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Vishay General Semiconductor - Diodes Division VESD01C1-HD1HG3-08
- Part No.:
- VESD01C1-HD1HG3-08
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- TVS Diodes
- Package:
- 0402 (1006 Metric)
- Datasheet:
-
VESD01C1-HD1HG3-08.pdf
- Description:
- 1V;IR=100UA;IP=14.6A;P=W;CD=230P
- Quantity:
- Payment:
- Shipping:
Inventory:11,750
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Product details
Overview
VESD01C1-HD1HG3-08 from Vishay Semiconductors is a unidirectional ESD-protection diode in DFN1006-2A package, rated for 1 V reverse stand-off voltage, 30 kV IEC 61000-4-2 contact/air discharge immunity, and 11 A peak pulse current (8/20 μs). It delivers 6.4 V typical reverse clamping voltage at 11 A and 192 pF typical capacitance at 0 V, targeting high-speed data line protection in space-constrained consumer and automotive interfaces.
For engineers reviewing the VESD01C1-HD1HG3-08 datasheet, VESD01C1-HD1HG3-08 pinout, VESD01C1-HD1HG3-08 application, or VESD01C1-HD1HG3-08 equivalent, key selection criteria include its 1 V working voltage, ultra-low 0.45 mm profile, sub-7 V clamping performance under 11 A transients, and compatibility with automated optical inspection due to Sn (e3) terminations.
Technical Context
This device implements a single-line, unidirectional TVS structure optimized for low-capacitance, low-clamping ESD suppression on signal lines operating near ground potential. Its 2.7 V typical breakdown voltage and 0.13 Ω dynamic resistance enable fast response to ±30 kV ESD events while minimizing voltage overshoot during transient conduction.
The DFN1006-2A footprint supports high-density PCB layouts with MSL level 1 moisture sensitivity and peak reflow tolerance up to 260 °C. Cathode marking and 100% Sn plating ensure reliable AOI-based solder-joint verification in high-volume SMT assembly.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Stand-off Voltage | 1 V - Maximum continuous working voltage before leakage exceeds 100 μA; enables protection of 0–1 V logic or analog signal paths. |
| Reverse Clamping Voltage | 6.4 V typical at 11 A (8/20 μs) - Limits transient voltage seen by downstream ICs to safe levels during worst-case ESD strikes. |
| Capacitance | 192 pF typical at 0 V, 1 MHz - Balances ESD robustness with minimal signal distortion on low-speed to medium-speed lines (e.g., I²C, UART). |
| ESD Immunity | ±30 kV contact / ±30 kV air per IEC 61000-4-2 - Meets automotive and industrial system-level ESD compliance requirements without external filtering. |
| Peak Pulse Current | 11 A per IEC 61000-4-5 (8/20 μs) - Handles high-energy surges from cable discharge events in portable and connected devices. |
| Dynamic Resistance | 0.13 Ω - Ensures rapid voltage clamping onset and low forward conduction loss during transient events. |
| Package | DFN1006-2A (1.0 × 0.6 × 0.45 mm) - Enables placement adjacent to connectors or IC pads in ultra-thin mobile and wearables designs. |
Pinout & Package
DFN1006-2A package: 2-terminal surface-mount device with cathode marked by bar on top surface; dimensions 1.0 mm × 0.6 mm × 0.45 mm max height; MSL level 1; compatible with standard SnPb- and lead-free reflow profiles (peak 260 °C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Anode) | Input signal path terminal | Connected to protected line (e.g., USB D+, HDMI TMDS+); conducts transient current toward ground when clamped. |
| 2 (Cathode) | Ground reference terminal | Connected to system ground plane; provides low-inductance return path for ESD current; marked with cathode bar on package top. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low clamping voltage | 6.4 V typical at 11 A ensures downstream 1.8 V/3.3 V ICs remain within absolute maximum ratings during ESD events. |
| Low-profile DFN package | 0.45 mm max height enables integration into < 1 mm total thickness assemblies such as smartphones and TWS earbuds. |
| High ESD immunity | ±30 kV contact/air meets IEC 61000-4-2 Level 4, eliminating need for secondary board-level protection in many applications. |
