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Microchip Technology ZL70571UDJ

Part No.:
ZL70571UDJ
Manufacturer:
Microchip Technology
Category:
Surge Suppression Ics
Package:
Die
Datasheet:
AetrixZL70571UDJ.pdf
Description:
IMPLANTABLE SURGE PROTECT DEVICE
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,147

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Product details

Overview

ZL70571UDJ from Microsemi is a 5-terminal, solder-bumped silicon thyristor-based medical surge protection device designed for implantable cardiac pacemakers and neurostimulators. It provides sub-150 ns turn-on, <13 V peak clamping voltage during 8 A/10 ms defibrillation surges, and ultra-low off-state leakage (<150 nA at +8.5 V), enabling direct parallel connection to protected IC pins without signal interference.

For engineers reviewing the ZL70571UDJ datasheet, ZL70571UDJ pinout, ZL70571UDJ application, or ZL70571UDJ equivalent, this page delivers verified electrical specs, substrate-connected terminal mapping (SUB1/SUB2), EN-45502/EN-50061 compliance context, and validated alternatives for high-reliability implantable electronics design.

Technical Context

ZL70571UDJ implements a five-branch self-triggering thyristor-diode architecture with two dedicated substrate terminals (SUB1, SUB2) - a functional distinction from the 6- or 7-terminal ZL70573/74/88 variants. Its dual substrate connections enable optimized current sharing and thermal path control in flip-chip mounted implants.

The device achieves rapid transient response via low-dynamic-resistance thyristor conduction (Ron ≤ 1 Ω) and exhibits guaranteed dV/dt immunity >100 V/µs at 9 V (T–T) and 8.5 V (T–SUB), ensuring robust operation against fast-rising defibrillation transients without false triggering.

Key Specifications

Parameter Value and Actual Design Meaning
Peak Surge Current 8 A (10 ms pulse per IEC/EN defibrillation test waveform)
Turn-On Delay <4 µs (measured from Vbo −2 V to 3.5 V; enables sub-150 ns effective activation)
Peak Clamping Voltage 11.5–13 V (during 4 A surge; limits stress on downstream analog/digital pacemaker ICs)
Off-State Leakage <150 nA at +8.5 V (terminal-to-terminal; preserves low-power sensor/telemetry circuit integrity)
On-State Voltage 1.0–3.0 V (terminal-to-substrate; minimizes power dissipation during surge conduction)
Parasitic Capacitance 200 pF (enables stable RF telemetry performance without signal distortion)
Operating Temperature 0°C to +55°C (validated for human torso implant environment)

Pinout & Package

Solder-bumped die in waffle tray packaging; 528 ± 25 µm thickness; flip-chip assembly with Sn/Pb 63/37 bumps. Requires underfill for mechanical reliability in implanted systems.

Pin/Terminal Circuit Role Design Meaning
T1 Transient Surge Protection Terminal 1 Primary surge path input; connects to atrial tip or ventricular tip lead in pacemaker interface
T2 Transient Surge Protection Terminal 2 Secondary surge path input; connects to atrial ring or ventricular ring lead
SUB1 Substrate Connection 1 Dedicated low-impedance substrate tie; must be electrically joined to all SUB1 bumps on PCB for uniform current distribution
T3 Transient Surge Protection Terminal 3 (Doubled Area) High-current surge path; recommended for pacemaker case connection due to enhanced current-handling capability
SUB2 Substrate Connection 2 Redundant substrate tie; improves thermal dissipation and reduces localized heating during multi-pulse surges
T4 Transient Surge Protection Terminal 4 Additional surge path; used for auxiliary electrodes or telemetry antenna feed points
T5 Transient Surge Protection Terminal 5 Fifth independent surge node; supports multi-electrode neurostimulator configurations

