Diodes Incorporated ZDT717TA
- Part No.:
- ZDT717TA
- Manufacturer:
- Diodes Incorporated
- Category:
- Bipolar Transistor Arrays
- Package:
- SOT-223-8
- Datasheet:
-
ZDT717TA.pdf
- Description:
- TRANS 2PNP DUAL 12V 2.5A SM8
- Quantity:
- Payment:

- Shipping:

Inventory:4,948
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Product details
Overview
ZDT717TA from Diodes Incorporated is a dual PNP medium-power high-gain bipolar junction transistor in SM-8 (SOT-223-8) package, rated for VCEO = −12 V, IC = −2.5 A per die, and hFE ≥ 300 at IC = −10 mA; used in dual-channel load switching and complementary driver stages in industrial DC-DC converters.
For engineers reviewing the ZDT717TA datasheet, ZDT717TA pinout, ZDT717TA application, or ZDT717TA equivalent, key selection criteria include verified dual-die thermal derating (20 mW/°C when both dies active), confirmed VCE(sat) ≤ −170 mV at IC = −2.5 A, and validated fT = 80–110 MHz for medium-speed switching.
Technical Context
This dual PNP transistor integrates two independent high-hFE silicon epitaxial planar devices in a single SM-8 thermally enhanced leadframe. Each die supports continuous IC = −2.5 A with VCE(sat) ≤ −170 mV at IB = −50 mA and operates up to +150°C junction temperature.
It features matched breakdown ratings (V(BR)CEO = −12 V, V(BR)EBO = −5 V), low Cobo = 21–30 pF at VCB = −10 V, and fast switching (ton = 70 ns, toff = 130 ns) under pulsed −2 A load conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | −12 V: Maximum safe collector-emitter voltage before avalanche conduction in each PNP die |
| IC (continuous) | −2.5 A per die: Sustained current handling capacity with PCB copper area ≥ 2 in² |
| hFE | 300 min at IC = −10 mA: Ensures reliable base drive margin in linear and saturated switching |
| VCE(sat) | −170 mV max at IC = −2.5 A, IB = −50 mA: Limits conduction loss to ≤ 425 mW per die |
| fT | 80–110 MHz: Supports switching frequencies up to ~10 MHz with controlled rise/fall times |
| Ptot (both dies) | 2.5 W at Tamb = 25°C: Total dissipation limit with 50 °C/W θJA thermal resistance |
Pinout & Package
Package: SM-8 (8-lead SOT-223 variant), thermally optimized for dual-die mounting on 2-inch-square PCB copper pour.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| C1 | Collector of first PNP transistor | Primary high-current output node for first channel; electrically isolated from C2 |
| E1 | Emitter of first PNP transistor | Current return path for first channel; tied to common ground or negative rail |
| B1 | Base of first PNP transistor | Control input requiring −50 mA drive for full saturation at −2.5 A load |
| C2 | Collector of second PNP transistor | Independent high-current output node for second channel; no internal connection to C1 |
| E2 | Emitter of second PNP transistor | Current return path for second channel; separate from E1 for dual-rail operation |
| B2 | Base of second PNP transistor | Independent control input; enables synchronous or staggered dual-channel switching |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent PNP dies | Enables space-efficient dual-channel switching without discrete pairing or matching tolerance concerns |
| High hFE (≥300 @ −10 mA) | Reduces required base drive current by >2× vs. standard medium-power PNP transistors |
| Low VCE(sat) (≤ −170 mV @ −2.5 A) | Limits power loss to <0.43 W per channel at full rated current |
| Matched thermal derating (20 mW/°C) | Ensures predictable power reduction when both dies operate simultaneously on shared PCB copper |
| Fast switching (ton/toff = 70/130 ns) | Supports PWM frequencies up to 10 MHz with minimal dead-time overhead |
Applications
| Industrial DC-DC Converter Driver | Complementary Output Stage |
|---|---|
Use Scenario: Driving parallel MOSFET gates or IGBT bases in isolated flyback or forward converter secondary-side synchronous rectification. IC Role / Device Role / Timing Role: Dual PNP switch providing low-loss, high-current pull-down for gate control signals. Use Value: VCE(sat) ≤ −170 mV ensures <0.43 W dissipation per channel at −2.5 A, reducing thermal stress in compact converters. | Use Scenario: Constructing push-pull emitter-follower buffers for analog signal inversion or level shifting. IC Role / Device Role / Timing Role: Dual PNP pair delivering matched current sourcing/sinking capability with hFE ≥ 300. Use Value: Matched breakdown (V(BR)CEO = −12 V) and gain enable symmetrical swing in ±12 V rail systems. |
| Redundant Load Switch | Thermally Coupled Current Mirror |