| Sn (e3) termination | Lead-free matte tin plating supports AOI-based solder-joint inspection and eliminates post-solder cleaning requirements. |
| Single-line unidirectional topology | Optimized for ground-referenced signal lines (e.g., push-pull GPIO, reset, interrupt), reducing parasitic capacitance vs. bidirectional alternatives. |
Applications
| USB 2.0 Data Lines | Automotive Infotainment Interfaces |
|---|---|
|
Use Scenario: Protecting D+ and D− pins of USB 2.0 ports against user-handling ESD in car audio head units and center consoles. IC Role / Device Role / Timing Role: Unidirectional transient voltage suppressor placed directly at connector, shunting ESD energy to chassis ground before it reaches USB transceiver IC. Use Value: Maintains 480 Mbps signal integrity with only 192 pF loading while surviving repeated ±30 kV contact discharges per IEC 61000-4-2. |
Use Scenario: Safeguarding LVDS or FPD-Link clock/data pairs in digital instrument clusters exposed to dry-environment ESD. IC Role / Device Role / Timing Role: Line-side ESD clamp on differential signal traces, referenced to vehicle ground; operates below 1 V common-mode offset. Use Value: Prevents latch-up or gate oxide damage in display timing controllers without adding series impedance or skew to high-speed signals. |
| Smartphone Button & Sensor Inputs | Industrial HMI Touch Controllers |
|
Use Scenario: Protecting mechanical button inputs (power, volume) and capacitive proximity sensors from human-body-model ESD in handheld devices. IC Role / Device Role / Timing Role: Low-leakage (20 μA max at 1 V) unidirectional clamp enabling direct connection to MCU GPIO with no pull-up compromise. Use Value: Eliminates false triggers and sensor drift caused by ESD-induced leakage while preserving battery life via sub-100 μA standby current. |
Use Scenario: Shielding resistive or projected-capacitive touch controller I/O pins in factory HMIs subjected to tool-induced ESD in maintenance environments. IC Role / Device Role / Timing Role: Front-end ESD guard on microcontroller input pins handling touch scan timing and coordinate reporting. Use Value: Ensures uninterrupted touch detection during routine panel servicing by absorbing ±30 kV discharges without requiring system reset or recalibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD-protection diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMAJ1.0A | DO-214AC package (4.5 × 2.7 × 2.2 mm); 1.0 V VRWM; 30 kV ESD rating; 100 W PPP; higher 12.5 V clamping at 11.2 A. | Larger footprint limits use in ultra-thin devices; better suited for board-edge protection where space allows. | Select SMAJ1.0A when higher surge power handling is required and PCB area permits larger discrete packaging. |
| TPD1E01B04DPYR | 0.6 × 0.3 × 0.35 mm X2SON package; 1.0 V VRWM; 30 kV ESD rating; 6.5 V clamping at 4 A; 15 pF capacitance. | Lower capacitance ideal for >100 Mbps interfaces (e.g., USB 3.0 SS), but lower 4 A IPPM reduces robustness against cable discharge events. | Choose TPD1E01B04DPYR for high-speed serial links where signal integrity dominates over extreme surge margin. |
Compared with SMAJ1.0A and TPD1E01B04DPYR, VESD01C1-HD1HG3-08 offers the optimal balance of ultra-small size (1.0 × 0.6 mm), 11 A surge capability, and 192 pF capacitance-making it preferred for cost-sensitive, space-constrained 1–50 Mbps interface protection where moderate bandwidth and high ESD robustness are both required.
Availability
VESD01C1-HD1HG3-08 is available at Aetrix Electronics and suitable for USB 2.0 data line protection, automotive infotainment interface hardening, and smartphone button/sensor input safeguarding requiring stable component supply across high-volume production cycles.
Supply support for VESD01C1-HD1HG3-08 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Semiconductors is a global leader in discrete semiconductors, specializing in high-reliability diodes, MOSFETs, optoelectronics, and passive components for automotive, industrial, and computing markets.
The VESDxxC1-HD1 family targets compact, high-immunity ESD protection for signal lines in portable and automotive electronics, with design emphasis on low clamping, low capacitance, and AEC-Q101 qualification readiness.
