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Vishay General Semiconductor - Diodes Division VESD05A8A-HNH-GS08

Part No.:
VESD05A8A-HNH-GS08
Manufacturer:
Vishay General Semiconductor - Diodes Division
Category:
TVS Diodes
Package:
8-UFDFN Exposed Pad
Datasheet:
AetrixVESD05A8A-HNH-GS08.pdf
Description:
TVS DIODE 5VWM 13VC LLP1713-9L
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:17,357

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Product details

Overview

VESD05A8A-HNH-GS08 from Vishay Semiconductors is an 8-line bidirectional asymmetrical ESD protection diode array in LLP1713-9L package, rated for 5 V working voltage (VRWM), 30 pF typical capacitance at 0 V, ±25 kV IEC 61000-4-2 contact ESD immunity, and 13 V reverse clamping voltage at 5 A surge. It protects high-speed data lines such as USB 2.0, HDMI, and SD card interfaces.

For engineers reviewing the VESD05A8A-HNH-GS08 datasheet, VESD05A8A-HNH-GS08 pinout, VESD05A8A-HNH-GS08 application, or VESD05A8A-HNH-GS08 equivalent, key selection criteria include low 0.6 mm profile for space-constrained PCBs, sub-1 μA leakage at 5 V, dual-mode operation (BiAs/BiSy), and validated IEC 61000-4-5 surge handling up to 5 A per line.

Technical Context

The VESD05A8A-HNH-GS08 implements two distinct protection configurations: BiAs-mode uses pin 9 as common ground for eight independent signal-to-ground paths (pins 1–8 → pin 9), delivering asymmetrical clamping (4.5 V forward / 13 V reverse). BiSy-mode repurposes pin 5 as ground and leaves pin 9 unconnected, enabling seven symmetrical bidirectional paths between any two of pins 1–8, with matched ±13 V clamping and reduced 15 pF capacitance at 0 V.

Its LLP1713-9L package features e4-compliant precious-metal terminations, MSL level 1 moisture sensitivity, and UL 94 V-0 molding compound - optimized for reflow compatibility and reliability in consumer and industrial portable electronics where board space and ESD robustness are critical.

Key Specifications

Parameter Value and Actual Design Meaning
Working Voltage (VRWM) 5 V - defines maximum continuous DC voltage on protected lines without leakage degradation
Reverse Clamping Voltage (VC) 13 V at 5 A (IEC 61000-4-5) - limits transient voltage seen by downstream ICs during surge events
Capacitance (CD) 30 pF at 0 V, 18 pF at 2.5 V - ensures minimal signal distortion on USB 2.0 and SDIO interfaces
ESD Immunity ±25 kV contact / ±30 kV air (IEC 61000-4-2) - exceeds Level 4 system-level ESD requirements
Leakage Current (IR) < 0.1 μA at 5 V - prevents battery drain in always-on portable device rails
Package LLP1713-9L - 1.75 × 1.3 mm footprint, 0.6 mm max height, compatible with 0.4 mm pitch routing

Pinout & Package

LLP1713-9L is a 9-terminal leadless plastic package with exposed thermal pad (DAP), 0.4 mm pitch, and pin 1 marked by dot. Pin 9 serves as common cathode in BiAs-mode; pin 5 acts as ground reference in BiSy-mode. The package supports solder reflow per J-STD-020 MSL level 1 (peak 260 °C).

Pin/Terminal Circuit Role Design Meaning
1–8 Signal input / protected line Each connects to one data line (e.g., USB D+, D−, SDIO CLK, CMD); configured as anode in BiAs-mode
9 Common cathode (BiAs-mode) Ground return path for all eight protection diodes; must be connected to system ground
5 Ground reference (BiSy-mode) Used instead of pin 9 when operating in 7-line symmetrical mode; pin 9 left floating
DAP (exposed pad) Thermal and electrical ground Enhances heat dissipation during surge events and improves grounding integrity when soldered

Key Features

Feature Design Value
Ultra-low profile 0.6 mm max height - enables integration beneath connectors and in ultra-thin mobile designs
Dual-mode operation Configurable as 8-line BiAs or 7-line BiSy - supports both asymmetric logic-level and symmetric analog/data-line protection
Precious-metal terminations (e4) Au/NiPdAu finish - ensures reliable solderability and intermetallic stability over thermal cycling
Low dynamic capacitance 15–30 pF range - preserves signal integrity on 480 Mbps USB 2.0 and 25 MHz SDIO buses
High surge robustness 65 W peak pulse power (BiAs) - withstands repeated 8/20 µs transients without parameter shift

Applications

USB 2.0 Interface Protection HDMI DDC Channel Protection

Use Scenario: Protecting USB 2.0 D+ and D− lines against ESD events during cable insertion in smartphones and tablets.