Key Features

Feature Design Value
EN-45502/EN-50061 Compliance Validated for 140 V/300 Ω defibrillation pulse sequences; ensures continued operation post-surge in active implantables
Ultra-Fast Turn-On <150 ns activation time prevents overshoot damage to sensitive analog front-ends in pacemaker ASICs
Dual Substrate Terminals SUB1 and SUB2 provide symmetrical current division and lower thermal resistance vs. single-substrate variants
MIL-PRF-38535 QA 100% burn-in at +125°C, lot traceability to wafer level, and LAT testing ensure zero-defect reliability for life-critical implants
Low Parasitic Capacitance 200 pF avoids degradation of RF telemetry (e.g., MICS band) and ECG sensing bandwidth

Applications

Pacemaker Lead Protection Neurostimulator Electrode Interface

Use Scenario: Dual-chamber pacemaker with atrial/ventricular tip and ring leads connected directly to protected ASIC inputs.

IC Role / Device Role / Timing Role: ZL70571UDJ acts as a parallel-connected, self-triggering voltage clamp between each lead and the implant case, limiting transient voltage before it reaches the sensing/stimulation circuitry.

Use Value: Prevents permanent latch-up or gate oxide rupture in CMOS pacemaker ICs during external defibrillation, maintaining pacing functionality per ISO 14708-2.

Use Scenario: Implantable spinal cord stimulator with eight electrode contacts requiring individual surge paths to the hermetic case.

IC Role / Device Role / Timing Role: ZL70571UDJ provides discrete, low-leakage surge suppression per electrode pair, leveraging T3's doubled-area design for highest-current case connection.

Use Value: Enables safe delivery of therapeutic stimulation pulses post-defibrillation by clamping transients below 13 V, preserving neural signal fidelity.

Implantable Cardioverter-Defibrillator (ICD) Sensing Front-End Implanted Loop Recorder Telemetry Protection

Use Scenario: ICD sensing amplifier inputs exposed to high-voltage therapy pulses and electromagnetic interference during charging cycles.

IC Role / Device Role / Timing Role: ZL70571UDJ serves as a bidirectional voltage limiter between sense electrodes and reference ground, activated only during overvoltage events.

Use Value: Maintains sub-1 µV noise floor during normal operation while suppressing >100 V transients within 150 ns - critical for accurate R-wave detection.

Use Scenario: Subcutaneous loop recorder transmitting ECG data via MICS-band (402–405 MHz) RF telemetry through a hermetically sealed titanium case.

IC Role / Device Role / Timing Role: ZL70571UDJ protects RF transceiver I/O pins from ESD and coupling-induced surges without degrading antenna impedance matching.

Use Value: 200 pF capacitance and low insertion loss preserve telemetry link margin and battery life over 3+ year implant duration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar medical surge protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
ZL70572UDJ Higher breakover voltage (17–19.5 V), same 5-terminal/SUB structure; lower dV/dt immunity (≥100 V/µs) Targeted at higher-voltage neurostimulation systems where 13 V clamping is excessive Select ZL70572UDJ when protecting circuits with ≥16 V operating rails; retains identical footprint and assembly process
ZL70573UDJ 6-terminal, no substrate terminals; 9–12 V breakover; >2300 V/µs dV/dt immunity; 50 pF capacitance Better suited for compact, non-case-grounded implants where substrate access is impractical Choose ZL70573UDJ for space-constrained devices needing minimal parasitic capacitance and maximum dV/dt rejection - requires PCB redesign for 6-pin layout

Compared with ZL70572UDJ, ZL70571UDJ offers tighter voltage clamping for low-voltage pacemaker ICs; compared with ZL70573UDJ, it trades some dV/dt immunity for superior thermal management via dual substrate ties - critical for repeated surge events in chronic implants.

Availability

ZL70571UDJ is available at Aetrix Electronics and suitable for pacemaker lead protection, neurostimulator electrode interfaces, ICD sensing front-ends, implantable loop recorder telemetry protection, and EN-45502-compliant active implantable medical device development requiring stable component supply across long production lifecycles.

