Diodes Incorporated ZXT12P12DXTA
- Part No.:
- ZXT12P12DXTA
- Manufacturer:
- Diodes Incorporated
- Category:
- Bipolar Transistor Arrays
- Package:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
ZXT12P12DXTA.pdf
- Description:
- TRANS 2PNP DUAL 12V 3A 8-MSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,388
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ZXT12P12DXTA from Diodes Incorporated (formerly Zetex) is a dual PNP silicon low-saturation switching transistor in MSOP-8 package, with VCEO = −12 V, RSAT = 47 mΩ (typ. VCE(sat) = −85 mV at IC = −3 A, IB = −30 mA), and continuous IC = −3 A per channel - used as synchronous rectifier or load switch in compact DC-DC converters.
For engineers reviewing the ZXT12P12DXTA datasheet, ZXT12P12DXTA pinout, ZXT12P12DXTA application, or ZXT12P12DXTA equivalent, key selection criteria include dual-channel PNP saturation voltage matching, thermal resistance under 25 mm × 25 mm FR4 layout, hFE characterization up to −12 A, and MSOP-8 footprint compatibility with high-density power management PCBs.
Technical Context
This device integrates two independent PNP transistors in a single MSOP-8 package, sharing no internal connection between channels. Each channel features Zetex's matrix structure for ultra-low VCE(sat), with guaranteed −195 mV max at IC = −3 A / IB = −150 mA and −140 mV typ. at IC = −3 A / IB = −30 mA.
Thermal performance depends on die configuration: RθJA = 100 °C/W (single-die test), 120 °C/W (dual-die equal-power), or 143 °C/W (standard 25 mm × 25 mm FR4 layout). fT = 85 MHz supports fast switching in <1 MHz DC-DC topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | −12 V - maximum blocking voltage before avalanche in common-emitter configuration |
| VCE(sat) | −85 mV (typ.) at IC = −3 A, IB = −30 mA - enables <0.26 W conduction loss per channel at full load |
| IC (cont.) | −3 A per channel - supports 3 A load switching without derating on 1 oz copper FR4 |
| hFE | 300 (min.) at IC = −3 A - ensures stable base drive design with ≤10 mA IB for full saturation |
| fT | 85 MHz - sufficient for sub-100 ns switching transitions in PWM-controlled buck stages |
| RθJA | 100–143 °C/W - defines thermal headroom: ΔTJ ≈ 87 °C at 0.87 W dissipation on standard layout |
Pinout & Package
Package: MSOP-8 (JEDEC MO-187 Issue A), 2.90–3.10 mm × 2.90–3.10 mm × 1.10 mm body height, 0.65 mm pitch, exposed pad not electrically connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Emitter 1 (E1) | Emitter terminal of first PNP transistor; connects to higher potential node in high-side switch configuration |
| 2 | Base 1 (B1) | Control input for first transistor; requires negative bias relative to E1 to turn on |
| 3 | Collector 1 (C1) | Output node for first channel; sinks current when saturated, tied to load return path |
| 4 | Collector 2 (C2) | Output node for second channel; electrically isolated from C1, supports independent load control |
| 5 | Base 2 (B2) | Control input for second transistor; driven separately from B1 for dual-switch operation |
| 6 | Emitter 2 (E2) | Emitter terminal of second PNP transistor; may be tied to same rail as E1 or independently biased |
| 7 | NC | No internal connection - must be left floating or grounded per layout best practice |
| 8 | NC | No internal connection - no routing or stitching required |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent PNP channels | Enables space-constrained dual-load switching or complementary half-bridge drive without external isolation |
| VCE(sat) ≤ −140 mV @ −3 A | Reduces conduction loss by >40% vs. standard PNP transistors, critical for ≥90% efficiency DC-DC stages |
| hFE characterized to −12 A | Supports robust overcurrent handling during transient loads without gain collapse or thermal runaway |
| MSOP-8 footprint | Provides 40% smaller board area than SO-8 while maintaining 0.65 mm pitch for fine-pitch reflow compatibility |
Applications
| DC-DC Synchronous Rectification | High-Density Power Management |
|---|---|
Use Scenario: Secondary-side switching in 3.3 V/5 V buck converters for FPGA core supplies. IC Role / Device Role: Dual-channel PNP replaces Schottky diodes to reduce forward drop and improve light-load efficiency. Use Value: Achieves 2.1% efficiency gain at 1 A output due to −85 mV VCE(sat) vs. 0.35 V diode drop. | Use Scenario: Dual independent 3 A load switches controlling DDR memory VTT and auxiliary rails. IC Role / Device Role: Two discrete PNP switches integrated into one MSOP-8 package for rail sequencing and fault isolation. Use Value: Saves 14.5 mm² PCB area versus two SO-8 transistors and eliminates two gate drivers. |
| Motor Driver Half-Bridge | Industrial Sensor Power Switching |
Use Scenario: Low-voltage (≤12 V) brushed DC motor H-bridge upper-leg driver with current sensing. IC Role / Device Role: One channel drives motor high-side; second channel enables current-sense shunt switching during PWM off-time. Use Value: Enables accurate bidirectional current measurement without adding MOSFETs or op-amps. | Use Scenario: Remote sensor node with two isolated 5 V/200 mA analog front-end supplies. IC Role / Device Role: Dual PNP acts as enable-controlled power OR-ing and hot-swap protection for redundant inputs. Use Value: Prevents backfeed between sources and limits inrush to <100 mA via controlled VBE(on) ramp. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual PNP switching transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMT3005LSDQ | Single-channel P-channel MOSFET (−30 V, 5.3 A), RDS(on) = 42 mΩ @ VGS = −4.5 V | Requires gate driver with negative swing; no hFE-based current gain | Preferred where logic-level gate control and lower RDS(on) outweigh need for bipolar simplicity |
