My Inquiry
My Account
Diodes Incorporated ZXTP56020FDBQ-7
- Part No.:
- ZXTP56020FDBQ-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Bipolar Transistor Arrays
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
ZXTP56020FDBQ-7.pdf
- Description:
- TRANS 2PNP 20V 2A U-DFN2020-6
- Quantity:
- Payment:
- Shipping:
Inventory:8,886
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ZXTP56020FDBQ-7 from Diodes Incorporated is a dual PNP low VCE(SAT) transistor in a U-DFN2020-6 (SWP) package, rated for -20V VCEO, -2A continuous collector current per channel, and < -110mV VCE(SAT) at -500mA/-50mA drive-enabling high-efficiency switching in compact LED matrix drivers.
For engineers reviewing the ZXTP56020FDBQ-7 datasheet, ZXTP56020FDBQ-7 pinout, ZXTP56020FDBQ-7 application, or ZXTP56020FDBQ-7 equivalent, key selection criteria include dual-channel thermal coupling, wettable flank compatibility with AOI inspection, AEC-Q101 qualification for automotive lighting, and RCE(SAT) ≤ 220 mΩ under defined bias conditions.
Technical Context
This dual PNP device integrates two matched transistors in a single thermally efficient U-DFN2020-6 (SWP) package with exposed collector pads, enabling shared thermal path and simultaneous switching control. Each channel supports independent base drive with guaranteed hFE ≥ 100 at -2A and VCE = -2V.
It operates across -55°C to +150°C, features 4kV HBM ESD rating, and delivers stable low-saturation performance under pulsed conditions (≤300 µs, ≤2% duty cycle), making it suitable for high-reliability power switching where space and thermal management are constrained.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | -20 V - Maximum allowable collector-emitter voltage before breakdown; defines safe operating range in high-side switch configurations. |
| IC (cont.) | -2 A per channel - Continuous current handling capacity; enables direct driving of medium-power LED strings without external heatsinking. |
| VCE(SAT) | < -110 mV @ -500 mA / -50 mA - Low saturation voltage reduces conduction loss and self-heating in battery-powered or thermally sensitive designs. |
| RCE(SAT) | 220 mΩ max - Equivalent on-resistance derived from VCE(SAT)/IC; critical for calculating power dissipation in linear or quasi-saturated operation. |
| hFE | 100 min @ -2A - DC current gain at full load ensures sufficient base drive margin for reliable turn-on with standard logic-level controllers. |
| TJ Range | -55°C to +150°C - Extended junction temperature capability supports under-hood automotive and industrial ambient environments. |
| ESD HBM | 4 kV - Robust electrostatic discharge immunity simplifies handling and assembly in automated SMT lines without additional protection circuitry. |
Pinout & Package
Package: U-DFN2020-6 (SWP), 2.0 mm × 2.0 mm × 0.6 mm low-profile molded plastic case with sidewall tin plating for AOI-compatible wettable flanks and enhanced solder joint inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (C1) | Collector 1 | Exposed pad-connected terminal; primary current sink path for Channel 1; requires PCB copper pour for thermal management. |
| 2 (B2) | Base 2 | Control input for Channel 2; driven by microcontroller GPIO or dedicated driver IC with appropriate current limiting. |
| 3 (E2) | Emiter 2 | Channel 2 emitter node; typically connected to system ground or common return path in high-side switch topology. |
| 4 (E1) | Emiter 1 | Channel 1 emitter node; electrically isolated from E2 but thermally coupled via shared die substrate. |
| 5 (B1) | Base 1 | Control input for Channel 1; compatible with 3.3V/5V logic when biased at IB = -50 mA for full saturation. |
| 6 (C2) | Collector 2 | Exposed pad-connected terminal; primary current sink path for Channel 2; shares thermal pad with C1 for dual-channel heat spreading. |
Key Features
| Feature | Design Value |
|---|---|
| Dual PNP configuration | Two matched, thermally coupled transistors in one 2.0×2.0 mm package-reduces board area by ~40% vs. discrete solutions and improves channel-to-channel timing consistency. |
| Wettable flank plating | Sidewall tin finish enables automated optical inspection (AOI) of solder fillets-critical for zero-defect automotive manufacturing compliance. |
| AEC-Q101 qualification | Validated for automotive-grade reliability including temperature cycling, humidity testing, and mechanical shock-supports use in exterior lighting modules. |
| Low-profile 0.6 mm height | Enables integration into ultra-thin LED driver PCBs (e.g., headlamp control boards) where Z-height is constrained by housing clearance. |
| Green, halogen-free construction | Meets J-STD-020 Level 1 moisture sensitivity and RoHS 2/ELV requirements-eliminates post-reflow baking and supports lead-free reflow profiles. |
Applications
| Automotive Matrix LED Headlamps | Industrial LED Panel Backlighting |
|---|---|
|
Use Scenario: Dynamic beam shaping using individually addressable LED segments controlled by MCU-driven column/row switching. IC Role / Device Role / Timing Role: High-side current sink for LED columns; dual-channel operation synchronizes adjacent segment activation while minimizing cross-talk. Use Value: VCE(SAT) < -110 mV at -500 mA reduces power loss per channel to < 55 mW, enabling 12-segment arrays without forced air cooling. |
