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Diodes Incorporated ZXT12N20DXTC

Part No.:
ZXT12N20DXTC
Manufacturer:
Diodes Incorporated
Category:
Bipolar Transistor Arrays
Package:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Datasheet:
AetrixZXT12N20DXTC.pdf
Description:
TRANS 2NPN DUAL 20V 3.5A 8-MSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,865

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Product details

Overview

ZXT12N20DXTC from Diodes Incorporated (formerly Zetex) is a dual NPN silicon low-saturation switching transistor in MSOP-8 package, with VCEO = 20 V, RSAT = 40 mΩ (typ. VCE(sat) = 70 mV @ IC = 0.1 A, IB = 10 mA), and IC = 3.5 A continuous. It serves as a high-efficiency synchronous rectifier or power switch in low-voltage DC–DC converters.

For engineers reviewing the ZXT12N20DXTC datasheet, ZXT12N20DXTC pinout, ZXT12N20DXTC application, or ZXT12N20DXTC equivalent, key selection criteria include dual-die thermal coupling, sub-100 mV saturation at 3.5 A, hFE ≥ 250 at 3.5 A, fT = 112 MHz, and MSOP-8 footprint compatibility with space-constrained power stages.

Technical Context

This dual NPN device integrates two independent transistors sharing a common thermal substrate in a single MSOP-8 package, enabling matched switching behavior and reduced board area versus discrete pairs. Each die supports 3.5 A continuous collector current with guaranteed VCE(sat) ≤ 160 mV at IC = 3.5 A / IB = 50 mA.

The matrix structure yields hFE of 400 (min) at IC = 10 A and fT = 112 MHz under 50 mA / 10 V bias, supporting fast switching in 300 kHz–1 MHz DC–DC topologies. Turn-on/turn-off times are 65 ns and 400 ns respectively at VCC = 10 V, IC = 2 A.

Key Specifications

ParameterValue and Actual Design Meaning
VCEO20 V - Maximum blocking voltage across collector-emitter before breakdown; sets upper limit for input/output rail in buck or boost converters.
VCE(sat) @ 3.5 A70–160 mV - Directly determines conduction loss: ~250 mW dissipation at full load, enabling >95% efficiency in 5 V–12 V output stages.
IC (continuous)3.5 A - Sustained current capability per transistor; enables use in 10–25 W point-of-load regulators without external heatsinking.
fT112 MHz - Ensures sufficient gain-bandwidth for stable gate drive in high-frequency PWM control loops up to 1 MHz.
RθJA (dual-die)120 °C/W - Thermal resistance when both dies operate equally; allows ~8.3 W total PD at TA = 25 °C, critical for thermal derating in compact layouts.
hFE @ 3.5 A320 (min) - Supports low base drive current (≤50 mA) while maintaining saturation, reducing driver-stage power loss.

Pinout & Package

Package: MSOP-8 (JEDEC MO-187 Iss A), 3.0 × 4.9 mm body, 0.65 mm pitch, exposed thermal pad (not electrically connected). Designed for surface-mount assembly on 1 oz copper FR4 with 25 mm × 25 mm thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
1Emitter 1 (E1)Emitter terminal of first NPN transistor; tied to source-side return path in high-side switch configuration.
2Base 1 (B1)Control input for first transistor; requires ~50 mA drive to saturate at 3.5 A load.
3Collector 1 (C1)Power output node for first transistor; connects to inductor or load in half-bridge leg.
4Collector 2 (C2)Power output node for second transistor; enables dual-switch topology (e.g., synchronous buck + OR-ing).
5Base 2 (B2)Independent control input for second transistor; allows asynchronous or complementary drive schemes.
6Emitter 2 (E2)Emitter terminal of second NPN transistor; may be tied to ground or used as floating reference in isolated configurations.
7NCNo internal connection; left unconnected per datasheet - not to be bonded or routed.
8NCNo internal connection; electrically isolated; must remain unconnected to avoid parasitic coupling.

Key Features

FeatureDesign Value
Dual NPN topology in single MSOP-8Reduces PCB area by >40% vs. two discrete SOT-23 transistors; enables matched thermal and electrical characteristics between switches.
VCE(sat) ≤ 100 mV @ IC = 1 AMinimizes conduction loss in 3.3 V–5 V output rails, directly improving light-load efficiency in always-on power domains.
hFE characterized to 10 AValidates stable current gain under peak transient loads (e.g., motor startup), eliminating guesswork in base drive design.
112 MHz fTSupports clean square-wave switching at 500 kHz–1 MHz with <1% overshoot, reducing EMI filter component count.
Thermally coupled dual-die constructionEnsures balanced junction temperature rise during simultaneous operation, preventing thermal runaway in paralleled switching paths.

Applications

DC–DC Buck ConverterLoad Switching for FPGA Core Rails

Use Scenario: 12 V input to 3.3 V/3 A output in telecom power module.

IC Role / Device Role: Low-side synchronous rectifier replacing Schottky diode.

Use Value: Reduces conduction loss from ~1.2 W (diode) to ~0.25 W, lowering thermal stress and enabling fanless operation.

Use Scenario: Sequenced 1.2 V core supply enable for Xilinx Artix-7 FPGA.

IC Role / Device Role: High-current, low-RDS(on) replacement for discrete MOSFET load switch.

Use Value: Achieves <100 mV dropout at 3 A, meeting FPGA VCCINT tolerance while simplifying gate-drive circuitry.

