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Vishay General Semiconductor - Diodes Division VLIN2626-02G-E3-08
- Part No.:
- VLIN2626-02G-E3-08
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- TVS Diodes
- Package:
- SC-76, SOD-323
- Datasheet:
-
VLIN2626-02G-E3-08.pdf
- Description:
- TVS DIODE 26.5VWM 50VC SOD323
- Quantity:
- Payment:
- Shipping:
Inventory:10,966
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Product details
Overview
VLIN2626-02G-E3-08 from Vishay Semiconductors is a single-line, low-capacitance ESD-protection diode optimized for LIN-Bus communication systems, featuring a reverse stand-off voltage of 26.5 V, clamping voltage ≤40 V at 1 A, leakage current < 0.05 μA, and load capacitance < 16 pF. It provides ±30 kV IEC 61000-4-2 contact/air discharge protection in automotive-grade SOD-323 packaging.
For engineers reviewing the VLIN2626-02G-E3-08 datasheet, VLIN2626-02G-E3-08 pinout, VLIN2626-02G-E3-08 application, or VLIN2626-02G-E3-08 equivalent, key selection criteria include LIN-Bus voltage tolerance (±26.5 V), ultra-low capacitance (<16 pF) for signal integrity, AEC-Q101 qualification, and SOD-323 footprint compatibility with high-density PCB layouts.
Technical Context
This device is a unidirectional transient voltage suppression (TVS) diode configured as a single-channel ESD clamp for LIN physical layer interfaces. Its circuit role is line-level protection between LIN transceiver I/O and external wiring harnesses, operating within ±26.5 V working range while maintaining sub-16 pF capacitance to avoid signal distortion on 19.2–20 kbaud bus signals.
The diode exhibits a typical breakdown voltage of 30 V (min 28 V, max 32 V) and clamps to ≤50 V under 4 A 8/20 μs surge per IEC 61000-4-5. It meets AEC-Q101 Class H3B (>8 kV HBM) and supports reflow soldering up to 260 °C peak temperature with MSL Level 1 moisture sensitivity rating.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Protection lines | 1-line configuration - protects single LIN data line without cross-coupling or channel interaction |
| Reverse stand-off voltage | 26.5 V - defines maximum continuous DC voltage the line can tolerate before conduction begins |
| Clamping voltage (1 A) | ≤40 V - limits voltage seen by downstream LIN transceiver during ESD event, preserving IC reliability |
| Capacitance (0 V, 1 MHz) | 13.5–16 pF - ensures minimal signal rise-time degradation on LIN's 19.2–20 kbaud data rate |
| Leakage current (26.5 V) | <0.05 μA - avoids measurable DC loading on LIN bias network or wake-up detection circuitry |
| ESD immunity | ±30 kV contact/air (IEC 61000-4-2) - exceeds automotive OEM requirements for connector-level ESD robustness |
| AEC-Q101 qualification | H3B class (>8 kV HBM) - validated for under-hood and body-control module deployment in passenger vehicles |
Pinout & Package
SOD-323 surface-mount package: 2-pin, cathode-bar marked, 1.95 mm × 1.25 mm footprint, 0.9 mm height, MSL Level 1, lead (Pb)-free tin (Sn) plating (e3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Anode) | Input line connection | Connected to LIN bus trace; carries protected signal toward transceiver |
| 2 (Cathode) | Ground reference / clamp path | Connected to local chassis or system ground; sinks ESD current during overvoltage events |
Key Features
| Feature | Design Value |
|---|---|
| LIN-Bus optimized voltage rating | 26.5 V reverse stand-off matches LIN specification nominal 12 V supply + transients, avoiding false triggering |
| Ultra-low capacitance | 13.5–16 pF enables full-speed LIN operation without bit error rate increase or timing jitter |
| AEC-Q101 qualified | H3B-class ESD robustness (>8 kV HBM) ensures reliability in automotive control units across temperature (-55 to +150 °C) |
| e3 tin termination | RoHS-compliant Sn plating ensures solderability and intermetallic stability in lead-free reflow processes |
| Single-shot 200 W surge capability | Withstands IEC 61000-4-5 8/20 μs surges up to 4 A - sufficient for ISO 7637-3 coupled transients in vehicle networks |
