Microchip Technology UPS540/TR13

Overview

UPS540/TR13 from Microsemi is a 5 A, 40 V Schottky barrier rectifier in the Powermite3® package, featuring low forward voltage (0.47 V at 5 A, 25°C), 3.2°C/W junction-to-case thermal resistance, and RoHS-compliant e3 matte-tin plating. It serves as a high-frequency SMD output rectifier in switching power supplies where low reverse recovery loss and minimal EMI are critical.

For engineers reviewing the UPS540/TR13 datasheet, UPS540/TR13 pinout, UPS540/TR13 application, or UPS540/TR13 equivalent, key selection criteria include its 100 A non-repetitive surge rating, 250 pF junction capacitance at 4 V, -55°C to +125°C operating junction temperature, and compatibility with automatic insertion equipment and 16 mm tape/reel handling per EIA-481-B.

Technical Context

This Schottky rectifier uses guard-ring-die construction for transient protection and relies on a full metallic bottom and integral locking tab to conduct heat directly to the heatsink-enabling effective thermal management without solder flux entrapment. Its low-profile design (max height 1 mm) and 190 × 270 mil footprint support dense PCB layouts.

The device operates with zero reverse recovery time and minimal IRM (reverse current), eliminating reverse-recovery oscillations. Electrical performance is specified across temperature: VF rises only marginally from 0.47 V (25°C) to 0.59 V (125°C) at 5 A, while IR increases from 0.03 mA to 2.5 mA at 40 V reverse bias.

Key Specifications

Pinout & Package

Powermite3® package: surface-mount, low-profile (1.0 mm max height), void-free thermosetting epoxy case (UL94V-0), full metallic bottom with locking tab, matte-tin plating over copper, polarity marked with cathode band (S540 marking), weight 0.072 g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schottky rectifier applications.

Compared with VS-50SQ040 and MBR540F-E3/45, UPS540/TR13 delivers superior thermal performance (3.2°C/W vs. ≥75°C/W) and lower leakage at elevated temperatures, making it optimal for space-constrained, high-reliability industrial power stages where flux-free assembly and automatic insertion are required.

Availability

UPS540/TR13 is available at Aetrix Electronics and suitable for switching power supplies, DC-DC converters, and charge pump circuits requiring stable component supply, RoHS compliance, and automated manufacturing readiness.

Supply support for UPS540/TR13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microsemi (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog and mixed-signal ICs, discrete power devices, and radiation-hardened components for aerospace, defense, and industrial markets.

The UPSx40 series was designed specifically for high-efficiency, high-frequency SMD rectification in compact power converters-emphasizing thermal integrity, surge resilience, and manufacturability in automated assembly lines.

FAQ

What is the maximum junction temperature rating for UPS540/TR13?

The UPS540/TR13 has a rated junction temperature range of -55°C to +125°C. This specification is validated per Microsemi's absolute maximum ratings table and applies under continuous operation with proper thermal management. The device must not exceed +125°C at the silicon junction during operation, which requires adherence to the 3.2°C/W RθJC limit and appropriate heatsinking. UPS540/TR13 derates linearly above 25°C ambient, and its 100 A surge rating assumes Tc = 90°C.

Does UPS540/TR13 support lead-free reflow soldering?

Yes, UPS540/TR13 features an e3 matte-tin plating that is fully compatible with lead-free reflow processes per JEDEC J-STD-020. Its annealed tin finish meets MIL-STD-750 Method 2026 for solderability and withstands peak reflow temperatures up to 260°C for 10 seconds. The Powermite3® package's void-free epoxy and metallic bottom also prevent delamination and flux entrapment during Pb-free thermal profiles. UPS540/TR13 is RoHS compliant and certified for Class 1 moisture sensitivity.

How does the locking tab on UPS540/TR13 improve thermal performance?

The locking tab on UPS540/TR13 is an integral part of the full metallic bottom structure that mechanically anchors the device to the PCB while providing a low-resistance thermal path from the die to the copper pour or heatsink. It reduces effective RθJC to 3.2°C/W by minimizing interfacial thermal resistance versus conventional SMD diodes with plastic-exposed pads. This feature allows UPS540/TR13 to dissipate 1.5 W continuously at Tc = 90°C-critical for fanless industrial power supplies. UPS540/TR13 leverages this tab for both thermal and mechanical stability.

Can UPS540/TR13 replace a standard 1N5822 in existing designs?

UPS540/TR13 is not a direct replacement for the through-hole 1N5822 due to differing packages (Powermite3® SMD vs. DO-201AD), pinout, and thermal interface. While both are 40 V, 5 A Schottky rectifiers, UPS540/TR13 offers lower VF (0.47 V vs. 0.55 V), better thermal resistance (3.2°C/W vs. ~10°C/W), and automated placement compatibility. Retrofitting requires PCB redesign. UPS540/TR13 is best suited for new SMD-focused designs prioritizing density and thermal performance.

What is the reverse recovery behavior of UPS540/TR13?

As a Schottky barrier rectifier, UPS540/TR13 exhibits no minority-carrier storage and therefore has zero reverse recovery time (trr ≈ 0 ns) and negligible reverse recovery charge (Qrr ≈ 0 nC). This eliminates reverse-recovery oscillations and associated EMI, reducing or removing the need for snubbers and EMI filters in high-frequency switching applications. UPS540/TR13 achieves this via majority-carrier conduction-confirmed by its 250 pF junction capacitance and absence of trr specification in the datasheet.