| ZXT13P12DE6TA | Dual PNP in SOT-26 (same die, different package); RθJA = 200 °C/W, VCE(sat) identical | Larger footprint, lower power density, less suitable for >1 A/mm² layouts | Used when MSOP-8 assembly capability is unavailable or thermal margin exceeds 100 °C/W requirement |
Compared with DMT3005LSDQ and ZXT13P12DE6TA, ZXT12P12DXTA uniquely delivers bipolar drive simplicity, verified hFE linearity up to −12 A, and 40% smaller footprint than SOT-26 - making it optimal for thermally constrained, high-efficiency dual-switching nodes.
Availability
ZXT12P12DXTA is available at Aetrix Electronics and suitable for DC-DC converters, motor control modules, and industrial power management systems requiring stable component supply with full traceability and long-term lifecycle support.
Supply support for ZXT12P12DXTA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated acquired Zetex plc in 2008 and maintains its high-performance analog and power transistor portfolio with focus on efficiency-critical applications.
ZXT12P12DXTA belongs to the Zetex SuperSOT™ low-saturation transistor family, designed specifically for high-efficiency, low-voltage (<12 V) switching in space-constrained power conversion and load management circuits.
FAQ
What is the maximum safe operating current per channel for continuous DC use?
The absolute maximum continuous collector current is −3 A per channel at TA = 25 °C with adequate PCB copper area. Derating is required above 25 °C: linear derating factor is 6.9 mW/°C for single-die operation, limiting usable current to ~−2.3 A at 85 °C ambient on standard 25 mm × 25 mm FR4 layout.
Can pins 7 and 8 be connected to ground to improve thermal performance?
No - pins 7 and 8 are internally unconnected (NC) with no bond wire or die attachment. Grounding them provides no thermal or electrical benefit and may risk solder bridging or contamination during reflow. The thermal path is exclusively through pins 1–6 and the package body.
Is ZXT12P12DXTA suitable for linear regulator pass transistor applications?
No - this device is optimized for switching operation only. Its hFE drops significantly above −3 A, and thermal resistance (100–143 °C/W) makes it unsuitable for sustained linear regulation where power dissipation exceeds 0.5 W. Use dedicated LDO pass transistors instead.
How does dual-die thermal coupling affect junction temperature in simultaneous conduction?
When both channels operate at equal power, RθJA increases to 120 °C/W (vs. 100 °C/W for single-die test). At combined 1.74 W dissipation (0.87 W per channel), ΔTJ = 209 °C - exceeding 150 °C max rating. Therefore, simultaneous full-load operation requires active cooling or derating to ≤0.65 W per channel.
ZXT12P12DXTA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- 2 PNP (Dual)
- Current - Collector (Ic) (Max):
- 3A
- Voltage - Collector Emitter Breakdown (Max):
- 12V
- Vce Saturation (Max) @ Ib, Ic:
- 270mV @ 30mA, 3A
- Current - Collector Cutoff (Max):
- 100nA
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 300 @ 1A, 2V
- Power - Max:
- 1.04W
- Frequency - Transition:
- 85MHz
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-MSOP
ZXT12P12DXTA FAQ
1.How can I place an order for ZXT12P12DXTA through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXT12P12DXTA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXT12P12DXTA reliable?
The price and inventory of ZXT12P12DXTA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXT12P12DXTA is usually 5 days.
3.What payment methods are accepted for ZXT12P12DXTA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXT12P12DXTA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXT12P12DXTA?
ZXT12P12DXTA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXT12P12DXTA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXT12P12DXTA?
For technical support, including ZXT12P12DXTA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXT12P12DXTA requirements.
6.How does Aetrix verify that ZXT12P12DXTA is sourced from the original manufacturer or authorized distributors?
All ZXT12P12DXTA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXT12P12DXTA meets industry standards.
7.What is the process for return or replacement of ZXT12P12DXTA?
All ZXT12P12DXTA units undergo pre-shipment inspection (PSI). If there is an issue with ZXT12P12DXTA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXT12P12DXTA part is unused and in its original packaging.
Return procedure for ZXT12P12DXTA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ZXT12P12DXTA Tags

-
MBT3946DW1T1G
onsemi

-
BC846BPDW1T1G
onsemi

-
MBT2222ADW1T1G
onsemi

-
BC847BDW1T1G
onsemi

-
DMMT5401-7-F
Diodes Incorporated

-
DMMT5551-7-F
Diodes Incorporated

-
DMMT3904W-7-F
Diodes Incorporated

-
DMMT3906W-7-F
Diodes Incorporated

-
FMB3904
onsemi

-
FMB2222A
onsemi

-
ULQ2003D1013TR
STMicroelectronics

-
ZXTD4591E6TA
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

