Taiwan Semiconductor Corporation UR3KB60

Overview

UR3KB60 from Taiwan Semiconductor is a 3A, 600V standard quad bridge rectifier in D3K package, featuring 90A surge capability, 150°C max junction temperature, and UL Recognized (E-326243) construction - deployed in AC/DC front-end stages of compact switching mode power supplies.

For engineers reviewing the UR3KB60 datasheet, UR3KB60 pinout, UR3KB60 application, or UR3KB60 equivalent, key selection criteria include repetitive peak reverse voltage (600 V), forward current rating (3.0 A with heatsink), thermal resistance (R_θJC = 5.2 °C/W), and D3K mechanical compatibility for PCB-mount high-density power conversion designs.

Technical Context

The UR3KB60 integrates four silicon diodes in a single-phase full-wave bridge configuration, optimized for unidirectional DC output from AC input. Its D3K package enables surface-mount assembly with matte tin-plated leads compliant to J-STD-002 solderability and JESD201 Class 1A whisker resistance.

Thermal performance is defined by R_θJC = 5.2 °C/W and R_θJA = 13.7 °C/W, supporting operation up to 150°C junction temperature. Electrical behavior includes VF ≤ 1.0 V at IF = 1.5 A (25°C), IR ≤ 10 µA per diode at rated VR, and I²t = 33.61 A²s for fusing protection.

Key Specifications

Pinout & Package

Package: D3K - molded plastic case meeting UL 94V-0 flammability rating, with matte tin-plated leads for reliable reflow soldering and JESD201 Class 1A whisker resistance. Mounting torque limit: 0.80 N·m.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBU6K and GBU6J, the UR3KB60 offers optimal balance of surge resilience (90 A), thermal efficiency (R_θJC = 5.2 °C/W), and D3K footprint compatibility - making it especially suited for space-constrained, high-reliability AC/DC converters where inrush and thermal margins are critical.

Availability

UR3KB60 is available at Aetrix Electronics and suitable for switching mode power supplies, AC adapters, and LED driver power stages requiring stable component supply, consistent parametric performance, and UL-recognized safety compliance.

Supply support for UR3KB60 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global power electronics and industrial markets since 1979.

The UR3KB60 belongs to TSC's standard bridge rectifier product line, engineered for high-efficiency, high-reliability AC/DC conversion in cost-sensitive, high-volume power supply applications - emphasizing thermal robustness, safety certification, and manufacturability.

FAQ

What is the maximum continuous forward current rating for UR3KB60 under typical PCB mounting conditions?

The UR3KB60 delivers 1.2 A continuous forward current without a heatsink at TA = 29°C, and 3.0 A when mounted with a heatsink at TC = 140°C. This dual rating reflects its D3K package's thermal path design - the 3.0 A value assumes effective case-to-heatsink conduction and is validated per absolute maximum ratings table in the official TSC datasheet (Version J2104). Designers must verify actual thermal resistance in their layout to avoid exceeding TJ max = 150°C.

Does UR3KB60 meet RoHS and halogen-free requirements?

Yes, UR3KB60 is RoHS compliant and halogen-free per IEC 61249-2-21. This is explicitly stated in the "FEATURES" section of the official Taiwan Semiconductor documentation (Version J2104), confirming suitability for environmentally regulated markets including EU, Japan, and China. The molding compound and plating materials are certified to these standards, and no exemptions apply to this part number.

What is the marking code printed on the UR3KB60 device body?

The marking code on the UR3KB60 device body is "UR3KB60", as confirmed in the "ABSOLUTE MAXIMUM RATINGS" table and "MARKING DIAGRAM" section of the Taiwan Semiconductor datasheet (Version J2104). This distinguishes it from other members of the UR3KBx family (e.g., UR3KB80, UR3KB100) and ensures traceability during inspection and assembly.

What is the junction-to-case thermal resistance (R_θJC) of UR3KB60, and how is it used in thermal design?

The junction-to-case thermal resistance (R_θJC) of UR3KB60 is 5.2 °C/W, per the "THERMAL PERFORMANCE" table in the official datasheet (Version J2104). This value quantifies the thermal barrier between the silicon die and the outer case surface, and is used to calculate temperature rise from junction to heatsink interface - essential for sizing thermal interface material and heatsink surface area in high-power-density designs.

Is UR3KB60 UL Recognized, and what is its recognition file number?

Yes, UR3KB60 is UL Recognized under File # E-326243, as documented in the "FEATURES" section of the Taiwan Semiconductor datasheet (Version J2104). This recognition applies specifically to the UR3KB60 variant and confirms compliance with UL 60747-1 for discrete semiconductors, supporting end-product safety certification for commercial and industrial power supplies.