Motor Driver Half-BridgeOR-ing Diode Replacement

Use Scenario: 24 V brushed DC motor control in industrial actuator.

IC Role / Device Role: Upper and lower switch in H-bridge leg (dual-die used per leg).

Use Value: Enables bidirectional PWM control with <150 ns dead-time margin due to matched ton/toff.

Use Scenario: Redundant 5 V power inputs in network switch backplane.

IC Role / Device Role: Active OR-ing element replacing 40 V Schottky diodes.

Use Value: Cuts forward voltage drop from 0.45 V to 0.08 V, reducing power loss by 82% per rail and eliminating thermal derating.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual NPN low-saturation switching applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ZXT13N20DXTCHigher VCEO = 25 V; VCE(sat) = 90 mV @ 3.5 A; same MSOP-8 package.Preferred where input rail exceeds 20 V (e.g., 24 V automotive systems) but sacrifices 20% lower saturation performance.Select when system overvoltage margin >5 V is required and 10–15 mV higher VCE(sat) is acceptable.
DMT3005LPSQ-13Single N-channel MOSFET (30 V, 5.3 mΩ); SO-8 package; no bipolar drive requirement.Replaces BJT with MOSFET for gate-driven topologies; eliminates base current but requires level-shifted gate drive above 5 V.Choose when controller supports high-side NMOS drive and RDS(on) < 6 mΩ justifies added gate-driver complexity.

Compared with ZXT13N20DXTC, this part offers tighter saturation control at 20 V systems; versus DMT3005LPSQ-13, it avoids gate-drive overhead but trades off conduction loss scalability beyond 5 A.

Availability

ZXT12N20DXTC is available at Aetrix Electronics and suitable for DC–DC converters, FPGA load switching, motor control half-bridges, and OR-ing power redundancy requiring stable component supply and JEDEC-compliant MSOP-8 sourcing.

Supply support for ZXT12N20DXTC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated acquired Zetex plc in 2008 and maintains its high-performance analog and power transistor portfolio, emphasizing precision, efficiency, and reliability in power management ICs and discretes.

ZXT12N20DXTC belongs to the Zetex SuperSOT™ low-saturation bipolar transistor family, engineered specifically for high-efficiency, low-voltage switching in space-constrained DC–DC and load-switching applications.

FAQ

What is the maximum safe operating junction temperature for ZXT12N20DXTC?

The absolute maximum junction temperature is +150 °C, with recommended continuous operation below +125 °C. Derating begins at 25 °C ambient using RθJA = 120 °C/W (dual-die mode), limiting usable power dissipation to 6.9 W at 25 °C and 4.2 W at 70 °C ambient.

Can pins 7 and 8 be connected to ground or left floating?

Pins 7 and 8 are internally unconnected (NC) and must remain unconnected in layout. Neither grounding nor routing them is permitted - doing so risks parasitic capacitance increase, signal coupling, or mechanical stress on bond wires during reflow.

How does thermal coupling between the two dies affect parallel operation?

The dual-die construction ensures matched thermal impedance and junction temperature rise under equal power dissipation. This eliminates thermal imbalance seen in discrete pairs, allowing simultaneous switching without current hogging - verified by identical VCE(sat) drift curves across temperature.

Is ZXT12N20DXTC suitable for linear regulator pass transistor applications?

No - it is optimized for switching operation only. Its SOA is limited to pulsed conditions (tp ≤ 300 µs, duty ≤ 2%), and linear-mode power dissipation exceeds safe limits beyond ~0.5 W due to low thermal mass and absence of Safe Operating Area characterization for DC bias.

ZXT12N20DXTC Specifications

Product attributes
Attribute value
Manufacturer:
Diodes Incorporated
Series:
-
Package/Case:
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Transistor Type:
2 NPN (Dual)
Current - Collector (Ic) (Max):
3.5A
Voltage - Collector Emitter Breakdown (Max):
20V
Vce Saturation (Max) @ Ib, Ic:
200mV @ 50mA, 3.5A
Current - Collector Cutoff (Max):
100nA
DC Current Gain (hFE) (Min) @ Ic, Vce:
300 @ 1A, 2V
Power - Max:
1.04W
Frequency - Transition:
112MHz
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-MSOP

ZXT12N20DXTC FAQ

1.How can I place an order for ZXT12N20DXTC through Aetrix?

Please submit a Request for Quotation (RFQ) for ZXT12N20DXTC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ZXT12N20DXTC reliable?

The price and inventory of ZXT12N20DXTC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXT12N20DXTC is usually 5 days.

3.What payment methods are accepted for ZXT12N20DXTC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXT12N20DXTC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ZXT12N20DXTC?

ZXT12N20DXTC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ZXT12N20DXTC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ZXT12N20DXTC?

For technical support, including ZXT12N20DXTC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXT12N20DXTC requirements.

6.How does Aetrix verify that ZXT12N20DXTC is sourced from the original manufacturer or authorized distributors?

All ZXT12N20DXTC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXT12N20DXTC meets industry standards.

7.What is the process for return or replacement of ZXT12N20DXTC?

All ZXT12N20DXTC units undergo pre-shipment inspection (PSI). If there is an issue with ZXT12N20DXTC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ZXT12N20DXTC part is unused and in its original packaging.

Return procedure for ZXT12N20DXTC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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