Applications
| Body Control Module (BCM) | Door Module |
|---|---|
|
Use Scenario: LIN communication between BCM and door latch, window lift, or mirror position sensors. IC Role / Device Role / Timing Role: Line-level ESD clamp on LIN data line, placed between connector and transceiver input. Use Value: Prevents latch-up or damage to LIN transceiver IC during door harness mating/unmating or static discharge events. |
Use Scenario: LIN interface in smart door modules controlling power windows, locks, and puddle lamps. IC Role / Device Role / Timing Role: Bidirectional ESD protection element on LIN bus segment exposed to mechanical stress and environmental contaminants. Use Value: Maintains <16 pF capacitance to preserve 20 kbaud signal edge integrity while surviving >30 kV contact discharge per ISO 10605. |
| Roof Module | Seat Control Unit |
|
Use Scenario: LIN-linked sunroof actuator and ambient light sensor in overhead console. IC Role / Device Role / Timing Role: Single-point protection at roof harness entry point, minimizing board space in constrained overhead cavity. Use Value: SOD-323 footprint allows placement directly at connector, reducing stub length and preserving signal fidelity on long LIN runs. |
Use Scenario: LIN communication between seat ECU and position/motor feedback sensors. IC Role / Device Role / Timing Role: Transient suppressor on LIN differential pair (single-wire implementation), referenced to local seat-frame ground. Use Value: Low leakage (<0.05 μA) prevents interference with seat position sensor biasing and wake-on-LIN functionality. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD-protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STUSB4710QTR | Integrated USB-C port protection IC with integrated switch; higher capacitance (25 pF), not LIN-optimized | Designed for USB 2.0/3.2 data lines, not automotive LIN; lacks AEC-Q101 qualification | Use only for non-automotive USB interfaces requiring integrated overvoltage + ESD protection |
| ON Semiconductor NUP2114 | Bi-directional configuration; 12 V VRWM; 22 pF capacitance; AEC-Q101 qualified | Targeted for CAN/LIN hybrid nodes or lower-voltage LIN variants; higher capacitance impacts 20 kbaud margin | Select when bi-directional clamping is required or system operates below 18 V nominal supply |
Compared with STUSB4710QTR and NUP2114, VLIN2626-02G-E3-08 delivers superior LIN-specific performance: tighter 26.5 V stand-off matching LIN spec, lowest capacitance (13.5–16 pF), and dedicated AEC-Q101 H3B validation - making it the optimal choice for production automotive LIN nodes where signal integrity and qualification compliance are mandatory.
Availability
VLIN2626-02G-E3-08 is available at Aetrix Electronics and suitable for body control modules, door modules, roof modules, and seat control units requiring stable component supply and automotive-grade ESD resilience.
Supply support for VLIN2626-02G-E3-08 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Semiconductors is a global leader in discrete semiconductors, specializing in high-reliability diodes, MOSFETs, optoelectronics, and passive components for automotive, industrial, and computing markets.
The VLIN2626-02G-E3-08 belongs to Vishay's automotive-qualified ESD protection portfolio, engineered specifically to meet stringent LIN-Bus voltage, capacitance, and qualification requirements in modern vehicle ECUs.
FAQ
What is the primary function of the VLIN2626-02G-E3-08 in a LIN-Bus system?
The VLIN2626-02G-E3-08 serves as a unidirectional ESD protection diode placed on the LIN data line to clamp transient overvoltages-such as those from electrostatic discharge or inductive switching-while maintaining signal integrity. Its 26.5 V reverse stand-off voltage aligns precisely with LIN-Bus operating margins, and its <16 pF capacitance ensures minimal impact on the 19.2–20 kbaud data rate. The VLIN2626-02G-E3-08 is rated for ±30 kV IEC 61000-4-2 discharge and qualified to AEC-Q101 H3B standards.
