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Vishay General Semiconductor - Diodes Division VESD05C-FC1-GS08
- Part No.:
- VESD05C-FC1-GS08
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- TVS Diodes
- Package:
- 4-UFBGA, FCBGA
- Datasheet:
-
VESD05C-FC1-GS08.pdf
- Description:
- TVS DIODE 5VWM 12VC 1005 FLIPCHP
- Quantity:
- Payment:
- Shipping:
Inventory:9,147
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Product details
Overview
VESD05C-FC1-GS08 from Vishay Semiconductors is a flip-chip ESD protection diode in 0402 (1005 metric) package, featuring 5 V reverse stand-off voltage, 9 V breakdown voltage, 12 V clamping voltage at 10 A, 75 pF capacitance at 0 V, and 20 µA leakage at rated voltage - deployed for high-frequency signal line protection in portable consumer electronics.
For engineers reviewing the VESD05C-FC1-GS08 datasheet, VESD05C-FC1-GS08 pinout, VESD05C-FC1-GS08 application, or VESD05C-FC1-GS08 equivalent, key selection criteria include IEC 61000-4-2 ±30 kV air/±8 kV contact ESD rating, low 0.5 mm² PCB footprint, lead-free SnAgCu solder bumps, and compatibility with J-STD-020 reflow profiles.
Technical Context
This device implements a monolithic silicon P/N junction optimized for transient voltage suppression on high-speed data lines. It delivers low clamping voltage (12 V @ 10 A, 8/20 µs) and low parasitic capacitance (75 pF @ 0 V, 1 MHz), enabling protection of USB 2.0, HDMI, audio, and RF interfaces without signal integrity degradation.
Designed as a surface-mount flip-chip with four solder bumps (80 µm height), the VESD05C-FC1-GS08 eliminates underfill requirements and supports standard SMT pick-and-place and reflow assembly. Its operating junction temperature range spans –55 °C to +150 °C, supporting automotive-grade reliability in compact portable systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Stand-off Voltage | 5 V - Maximum continuous working voltage before conduction begins |
| Breakdown Voltage | 6 V min - Voltage at which device enters avalanche conduction (1 mA test) |
| Clamping Voltage | 12 V max @ 10 A, 8/20 µs - Peak voltage seen by protected circuit during lightning surge |
| Capacitance | 75 pF @ 0 V, 1 MHz - Low enough for USB 2.0 (480 Mbps) and audio line protection |
| ESD Rating (IEC 61000-4-2) | 30 kV air / 8 kV contact - Meets highest system-level ESD immunity requirements |
| Peak Pulse Power | 120 W @ 8/20 µs - Sustains transient energy from IEC 61000-4-5 surges |
| Leakage Current | 20 µA @ VRWM - Minimal loading on high-impedance signal paths |
Pinout & Package
Package: Flip Chip 1005 (EIA 0402), 0.5 mm² footprint, 0.47 mg unit mass, 0.55 mm max height. Top-side interconnection via four SnAgCu solder bumps (80 µm nominal height), no bottom-side terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode bump | Transient current sink path | Connected to protected signal line; conducts ESD current to cathode during overvoltage |
| Cathode bump | Reference/ground return path | Connected to system ground plane; completes clamping loop with minimal inductance |
| Two auxiliary bumps | Mechanical anchoring & thermal relief | Provide structural stability and heat dissipation; not electrically active in normal operation |
Key Features
| Feature | Design Value |
|---|---|
| Flip-chip construction | Eliminates wire bonds and package leads, reducing parasitic inductance (< 0.3 nH) for superior high-frequency ESD response |
| Low capacitance (75 pF) | Preserves signal rise/fall times on 480 Mbps USB 2.0 and 24 MHz audio clock lines |
| No underfill required | Reduces assembly steps and cost; compatible with standard SMT reflow per J-STD-020 Class 3 |
| Lead-free SnAgCu bumps | Complies with RoHS 2002/95/EC and WEEE 2002/96/EC; qualified for Pb-free manufacturing |
| Ultra-compact footprint | 0.5 mm² area enables placement adjacent to connectors on space-constrained mobile PCBs |
Applications
| USB 2.0 Data Lines | Audio Line Inputs |
|---|---|
Use Scenario: Protection of D+ and D– pins on smartphone USB ports against repeated electrostatic discharge events during cable insertion. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector interface. Use Value: Clamps transients to ≤12 V while adding only 75 pF loading, preserving eye diagram integrity at 480 Mbps. | Use Scenario: Shielding analog audio inputs (e.g., 3.5 mm jack) in Bluetooth headsets from user-hand ESD. IC Role / Device Role / Timing Role: Low-leakage (20 µA) unidirectional clamp referenced to ground. Use Value: Prevents pop/click artifacts and amplifier latch-up without degrading SNR in 20 Hz–20 kHz band. |
| HDMI TMDS Channels | GPS RF Front-End |
Use Scenario: ESD hardening of HDMI source outputs in digital TVs and set-top boxes. IC Role / Device Role / Timing Role: High-speed bidirectional protector on differential TMDS pairs (clock/data). Use Value: 75 pF capacitance avoids skew between +/− lines; 12 V clamping prevents receiver IC damage. | Use Scenario: Protecting GPS antenna feedline input on wearable navigation modules. IC Role / Device Role / Timing Role: Low-capacitance shunt clamp between RF trace and ground. Use Value: Maintains impedance match (50 Ω) and noise figure; withstands >30 kV air-gap ESD per IEC 61000-4-2. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD5Z5.0T1G | Higher capacitance (100 pF), same 5 V VRWM, slightly higher clamping (13.5 V @ 10 A) | Less suitable for USB 2.0; acceptable for lower-speed audio or power rails | Prefer VESD05C-FC1-GS08 where <80 pF is mandatory for signal integrity |
| TPD2E001DRYR | Dual-channel array, 12 pF typical capacitance, 5.5 V VRWM, 11 V clamping, SOT-553 package | Requires larger PCB area; better for multi-line protection but not flip-chip assembly | Choose VESD05C-FC1-GS08 when ultra-small footprint and flip-chip process compatibility are critical |
Compared with ESD5Z5.0T1G and TPD2E001DRYR, the VESD05C-FC1-GS08 uniquely combines 0402 flip-chip form factor, 75 pF capacitance, and 30 kV air-discharge rating - making it optimal for miniaturized, high-speed portable designs requiring zero-layout overhead and J-STD-020-compliant assembly.
