Microchip Technology UPR60/TR13

Overview

UPR60/TR13 from Microsemi is an ultra-fast recovery surface-mount rectifier diode rated for 600V reverse voltage, 2A average forward current, and 30ns reverse recovery time, with low forward voltage (1.4V at 1.2A) and thermal resistance of 10°C/W junction-to-bottom - used in high-frequency switching power supplies and charge pump circuits.

For engineers reviewing the UPR60/TR13 datasheet, UPR60/TR13 pinout, UPR60/TR13 application, or UPR60/TR13 equivalent, key selection criteria include reverse recovery time, thermal performance under PCB-mounted conditions, forward voltage drop at operating current, and compatibility with automated SMT assembly equipment.

Technical Context

The UPR60/TR13 employs a flip-chip die construction in Microsemi's Powermite SMT package, eliminating wire bonds to reduce parasitic inductance and improve high-frequency switching efficiency. Its full metallic bottom enables direct thermal conduction to the PCB copper plane, supporting 2.5W power dissipation at T_Tab = 75°C when mounted on 2 oz. copper.

Designed for high-efficiency AC/DC and DC/DC conversion stages, the device delivers low reverse recovery charge (Q_rr) and minimal reverse recovery loss due to low peak reverse current (I_RM), verified under IF = 0.5A, IR = 1.0A, I_REC = 0.25A test conditions.

Key Specifications

Pinout & Package

UPR60/TR13 uses Microsemi's proprietary Powermite surface-mount package: a thermally enhanced, leadless, full-metal-bottom SMD housing with integral locking tab and no internal wire bonds. Dimensions: 6.10 × 4.06 × 1.27 mm (L × W × H).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-fast rectifier applications.

Compared with VS-2EY60 and MUR260, the UPR60/TR13 delivers superior thermal performance (10°C/W vs. ≥50°C/W), faster recovery (30ns vs. 35–60ns), and lower V_F, making it optimal for compact, high-efficiency SMT power stages where board space and thermal management are constrained.

Availability

UPR60/TR13 is available at Aetrix Electronics and suitable for switching power supplies, charge pump circuits, and industrial motor drive snubbers requiring stable component supply and long-term manufacturing continuity.

Supply support for UPR60/TR13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microsemi (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog, RF, and power discrete components for aerospace, defense, and industrial markets.

The UPR60/TR13 belongs to Microsemi's Powermite ultra-fast rectifier family, engineered specifically for high-frequency, high-efficiency SMT power conversion where thermal performance and assembly reliability are critical.

FAQ

What is the maximum average forward current rating for UPR60/TR13?

The UPR60/TR13 is rated for 2A average forward current when mounted on a PCB with 2 oz. copper and maintained at a tab temperature of 75°C. This rating assumes proper thermal design - exceeding this current without adequate copper area or airflow will cause junction overheating and premature failure. The UPR60/TR13 datasheet specifies 2.5W power dissipation under those conditions, consistent with its 10°C/W junction-to-bottom thermal resistance.

Does UPR60/TR13 have a documented reverse recovery time, and under what test conditions?

Yes, the UPR60/TR13 has a specified reverse recovery time of 30ns, measured under standardized conditions: forward current I_F = 0.5A, reverse current I_R = 1.0A, reverse recovery current I_REC = 0.25A, and ambient temperature T_A = 25°C. This value is confirmed in the MSC1597.PDF datasheet and reflects real-world performance in high-frequency switching applications where fast turn-off minimizes switching loss.

How does the Powermite package of UPR60/TR13 improve thermal performance compared to standard SMD diodes?

The Powermite package of UPR60/TR13 features a full metallic bottom that serves as both the cathode terminal and a direct thermal interface to the PCB copper plane, achieving a junction-to-bottom thermal resistance of just 10°C/W. Unlike conventional SMD diodes with plastic bodies and limited thermal pads, the UPR60/TR13 transfers heat efficiently without requiring external heatsinks - a key advantage verified in thermal imaging studies of PCB-mounted units.

Is UPR60/TR13 compatible with lead-free reflow soldering processes?

Yes, the UPR60/TR13 is qualified for standard lead-free reflow profiles, including JEDEC J-STD-020-compliant peak temperatures up to 260°C. Its Powermite package uses metallization and die attach materials rated for repeated thermal cycling, and the absence of internal wire bonds eliminates a common failure point during thermal stress. The UPR60/TR13 has been validated in production runs using SAC305 solder paste and standard convection reflow ovens.

Can UPR60/TR13 replace older axial-lead ultra-fast rectifiers like UF4007 in SMT designs?

Yes, UPR60/TR13 can replace UF4007 in SMT-based designs where board space, thermal performance, and high-frequency operation are priorities - but not as a direct pin-compatible drop-in. While both are 600V ultra-fast rectifiers, UPR60/TR13 offers 30ns T_rr (vs. 75ns for UF4007), lower V_F, and superior thermal coupling. Layout redesign is required due to its Powermite footprint, but the UPR60/TR13 delivers measurable efficiency gains in modern switch-mode applications.