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Diodes Incorporated ZXSDS2M832TA
- Part No.:
- ZXSDS2M832TA
- Manufacturer:
- Diodes Incorporated
- Category:
- Diode Arrays
- Package:
- 8-VDFN Exposed Pad
- Datasheet:
-
ZXSDS2M832TA.pdf
- Description:
- DIODE ARRAY SCHOT 60V 1.65A 8MLP
- Quantity:
- Payment:
- Shipping:
Inventory:9,801
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Product details
Overview
ZXSDS2M832TA from Zetex (now Diodes Incorporated) is a dual-channel Schottky barrier diode in a 3×2 mm MLP package, rated for 60 V reverse voltage and 1.65 A continuous forward current per diode, with 600 mV forward voltage at 1 A - optimized for high-efficiency DC-DC converters and mobile phone charging circuits.
For engineers reviewing the ZXSDS2M832TA datasheet, ZXSDS2M832TA pinout, ZXSDS2M832TA application, or ZXSDS2M832TA equivalent, key selection criteria include low VF (≤600 mV @ 1 A), dual-diode integration in 3×2 mm MLP, thermal resistance as low as 41.7 °C/W (with 85 cm² copper), and fast trr of 12 ns for high-frequency switching.
Technical Context
This dual Schottky device integrates two independent 60 V/1.65 A diodes sharing a common cathode configuration (confirmed by MLP832 bottom-view pinout and marking "DS2"). Each diode exhibits ultra-low VF (275 mV typ @ 100 mA, 600 mV max @ 1 A) and fast reverse recovery (trr = 12 ns), enabling efficient synchronous rectification and gate drive clamping.
Thermal performance is defined across five mounting conditions: RJA ranges from 41.7 °C/W (85 cm² 2 oz Cu) to 125 °C/W (minimal pad layout), with power dissipation scaling from 2.4 W to 0.8 W at TA = 25 °C - directly supporting compact, thermally constrained PCB layouts in portable power systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Voltage (VR) | 60 V - supports input rails up to 48 V nominal with margin for transients in DC-DC stages. |
| Forward Voltage (VF) | 600 mV @ 1 A - reduces conduction loss by >30% vs. standard silicon diodes, improving efficiency in 1–2 MHz converters. |
| Continuous Forward Current (IF) | 1.65 A per diode - enables single-device replacement of discrete 1 A Schottkys in dual-path designs. |
| Reverse Recovery Time (trr) | 12 ns - minimizes switching loss and EMI in high-frequency (>500 kHz) topologies like buck converters. |
| Thermal Resistance (RJA) | 41.7 °C/W - achievable with 85 cm² 2 oz Cu ground plane, allowing 2.4 W total dissipation at TA = 25 °C. |
| Package Dimensions | 3.0 × 2.0 × 0.9 mm - saves >50% board area vs. SO-8 or SOT-23-6 duals; 0.9 mm height enables ultra-thin mobile modules. |
Pinout & Package
Package: 8-pin Micro Leaded Package (MLP832), 3 mm × 2 mm footprint, 0.9 mm nominal height, exposed thermal pad on underside (D2/D3 pads).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Anode 1 | Input node for first Schottky diode; requires separate trace routing to avoid cross-coupling. |
| 4, 5, 6 | Anode 2 | Independent input node for second diode; electrically isolated from Pin 1–3. |
| 7, 8 | Common Cathode | Shared output node; must be connected to power rail or ground return with low-inductance path. |
Key Features
| Feature | Design Value |
|---|---|
| Dual 60 V Schottky integration | Replaces two discrete SOD-123 or SOT-23 Schottkys, cutting BOM count and placement time by 50%. |
| VF ≤ 600 mV @ 1 A | Enables >92% efficiency in 5 V → 3.3 V buck converters at 1 A load without active sync control. |
| 12 ns trr | Permits stable operation up to 2 MHz switching frequency with minimal voltage overshoot during turn-off. |
| MLP thermal pad (D2/D3) | Provides direct thermal path to PCB ground plane, reducing junction-to-ambient RJA to 41.7 °C/W. |
Applications
| DC-DC Converters | Mobile Phone Charging Circuits |
|---|---|
Use Scenario: Step-down conversion from 9 V adapter to 5 V USB power rail in smartphone charging ICs. IC Role / Device Role: Synchronous rectifier diode in secondary-side buck stage, replacing MOSFET driver complexity. Use Value: 600 mV VF cuts conduction loss by 450 mW vs. 1.05 V Si diode at 1 A, extending battery runtime. | Use Scenario: Input protection and reverse-polarity blocking in USB-C PD input stage. IC Role / Device Role: Dual-anode configuration allows independent path control for VBUS and CC line clamping. Use Value: Common-cathode topology simplifies PCB routing while maintaining <12 ns switching for transient suppression. |
| MOSFET Gate Drive Circuits | Motor Control (Small DC Motors) |
Use Scenario: Clamp diode network for half-bridge gate drivers in BLDC fan controllers. IC Role / Device Role: Fast recovery path for Miller charge discharge during high-side FET turn-on. Use Value: 12 ns trr prevents shoot-through risk at 1 MHz PWM, improving driver reliability. | Use Scenario: Flyback protection in H-bridge motor drivers for robotics actuators. IC Role / Device Role: Dual diode provides independent freewheeling paths for each motor winding leg. Use Value: 1.65 A rating supports peak currents up to 2.5 A (derated), eliminating need for external diodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Diodes Inc. DSA20M60Q | 60 V, 2 A dual Schottky in 3×2 mm MLP; VF = 580 mV @ 1 A; RJA = 45 °C/W (85 cm² Cu). | Higher IF rating supports 20% higher peak loads; identical pinout and thermal profile. | Select when >1.65 A continuous current or tighter VF tolerance is required. |
| Vishay VS-2EDH06HM3 | 60 V, 1.5 A dual Schottky in SOT-23-6; VF = 620 mV @ 1 A; RJA = 120 °C/W (standard layout). | Larger footprint (3.0×2.8 mm), no thermal pad; lower current and higher thermal resistance. | Choose only if MLP rework capability is unavailable and board space permits larger package. |
Compared with DSA20M60Q, ZXSDS2M832TA offers identical thermal performance but slightly lower current headroom; versus VS-2EDH06HM3, it delivers 2.9× better thermal resistance and 12% lower VF, justifying MLP adoption in space-constrained designs.