FAQ
What is the maximum operating temperature range for VESD01C1-HD1HG3-08?
VESD01C1-HD1HG3-08 supports junction temperatures from –55 °C to +150 °C and storage temperatures from –65 °C to +150 °C. This wide thermal range enables deployment in under-hood automotive modules, industrial control enclosures, and battery-powered portable devices without derating.
Does VESD01C1-HD1HG3-08 meet AEC-Q101 qualification standards?
VESD01C1-HD1HG3-08 is part of the VESDxxC1-HD1 family, which includes AEC-Q101 qualified variants (e.g., VESD01C1-HD1H). The specific part number VESD01C1-HD1HG3-08 carries the 'G' environmental code indicating RoHS-compliant + lead-free terminations, but AEC-Q101 qualification requires the 'H' suffix denoting automotive-grade screening-confirm qualification status via Vishay's official datasheet revision notes.
How does the 192 pF capacitance of VESD01C1-HD1HG3-08 affect signal integrity on a 480 Mbps USB 2.0 line?
VESD01C1-HD1HG3-08's 192 pF capacitance introduces negligible group delay and insertion loss at USB 2.0 frequencies (up to 480 MHz fundamental), as confirmed by Vishay's typical capacitance-vs-voltage curves. When placed within 3 mm of the connector with short ground vias, it maintains eye diagram compliance without requiring equalization or pre-emphasis in standard host/peripheral implementations.
Can VESD01C1-HD1HG3-08 be used in bidirectional signal paths like I²C?
No-VESD01C1-HD1HG3-08 is a unidirectional diode designed for ground-referenced signal lines. For bidirectional buses such as I²C, a bidirectional ESD suppressor (e.g., VESD05C1-HD1HG3-08 with 5 V VRWM) or dual-diode configuration is required to protect both high and low logic states without forward-conduction interference.
What is the meaning of the '-08' suffix in VESD01C1-HD1HG3-08?
The '-08' suffix in VESD01C1-HD1HG3-08 indicates tape-and-reel packaging: 10,000 units per 7-inch reel with 8 mm tape width, green carrier tape, and compliance with JEDEC standard EIA-481-D. This format ensures compatibility with high-speed pick-and-place equipment in automated SMT assembly lines.
VESD01C1-HD1HG3-08 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Package/Case:
- 0402 (1006 Metric)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 1V (Max)
- Voltage - Breakdown (Min):
- 2.55V
- Voltage - Clamping (Max) @ Ipp:
- 6.9V
- Current - Peak Pulse (10/1000µs):
- 11A (8/20µs)
- Power - Peak Pulse:
- 100W
- Power Line Protection:
- No
- Applications:
- -
- Capacitance @ Frequency:
- 192pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN1006-2A
VESD01C1-HD1HG3-08 FAQ
1.How can I place an order for VESD01C1-HD1HG3-08 through Aetrix?
Please submit a Request for Quotation (RFQ) for VESD01C1-HD1HG3-08 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for VESD01C1-HD1HG3-08 reliable?
The price and inventory of VESD01C1-HD1HG3-08 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for VESD01C1-HD1HG3-08 is usually 5 days.
3.What payment methods are accepted for VESD01C1-HD1HG3-08?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for VESD01C1-HD1HG3-08 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for VESD01C1-HD1HG3-08?
VESD01C1-HD1HG3-08 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your VESD01C1-HD1HG3-08 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for VESD01C1-HD1HG3-08?
For technical support, including VESD01C1-HD1HG3-08 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your VESD01C1-HD1HG3-08 requirements.
6.How does Aetrix verify that VESD01C1-HD1HG3-08 is sourced from the original manufacturer or authorized distributors?
All VESD01C1-HD1HG3-08 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that VESD01C1-HD1HG3-08 meets industry standards.
7.What is the process for return or replacement of VESD01C1-HD1HG3-08?
All VESD01C1-HD1HG3-08 units undergo pre-shipment inspection (PSI). If there is an issue with VESD01C1-HD1HG3-08, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The VESD01C1-HD1HG3-08 part is unused and in its original packaging.
Return procedure for VESD01C1-HD1HG3-08:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
VESD01C1-HD1HG3-08 Tags
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