Supply support for ZL70571UDJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microsemi Corporation (now part of Microchip Technology) designs high-reliability semiconductors for aerospace, defense, and life-critical medical applications, with rigorous quality standards rooted in MIL-PRF-38535.

ZL70571UDJ belongs to Microsemi's ZL7057x medical surge protection family, engineered specifically to meet EN-45502 and EN-50061 requirements for active implantable devices - prioritizing ultra-low leakage, sub-150 ns response, and full lot traceability.

FAQ

What is the primary function of ZL70571UDJ in an implantable medical device?

ZL70571UDJ functions as a self-triggering, parallel-connected transient voltage suppressor that clamps dangerous defibrillation surges (up to 8 A/10 ms) to ≤13 V, protecting sensitive pacemaker or neurostimulator ICs. Its ultra-low leakage (<150 nA) ensures no interference with low-power analog sensing or telemetry circuits during normal operation.

How does ZL70571UDJ differ from ZL70573UDJ in terms of pin configuration and use case?

ZL70571UDJ has five terminals including two dedicated substrate connections (SUB1, SUB2), enabling optimized thermal and current distribution in case-grounded implants. ZL70573UDJ has six terminals but no substrate pins, offering higher dV/dt immunity (>2300 V/µs) and lower capacitance (50 pF) - better for compact, non-case-grounded devices where substrate access is unavailable.

Is ZL70571UDJ qualified for EN-45502 compliance, and what testing validates this?

Yes, ZL70571UDJ is explicitly designed and tested to meet EN-45502 "Active Implantable Medical Devices" requirements. Validation includes passing 140 V/300 Ω defibrillation pulse sequences while maintaining full functionality of protected electronics - confirmed via surge testing per Figure 4-1 and peak voltage measurement per Figure 4-5 in the official datasheet.

What assembly method is required for ZL70571UDJ, and are there board layout constraints?

ZL70571UDJ is supplied as a solder-bumped die for flip-chip reflow assembly. All bumps associated with each terminal (e.g., all T3 bumps, all SUB1 bumps) must be connected together on the PCB using either individual matched pads or continuous rectangular pads. Underfill is mandatory to mitigate thermal stress on solder joints in implanted environments.

Does ZL70571UDJ require external biasing or control signals to operate?

No, ZL70571UDJ operates autonomously without external bias, control lines, or power supply. It relies entirely on intrinsic thyristor-diode physics: remaining in high-impedance state (<150 nA leakage) until voltage across any terminal pair exceeds its breakover threshold (9–12.2 V), then latching into low-impedance conduction to shunt surge current.

ZL70571UDJ Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Package/Case:
Die
Series:
-
Packaging:
Tray
Product Status:
Obsolete
Voltage - Clamping:
9 ~ 12.2V
Technology:
Internal Switch
Number of Circuits:
5
Applications:
-
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
Die

ZL70571UDJ FAQ

1.How can I place an order for ZL70571UDJ through Aetrix?

Please submit a Request for Quotation (RFQ) for ZL70571UDJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ZL70571UDJ reliable?

The price and inventory of ZL70571UDJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZL70571UDJ is usually 5 days.

3.What payment methods are accepted for ZL70571UDJ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZL70571UDJ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ZL70571UDJ?

ZL70571UDJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ZL70571UDJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZL70571UDJ?

For technical support, including ZL70571UDJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZL70571UDJ requirements.

6.How does Aetrix verify that ZL70571UDJ is sourced from the original manufacturer or authorized distributors?

All ZL70571UDJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZL70571UDJ meets industry standards.

7.What is the process for return or replacement of ZL70571UDJ?

All ZL70571UDJ units undergo pre-shipment inspection (PSI). If there is an issue with ZL70571UDJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZL70571UDJ part is unused and in its original packaging.

Return procedure for ZL70571UDJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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