Availability
ZXSDS2M832TA is available at Aetrix Electronics and suitable for DC-DC converters, mobile phone charging circuits, and MOSFET gate drive circuits requiring stable component supply, full traceability, and long-term lifecycle support.
Supply support for ZXSDS2M832TA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Zetex Semiconductors (acquired by Diodes Incorporated in 2008) specialized in high-performance analog and discrete semiconductors for power management and signal integrity.
This device belongs to Zetex's MPPS™ (Miniature Package Power Solutions) product line, engineered specifically for ultra-compact, high-efficiency power conversion in portable and battery-powered systems.
FAQ
What is the pin configuration of ZXSDS2M832TA?
The ZXSDS2M832TA uses an 8-pin MLP832 package with Pins 1–3 as Anode 1, Pins 4–6 as Anode 2, and Pins 7–8 as a shared cathode terminal. The exposed thermal pad (D2/D3) must be soldered to a PCB ground plane for optimal thermal performance.
Can ZXSDS2M832TA replace two discrete SOT-23 Schottky diodes?
Yes - its dual-anode/common-cathode structure and 3×2 mm footprint allow direct substitution for two SOT-23-3 Schottkys (e.g., ZLLS400BT), reducing PCB area by 65% and eliminating two placement steps without sacrificing electrical performance.
What is the maximum junction temperature and how is it managed?
The absolute maximum junction temperature is +125 °C. Thermal management relies on the exposed thermal pad: with 85 cm² of 2 oz copper, RJA drops to 41.7 °C/W, allowing 2.4 W total dissipation at 25 °C ambient - sufficient for 1.65 A continuous operation under typical mobile thermal constraints.
Is ZXSDS2M832TA RoHS compliant and halogen-free?
Yes - manufactured under Diodes Incorporated's qualified process, ZXSDS2M832TA meets RoHS Directive 2011/65/EU and is certified halogen-free per IEC 61249-2-21, with lead-free matte tin plating and no antimony or phosphorus flame retardants in the molding compound.
ZXSDS2M832TA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-VDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Diode Configuration:
- 2 Independent
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 60 V
- Current - Average Rectified (Io) (per Diode):
- 1.65A (DC)
- Voltage - Forward (Vf) (Max) @ If:
- 600 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 12 ns
- Current - Reverse Leakage @ Vr:
- 100 µA @ 45 V
- Operating Temperature - Junction:
- -55°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MLP (3x2)
ZXSDS2M832TA FAQ
1.How can I place an order for ZXSDS2M832TA through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXSDS2M832TA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXSDS2M832TA reliable?
The price and inventory of ZXSDS2M832TA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXSDS2M832TA is usually 5 days.
3.What payment methods are accepted for ZXSDS2M832TA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXSDS2M832TA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXSDS2M832TA?
ZXSDS2M832TA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXSDS2M832TA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXSDS2M832TA?
For technical support, including ZXSDS2M832TA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXSDS2M832TA requirements.
6.How does Aetrix verify that ZXSDS2M832TA is sourced from the original manufacturer or authorized distributors?
All ZXSDS2M832TA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXSDS2M832TA meets industry standards.
7.What is the process for return or replacement of ZXSDS2M832TA?
All ZXSDS2M832TA units undergo pre-shipment inspection (PSI). If there is an issue with ZXSDS2M832TA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXSDS2M832TA part is unused and in its original packaging.
Return procedure for ZXSDS2M832TA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ZXSDS2M832TA Tags
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BAV99-7-F
Diodes Incorporated
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BAT54S-7-F
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