or ULN2004AFWG,N,E equivalent, key selection criteria include verified 7.0 V logic-compatible input threshold, built-in flyback diode integration per channel, thermal derating behavior on JEDEC 2s2p board (10 mW/°C), and P-SOP16-0410-1.27-002 package compatibility with automated SMT assembly.
Technical Context
The ULN2004AFWG,N,E implements seven independent N-channel DMOS sink drivers with monolithic silicon construction. Each channel features an integrated clamp diode connected between output and COMMON pin to suppress inductive kickback during turn-off.
It operates with TTL- and CMOS-compatible input logic levels-specifically requiring ≥7.0 V input to guarantee full output conduction-and delivers low ON-resistance (0.7 V typical at 350 mA) while maintaining ≤1.0 μA leakage at 85°C. Thermal management follows JEDEC 2s2p PCB conditions with 1.25 W max power dissipation and 10 mW/°C derating above 25°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage Rating | 50 V - supports direct switching of 24 V DC industrial solenoids and 36 V automotive actuators without external snubbers |
| Per-Channel Output Current | 500 mA (MAX) - enables driving medium-power relays (e.g., 12 V/400 mA coil) with margin |
| Input Threshold (ON) | 7.0 V (MIN) - ensures reliable activation from 5 V logic via level-shifting or directly from 7–24 V control rails |
| ON-State Voltage Drop | 0.7 V (TYP, at 350 mA) - yields <0.25 W power loss per active channel, reducing thermal load |
| Clamp Diode Forward Voltage | 2.0 V (TYP, at 350 mA) - limits flyback energy dissipation within safe SOA during inductive turn-off |
| Power Dissipation (JEDEC 2s2p) | 1.25 W - defines maximum steady-state heat generation on standard evaluation PCB |
| Thermal Derating | 10 mW/°C above 25°C - mandates heatsinking or layout optimization for >70°C ambient operation |
Pinout & Package
P-SOP16-0410-1.27-002 surface-mount package: 16-pin, 1.27 mm pitch, 10.4 mm × 5.5 mm footprint, 1.2 mm max height, 0.15 g typical weight.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–7 (I1–I7) | Input control signals | CMOS/TTL-compatible inputs; ≥7.0 V required to fully saturate corresponding output |
| 8 | GND | Logic ground reference; must be low-impedance connection to minimize noise coupling into input thresholds |
| 9 | COMMON | Anode connection point for all internal clamp diodes; tied to positive rail of inductive load supply |
| 10–16 (O7–O1) | Sink output terminals | N-channel DMOS drains; each switches load current to GND when corresponding input is high |
Key Features
| Feature | Design Value |
|---|---|
| Integrated clamp diodes | One per channel, rated 50 V reverse, 400 mA forward - eliminates need for 7 discrete external flyback diodes |
| High-voltage sink capability | 50 V output rating - allows direct interface with 24 V/36 V industrial and automotive loads |
| Low-input-threshold compatibility | 7.0 V min input for full conduction - compatible with 5 V logic via simple resistor divider or direct use with 7–24 V control sources |
| Thermally optimized package | P-SOP16-0410-1.27-002 with JEDEC 2s2p thermal profile - supports 1.25 W dissipation with 10 mW/°C derating |
| Robust ESD protection | Class H2 (≥4 kV HBM) per JESD22-A114 - withstands handling and board-level electrostatic discharge events |
Applications
| Industrial Relay Drivers | Automotive Body Control |
|---|---|
Use Scenario: Driving 24 V DC electromagnetic relays in programmable logic controller (PLC) output modules. IC Role / Device Role / Timing Role: Sink driver array providing galvanically isolated load switching with integrated flyback suppression. Use Value: Eliminates 7 external diodes and reduces PCB area by >30% versus discrete MOSFET+diode solutions while maintaining 500 mA per channel drive. |
Use Scenario: Controlling door lock actuators, window lift motors, and mirror adjustment solenoids in vehicle body control units (BCUs). IC Role / Device Role / Timing Role: High-side referenced sink switch enabling common-positive load architecture with centralized COMMON rail. Use Value: Enables single-rail 12 V battery-powered actuation with built-in back-EMF clamping, reducing system BOM cost and failure points. |
| Stepper Motor Phase Control | Printer Solenoid Arrays |
Use Scenario: Driving unipolar stepper motor windings in office equipment and CNC positioning systems. IC Role / Device Role / Timing Role: Low-latency (0.4 μs tON) sink driver for precise phase sequencing under microcontroller GPIO control. Use Value: Supports 20 kHz+ step rates with <1.14 V ON-drop at 350 mA, minimizing winding heating and improving torque consistency. |
Use Scenario: Activating print head solenoids and paper feed mechanisms in impact dot-matrix printers. IC Role / Device Role / Timing Role: High-reliability current sink managing repetitive 100 ms pulses with 50% duty cycle at 85°C ambient. Use Value: Delivers 170 mA sustained per channel at 85°C/50% duty (FWG package), exceeding legacy mechanical solenoid requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage sink driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TBD62004APG | DIP-16 through-hole package; 1.47 W PD (device alone); no PCB thermal path dependency | Better suited for prototyping, manual soldering, or high-temperature environments where airflow cools device directly | Select TBD62004APG when hand-soldering, thermal testing without PCB, or replacing legacy DIP-based designs |
| ULN2003A | Lower input threshold (2.5 V MIN); same 7-channel sink architecture but rated for 500 mA at lower voltage (VOUT = 36 V) | Compatible with 3.3 V/5 V logic without level shifting; limited to ≤36 V loads | Choose ULN2003A for 3.3 V MCU interfaces or ≤36 V applications where lower drive voltage suffices |
Compared with TBD62004APG, ULN2004AFWG,N,E offers superior SMT manufacturability and higher thermal performance on JEDEC-compliant boards; versus ULN2003A, it provides higher 50 V load tolerance and 7.0 V input compatibility-critical for industrial 24 V control systems where noise immunity matters.