IC Role / Device Role / Timing Role: Asymmetrical bidirectional clamp limiting transient voltage to ≤13 V while maintaining <30 pF loading.

Use Value: Prevents latch-up or damage to USB PHY transceivers without degrading 480 Mbps eye diagram integrity.

Use Scenario: Safeguarding HDMI DDC SDA/SCL lines from user-handling ESD in monitors and set-top boxes.

IC Role / Device Role / Timing Role: Low-leakage (≤0.1 μA) ESD shunt that avoids pull-up resistor loading and I²C timing violations.

Use Value: Maintains DDC communication reliability across temperature (-40°C to +125°C) with no bus contention.

SD Card Interface Protection Industrial Sensor Bus Protection

Use Scenario: Shielding SDIO command, clock, and data lines in embedded cameras and IoT edge devices.

IC Role / Device Role / Timing Role: 8-channel array covering all six SDIO signals plus two auxiliary lines in single LLP footprint.

Use Value: Eliminates need for eight discrete diodes, reducing layout area by >60% versus SOT-23 solutions.

Use Scenario: Hardening RS-485 or CAN FD transceiver I/O pins against field-induced ESD in factory automation nodes.

IC Role / Device Role / Timing Role: Bidirectional clamp with ±12 kV BiSy-mode ESD rating and 13 V clamping for robust bus resilience.

Use Value: Enables uninterrupted sensor data transmission during maintenance hot-plug operations near motor drives.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPD8S300ARGER 8-channel, 5.5 V VRWM, 12 pF @ 0 V, ±15 kV contact ESD, QFN-16 package (2.5 × 2.5 mm) Lower capacitance but larger footprint and lower ESD rating; requires more PCB area Prefer when ultra-low capacitance (<15 pF) is prioritized over board space and ESD margin
ESDALC6V1-1U2 8-channel, 5.5 V VRWM, 20 pF @ 0 V, ±20 kV contact ESD, SOT-1202 (1.7 × 1.3 mm) Same footprint size but lower ESD rating and higher leakage (≤1 μA vs. ≤0.1 μA) Choose when cost sensitivity outweighs need for highest ESD immunity and lowest leakage

Compared with TPD8S300ARGER and ESDALC6V1-1U2, the VESD05A8A-HNH-GS08 delivers superior ESD margin (±25 kV), tighter leakage control (<0.1 μA), and identical 1.75 × 1.3 mm footprint - making it optimal for compact, high-reliability portable designs demanding full IEC 61000-4-2 Level 4 compliance.

Availability

VESD05A8A-HNH-GS08 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI DDC channel hardening, and SD card interface safeguarding requiring stable component supply across production ramps.

Supply support for VESD05A8A-HNH-GS08 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Semiconductors is a global leader in discrete semiconductors, specializing in high-reliability diodes, MOSFETs, optoelectronics, and protection devices for automotive, industrial, and computing markets.

The VESD05A8A-HNH-GS08 belongs to Vishay's ultra-compact ESD protection array family, engineered specifically for high-density portable electronics where board space, ESD robustness, and signal fidelity are co-constrained design priorities.

FAQ

What is the maximum operating temperature range for the VESD05A8A-HNH-GS08?

The VESD05A8A-HNH-GS08 has a junction temperature range of -40 °C to +125 °C and a storage temperature range of -55 °C to +150 °C. This wide thermal envelope allows deployment in automotive infotainment modules, industrial gateways, and outdoor IoT sensors where ambient conditions exceed standard commercial limits. The LLP1713-9L package's thermal pad enhances heat transfer under sustained surge conditions.