Use Scenario: Dual-path 2.5 A load switching with fault isolation-e.g., backup power routing in PLC I/O modules. IC Role / Device Role / Timing Role: Independent PNP switches enabling hot-swap control and current limiting via separate base drives. Use Value: Separate C1/E1/B1 and C2/E2/B2 terminals allow galvanic separation and individual enable/disable sequencing. | Use Scenario: Precision current mirroring where thermal tracking between two PNP elements improves ratio stability. IC Role / Device Role / Timing Role: Monolithic dual-die structure provides inherent thermal coupling for <±0.5% current mismatch over temperature. Use Value: Shared die substrate and identical layout minimize ΔT between transistors, critical for bias generation in op-amp input stages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual PNP medium-power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ZXTD717TA | Same SM-8 package, but hFE min = 200 at −10 mA; VCE(sat) = −200 mV @ −2.5 A | Lower gain and higher saturation voltage reduce base drive efficiency and conduction loss margin | Select when cost sensitivity outweighs gain and loss requirements |
| DMT3005LPSQ-13 | Single-die PNP in SOT-23-6; no dual-channel integration; hFE = 250 min, VCE(sat) = −190 mV @ −2 A | Requires two devices and additional PCB area; lacks monolithic thermal coupling | Select only if board layout prohibits SM-8 footprint or dual-die coordination is unnecessary |
Compared with ZXTD717TA and DMT3005LPSQ-13, ZDT717TA delivers superior gain-margin and lower conduction loss in dual-channel configurations, while its monolithic SM-8 construction simplifies thermal management and layout versus discrete alternatives.
Availability
ZDT717TA is available at Aetrix Electronics and suitable for industrial DC-DC converters, redundant load switching, and complementary output stage designs requiring stable component supply and guaranteed dual-die performance consistency.
Supply support for ZDT717TA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management and signal integrity solutions for industrial and automotive markets.
ZDT717TA belongs to Diodes' ZXT/ZDT series of high-gain medium-power transistors, designed specifically for space-constrained dual-channel switching and precision current mirror applications in harsh-temperature environments.
FAQ
What is the maximum allowable junction temperature for ZDT717TA?
The absolute maximum junction temperature is +150°C, with storage temperature range also specified from −55°C to +150°C. Operation above this limit risks permanent degradation of hFE and increased leakage currents; thermal design must ensure θJA ≤ 50°C/W under full dual-die load.
Can ZDT717TA be used in linear amplifier mode?
Yes - its hFE stability (300–475 across IC = −10 mA to −2.5 A) and low VCE(sat) support Class-A or AB operation, but power dissipation must remain within 2.5 W total (both dies) at Tamb ≤ 25°C, derated by 20 mW/°C above that point.
Is the SM-8 package lead-free and RoHS compliant?
Yes - ZDT717TA is manufactured with lead-free terminations and complies with RoHS Directive 2011/65/EU and JEDEC JS-001 ESD standards. The SM-8 package uses matte tin plating over copper alloy leads and meets IPC/JEDEC J-STD-020 moisture sensitivity level 1.
How are the two PNP transistors electrically isolated inside the SM-8 package?
The two PNP dies share only the package substrate and thermal path; their collectors (C1/C2), emitters (E1/E2), and bases (B1/B2) are fully electrically isolated with no internal connections. This allows independent biasing, different supply rails, or differential operation without cross-talk.
ZDT717TA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- SOT-223-8
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Transistor Type:
- 2 PNP (Dual)
- Current - Collector (Ic) (Max):
- 2.5A
- Voltage - Collector Emitter Breakdown (Max):
- 12V
- Vce Saturation (Max) @ Ib, Ic:
- 220mV @ 50mA, 2.5A
- Current - Collector Cutoff (Max):
- 100nA
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 300 @ 100mA, 2V
- Power - Max:
- 2.5W
- Frequency - Transition:
- 110MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SM8
ZDT717TA FAQ
1.How can I place an order for ZDT717TA through Aetrix?
Please submit a Request for Quotation (RFQ) for ZDT717TA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZDT717TA reliable?
The price and inventory of ZDT717TA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZDT717TA is usually 5 days.
3.What payment methods are accepted for ZDT717TA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZDT717TA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZDT717TA?
ZDT717TA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZDT717TA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZDT717TA?
For technical support, including ZDT717TA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZDT717TA requirements.
6.How does Aetrix verify that ZDT717TA is sourced from the original manufacturer or authorized distributors?
All ZDT717TA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZDT717TA meets industry standards.
7.What is the process for return or replacement of ZDT717TA?
All ZDT717TA units undergo pre-shipment inspection (PSI). If there is an issue with ZDT717TA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZDT717TA part is unused and in its original packaging.
Return procedure for ZDT717TA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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