Availability
ULN2004AFWG,N,E is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, and printer peripheral design requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.
Supply support for ULN2004AFWG,N,E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation is a Japanese semiconductor manufacturer specializing in power devices, analog ICs, and discrete components for industrial, automotive, and consumer applications.
The TBD62003A/TBD62004A product line delivers high-voltage, high-current sink driver arrays optimized for inductive load switching in harsh environments-designed specifically for reliability in PLC I/O modules and automotive ECUs.
FAQ
What is the minimum input voltage required to fully turn on an output channel of ULN2004AFWG,N,E?
The ULN2004AFWG,N,E requires a minimum input voltage of 7.0 V to guarantee full output conduction at 100 mA or higher load current. This threshold ensures robust noise immunity in industrial 24 V control environments. Below 7.0 V, output saturation degrades, increasing ON-resistance and power dissipation. The ULN2004AFWG,N,E datasheet specifies this value under VIN(ON) test condition with VOUT = 2 V and IOUT ≥ 100 mA.
Does ULN2004AFWG,N,E include built-in protection against overcurrent or short-circuit conditions?
No, ULN2004AFWG,N,E does not include built-in overcurrent or short-circuit protection circuits. It relies on external current limiting-such as series resistors or fuse-integrated power rails-to prevent destruction under fault conditions. The absolute maximum ratings specify 500 mA per channel, but sustained operation near this limit requires strict thermal management. Designers must implement external safeguards per Toshiba's usage precautions.
Can ULN2004AFWG,N,E drive inductive loads without external flyback diodes?
Yes, ULN2004AFWG,N,E can drive inductive loads without external flyback diodes because it integrates a clamp diode between each output (O1–O7) and the COMMON pin. These diodes conduct the back-EMF current generated during load turn-off, protecting the DMOS transistors. The diodes are rated for 50 V reverse voltage and 400 mA forward current, matching typical relay and solenoid characteristics.
What is the thermal derating behavior of ULN2004AFWG,N,E on a standard PCB?
When mounted on a JEDEC 2s2p PCB, ULN2004AFWG,N,E has a maximum power dissipation of 1.25 W at 25°C ambient, with linear derating of 10 mW/°C above that temperature. At 75°C ambient, usable power drops to 0.75 W. This behavior is defined in Note 4 of the Absolute Maximum Ratings table and must be applied during thermal design to avoid junction temperature exceedance beyond 120°C.
How does the COMMON pin function in ULN2004AFWG,N,E circuit implementation?
The COMMON pin in ULN2004AFWG,N,E serves as the common anode connection for all seven internal clamp diodes. It must be connected to the positive supply rail of the inductive loads (e.g., +24 V), not to GND or logic VCC. This configuration allows flyback current from any active output to return safely through its dedicated diode to the load supply, preventing voltage spikes on the output lines and ensuring predictable clamping action across all channels.
ULN2004AFWG,N,E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 16-SOIC (0.154", 3.90mm Width)
- Packaging:
- Cut Tape (CT)
- Product Status:
- Active
- Transistor Type:
- 7 NPN Darlington
- Current - Collector (Ic) (Max):
- 500mA
- Voltage - Collector Emitter Breakdown (Max):
- 50V
- Vce Saturation (Max) @ Ib, Ic:
- 1.6V @ 500µA, 350mA
- Current - Collector Cutoff (Max):
- -
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 1000 @ 350mA, 2V
- Power - Max:
- 1.25W
- Frequency - Transition:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOL
ULN2004AFWG,N,E FAQ
1.How can I place an order for ULN2004AFWG,N,E through Aetrix?
Please submit a Request for Quotation (RFQ) for ULN2004AFWG,N,E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ULN2004AFWG,N,E reliable?
The price and inventory of ULN2004AFWG,N,E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ULN2004AFWG,N,E is usually 5 days.
3.What payment methods are accepted for ULN2004AFWG,N,E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ULN2004AFWG,N,E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ULN2004AFWG,N,E?
ULN2004AFWG,N,E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ULN2004AFWG,N,E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ULN2004AFWG,N,E?
For technical support, including ULN2004AFWG,N,E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ULN2004AFWG,N,E requirements.
6.How does Aetrix verify that ULN2004AFWG,N,E is sourced from the original manufacturer or authorized distributors?
All ULN2004AFWG,N,E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ULN2004AFWG,N,E meets industry standards.
7.What is the process for return or replacement of ULN2004AFWG,N,E?
All ULN2004AFWG,N,E units undergo pre-shipment inspection (PSI). If there is an issue with ULN2004AFWG,N,E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ULN2004AFWG,N,E part is unused and in its original packaging.
Return procedure for ULN2004AFWG,N,E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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