Is the VLIN2626-02G-E3-08 compatible with lead-free reflow soldering processes?
Yes, the VLIN2626-02G-E3-08 features e3 tin (Sn) plating and is qualified for lead-free reflow soldering with a peak temperature of up to 260 °C, compliant with J-STD-020 MSL Level 1 handling. Its SOD-323 package has been validated for standard Pb-free thermal profiles, and the molding compound meets UL 94 V-0 flammability requirements. The VLIN2626-02G-E3-08 also supports wave and hand-soldering methods per Vishay's recommended conditions.
How does the clamping behavior of VLIN2626-02G-E3-08 compare at different surge currents?
The VLIN2626-02G-E3-08 clamps to ≤40 V at 1 A (8/20 μs) and ≤50 V at its maximum rated 4 A peak pulse current, per IEC 61000-4-5. This progressive clamping ensures downstream LIN transceivers remain within safe operating voltage limits across realistic surge magnitudes. The typical clamping curve shows linear voltage rise versus current, confirming predictable protection behavior. The VLIN2626-02G-E3-08 maintains this performance across -55 °C to +150 °C junction temperature range.
Can VLIN2626-02G-E3-08 be used in bi-directional LIN configurations?
No, the VLIN2626-02G-E3-08 is a unidirectional diode designed for standard LIN-Bus topologies where the data line is referenced to ground and operates with positive-going transients. It is not suitable for true bi-directional or floating-bus implementations. For applications requiring symmetrical clamping (e.g., certain LIN variants with differential referencing), a bi-directional alternative such as the NUP2114 must be evaluated. The VLIN2626-02G-E3-08's cathode-bar marking and anode-to-ground orientation confirm its unidirectional architecture.
What is the moisture sensitivity level (MSL) rating for VLIN2626-02G-E3-08?
The VLIN2626-02G-E3-08 carries an MSL Level 1 rating per J-STD-020, meaning it is not moisture-sensitive and may be stored indefinitely at ambient conditions without baking prior to assembly. This eliminates handling constraints common with higher-MSL components and simplifies manufacturing logistics. The SOD-323 package uses UL 94 V-0 compliant molding compound, and the VLIN2626-02G-E3-08's 4 mg unit weight reflects its compact, robust construction for automotive environments.
VLIN2626-02G-E3-08 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Package/Case:
- SC-76, SOD-323
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 26.5V (Max)
- Voltage - Breakdown (Min):
- 28V
- Voltage - Clamping (Max) @ Ipp:
- 50V
- Current - Peak Pulse (10/1000µs):
- 4A (8/20µs)
- Power - Peak Pulse:
- 200W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 13.5pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOD-323
VLIN2626-02G-E3-08 FAQ
1.How can I place an order for VLIN2626-02G-E3-08 through Aetrix?
Please submit a Request for Quotation (RFQ) for VLIN2626-02G-E3-08 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for VLIN2626-02G-E3-08 reliable?
The price and inventory of VLIN2626-02G-E3-08 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for VLIN2626-02G-E3-08 is usually 5 days.
3.What payment methods are accepted for VLIN2626-02G-E3-08?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for VLIN2626-02G-E3-08 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for VLIN2626-02G-E3-08?
VLIN2626-02G-E3-08 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your VLIN2626-02G-E3-08 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for VLIN2626-02G-E3-08?
For technical support, including VLIN2626-02G-E3-08 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your VLIN2626-02G-E3-08 requirements.
6.How does Aetrix verify that VLIN2626-02G-E3-08 is sourced from the original manufacturer or authorized distributors?
All VLIN2626-02G-E3-08 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that VLIN2626-02G-E3-08 meets industry standards.
7.What is the process for return or replacement of VLIN2626-02G-E3-08?
All VLIN2626-02G-E3-08 units undergo pre-shipment inspection (PSI). If there is an issue with VLIN2626-02G-E3-08, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The VLIN2626-02G-E3-08 part is unused and in its original packaging.
Return procedure for VLIN2626-02G-E3-08:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
VLIN2626-02G-E3-08 Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
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Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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Diodes Incorporated
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