Availability
VESD05C-FC1-GS08 is available at Aetrix Electronics and suitable for cellular phones, Bluetooth headsets, and GPS modules requiring stable component supply with full RoHS compliance and traceable sourcing.
Supply support for VESD05C-FC1-GS08 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Semiconductors is a global leader in discrete semiconductors, specializing in high-reliability diodes, MOSFETs, optoelectronics, and passive components for industrial, automotive, and consumer markets.
The VESD05C-FC1-GS08 belongs to Vishay's Flip Chip ESD Protection Diode product line, engineered specifically for ultra-compact, high-frequency board-level ESD hardening in space-constrained portable electronics.
FAQ
What is the maximum clamping voltage of the VESD05C-FC1-GS08 during an 8/20 µs surge?
The VESD05C-FC1-GS08 has a maximum clamping voltage of 12 V when subjected to a 10 A peak pulse current with an 8/20 µs waveform. This value is measured per IEC 61000-4-5 and ensures downstream ICs remain within safe operating limits during lightning-induced transients. The VESD05C-FC1-GS08 maintains this performance across its full operating temperature range of –55 °C to +150 °C.
Does the VESD05C-FC1-GS08 require underfill material during assembly?
No, the VESD05C-FC1-GS08 does not require underfill material. Its flip-chip structure uses four solder bumps for mechanical and electrical connection, eliminating wire bonds and package leads. This design allows direct mounting onto PCB pads using standard SMT reflow processes per J-STD-020, reducing process complexity and cost versus traditional packaged ESD diodes.
What is the capacitance of the VESD05C-FC1-GS08 and how does it affect high-speed signal lines?
The VESD05C-FC1-GS08 exhibits 75 pF capacitance at 0 V and 1 MHz. This low value minimizes signal distortion on high-speed interfaces such as USB 2.0 (480 Mbps) and HDMI TMDS channels. Unlike higher-capacitance alternatives, the VESD05C-FC1-GS08 preserves edge rates and eye opening, making it suitable for placement directly at connectors without equalization compensation.
Is the VESD05C-FC1-GS08 compliant with RoHS and lead-free assembly standards?
Yes, the VESD05C-FC1-GS08 is fully RoHS-compliant per Directive 2002/95/EC and WEEE 2002/96/EC. It uses lead-free SnAgCu solder bumps and meets J-STD-020 moisture sensitivity and reflow profile requirements. The VESD05C-FC1-GS08 is rated for peak soldering temperatures up to 260 °C for 10 seconds, ensuring robustness in Pb-free manufacturing environments.
How does the VESD05C-FC1-GS08 compare to standard SOD-323 or SOT-23 ESD diodes in terms of PCB space?
The VESD05C-FC1-GS08 occupies only 0.5 mm² (0402 size), significantly less than SOD-323 (~2.8 mm²) or SOT-23 (~6.5 mm²) packages. Its flip-chip architecture eliminates leads and substrate, enabling placement directly adjacent to high-density connectors in smartphones and wearables. This saves routing space and reduces parasitic inductance compared to leaded alternatives.
VESD05C-FC1-GS08 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Package/Case:
- 4-UFBGA, FCBGA
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 12V
- Current - Peak Pulse (10/1000µs):
- 10A (8/20µs)
- Power - Peak Pulse:
- 120W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 75pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1005 FlipChip
VESD05C-FC1-GS08 FAQ
1.How can I place an order for VESD05C-FC1-GS08 through Aetrix?
Please submit a Request for Quotation (RFQ) for VESD05C-FC1-GS08 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for VESD05C-FC1-GS08 reliable?
The price and inventory of VESD05C-FC1-GS08 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for VESD05C-FC1-GS08 is usually 5 days.
3.What payment methods are accepted for VESD05C-FC1-GS08?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for VESD05C-FC1-GS08 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for VESD05C-FC1-GS08?
VESD05C-FC1-GS08 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your VESD05C-FC1-GS08 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for VESD05C-FC1-GS08?
For technical support, including VESD05C-FC1-GS08 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your VESD05C-FC1-GS08 requirements.
6.How does Aetrix verify that VESD05C-FC1-GS08 is sourced from the original manufacturer or authorized distributors?
All VESD05C-FC1-GS08 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that VESD05C-FC1-GS08 meets industry standards.
7.What is the process for return or replacement of VESD05C-FC1-GS08?
All VESD05C-FC1-GS08 units undergo pre-shipment inspection (PSI). If there is an issue with VESD05C-FC1-GS08, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The VESD05C-FC1-GS08 part is unused and in its original packaging.
Return procedure for VESD05C-FC1-GS08:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
VESD05C-FC1-GS08 Tags
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ESD9B5.0ST5G
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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