Can the VESD05A8A-HNH-GS08 be used in BiSy-mode for 7-line protection, and what are the pin connections?

Yes, the VESD05A8A-HNH-GS08 supports BiSy-mode for 7-line symmetrical protection: connect pins 1, 2, 3, 4, 6, 7, and 8 to protected signal lines; tie pin 5 to system ground; and leave pin 9 unconnected. In this configuration, each pair of signal pins forms a bidirectional path with matched ±13 V clamping and 15 pF capacitance - ideal for differential buses like RS-485 or MIPI D-PHY lanes.

What is the clamping voltage of the VESD05A8A-HNH-GS08 under IEC 61000-4-5 surge conditions?

The VESD05A8A-HNH-GS08 delivers a reverse clamping voltage (VC) of 13 V at 5 A (8/20 µs waveform) in BiAs-mode and 13 V at 2.5 A in BiSy-mode. Forward clamping is 4.5 V at 5 A. These values are measured per IEC 61000-4-5 and ensure downstream ICs see transient voltages well below their absolute maximum ratings - critical for protecting 3.3 V or 5 V logic interfaces.

Does the VESD05A8A-HNH-GS08 require external biasing or control signals to operate?

No, the VESD05A8A-HNH-GS08 is a passive silicon diode array requiring no external power, bias, or enable signals. It operates purely on voltage threshold behavior: conducting only during overvoltage transients (≥VBR ≈ 6–8 V) while presenting <0.1 μA leakage at normal operating voltage (≤5 V). This zero-bias operation simplifies design and eliminates quiescent current concerns in battery-powered systems.

How does the LLP1713-9L package of the VESD05A8A-HNH-GS08 compare to standard SOT-23 or SC-70 packages in terms of PCB layout?

The LLP1713-9L package of the VESD05A8A-HNH-GS08 measures 1.75 × 1.3 mm with 0.4 mm pin pitch and includes an exposed thermal pad - offering ~40% smaller footprint than SOT-23-8 and ~30% less area than SC-70-8. Its land pattern requires no via-in-pad and supports standard stencil printing; the DAP improves thermal performance without complicating assembly. This makes VESD05A8A-HNH-GS08 ideal for dense, fine-pitch layouts in smartphones and wearables.

VESD05A8A-HNH-GS08 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay General Semiconductor - Diodes Division
Package/Case:
8-UFDFN Exposed Pad
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
8
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
5V (Max)
Voltage - Breakdown (Min):
6V
Voltage - Clamping (Max) @ Ipp:
13V
Current - Peak Pulse (10/1000µs):
5A (8/20µs)
Power - Peak Pulse:
65W
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
30pF @ 1MHz
Operating Temperature:
-40°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
LLP1713-9L

VESD05A8A-HNH-GS08 FAQ

1.How can I place an order for VESD05A8A-HNH-GS08 through Aetrix?

Please submit a Request for Quotation (RFQ) for VESD05A8A-HNH-GS08 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for VESD05A8A-HNH-GS08 reliable?

The price and inventory of VESD05A8A-HNH-GS08 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for VESD05A8A-HNH-GS08 is usually 5 days.

3.What payment methods are accepted for VESD05A8A-HNH-GS08?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for VESD05A8A-HNH-GS08 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for VESD05A8A-HNH-GS08?

VESD05A8A-HNH-GS08 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your VESD05A8A-HNH-GS08 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for VESD05A8A-HNH-GS08?

For technical support, including VESD05A8A-HNH-GS08 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your VESD05A8A-HNH-GS08 requirements.

6.How does Aetrix verify that VESD05A8A-HNH-GS08 is sourced from the original manufacturer or authorized distributors?

All VESD05A8A-HNH-GS08 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that VESD05A8A-HNH-GS08 meets industry standards.

7.What is the process for return or replacement of VESD05A8A-HNH-GS08?

All VESD05A8A-HNH-GS08 units undergo pre-shipment inspection (PSI). If there is an issue with VESD05A8A-HNH-GS08, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The VESD05A8A-HNH-GS08 part is unused and in its original packaging.

Return procedure for VESD05A8A-HNH-GS08:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

VESD05A8A-HNH-GS08 Tags

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