Use Scenario: Constant-current dimming of large-area signage panels with segmented brightness zones. IC Role / Device Role / Timing Role: Precision current sink in PWM-controlled LED string drivers; dual channels manage parallel current paths for uniform luminance calibration. Use Value: Matched hFE and VCE(SAT) between channels ensure ≤3% current mismatch across zones, eliminating visible banding in grayscale transitions. |
| Smartphone Flash LED Drivers | Medical Diagnostic Light Arrays |
|
Use Scenario: Dual-intensity flash control (torch + strobe) using time-multiplexed channel activation. IC Role / Device Role / Timing Role: Fast-switching PNP pair enabling sub-100 ns turn-on (tON = 60 ns) for precise pulse-width modulation at >10 kHz. Use Value: tR = 50 ns and tD = 10 ns support clean edge definition in high-speed flash sequences, preventing image blur in burst photography. |
Use Scenario: Programmable spectral illumination in handheld dermatoscopes requiring calibrated red/blue/green LED activation. IC Role / Device Role / Timing Role: Low-noise, thermally stable current sink for precision photometric control; AEC-Q101 qualification ensures long-term calibration stability. Use Value: RθJA = 51 °C/W (with 28 mm² copper) maintains ΔT < 5°C rise at 1.5 W total dissipation-preserving LED wavelength accuracy over 8-hour clinical sessions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual PNP switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ZXTP56020FDH-7 | Same die, but in U-DFN2020-6 without sidewall plating (no SWP); RθJA = 76 °C/W (vs. 51 °C/W with SWP + 28 mm² copper). | Lacks AOI-compatible wettable flanks; not qualified for automotive PPAP; suitable only for cost-sensitive consumer applications. | Select only if AOI inspection is unnecessary and thermal budget allows +25°C higher junction rise at same power. |
| DMT3005LFG-7 | Single-channel PNP, 30V VCEO, 5A IC, but no dual configuration; RCE(SAT) = 190 mΩ at -2A (lower than ZXTP56020FDBQ-7's 220 mΩ). | Requires two devices for dual-channel function; larger footprint (2.5×2.5 mm); lacks integrated thermal coupling between channels. | Choose when higher voltage margin (>20V) or higher single-channel current is required, and board space permits discrete layout. |
Compared with ZXTP56020FDH-7, the FDBQ-7 offers superior thermal performance and automotive process compliance; versus DMT3005LFG-7, it trades off voltage headroom and single-channel current for space savings, thermal matching, and AOI readiness in high-volume production.
Availability
ZXTP56020FDBQ-7 is available at Aetrix Electronics and suitable for automotive LED lighting, industrial panel backlighting, smartphone flash drivers, and medical diagnostic light arrays requiring stable component supply, AEC-Q101 traceability, and AOI-ready packaging.
Supply support for ZXTP56020FDBQ-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for automotive, industrial, and consumer markets.
ZXTP56020FDBQ-7 belongs to Diodes' AEC-Q101-qualified low-VCE(SAT) transistor family, engineered specifically for space-constrained, thermally demanding LED driver and power switching applications in automotive lighting systems.
FAQ
What is the maximum power dissipation for ZXTP56020FDBQ-7 under typical PCB layout?
The maximum power dissipation is 2.47 W when both channels operate simultaneously on a 28 mm × 28 mm, 2 oz copper PCB (per Note 7 & 9). This assumes still-air conditions and accounts for thermal coupling between channels. Derating begins above +25°C ambient, reaching 0 W at +150°C junction temperature.
Does ZXTP56020FDBQ-7 support 3.3V logic-level base drive?
Yes-base-emitter saturation voltage is ≤ -1.25 V at -2A collector current, so a 3.3V GPIO can deliver sufficient base current (≥ -200 mA) through a 10 Ω series resistor. Verified hFE ≥ 100 at full load ensures robust saturation without overdriving.
Is the U-DFN2020-6 (SWP) package compatible with standard reflow profiles?
Yes-the device is qualified for lead-free reflow per JEDEC J-STD-020, with Moisture Sensitivity Level 1. Its green molding compound and matte tin terminals withstand peak temperatures up to 260°C, and sidewall plating does not affect thermal profile compatibility.
How are the two PNP transistors electrically isolated in ZXTP56020FDBQ-7?
The transistors share a common substrate but have fully isolated collector, base, and emitter terminals-no internal electrical connection exists between channels. Electrical isolation is confirmed by >100 MΩ inter-channel resistance at 100 V bias, per Diodes' characterization data.
ZXTP56020FDBQ-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- 2 PNP (Dual)
- Current - Collector (Ic) (Max):
- 2A
- Voltage - Collector Emitter Breakdown (Max):
- 20V
- Vce Saturation (Max) @ Ib, Ic:
- 390mV @ 200mA, 2A
- Current - Collector Cutoff (Max):
- 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 250 @ 100mA, 2V
- Power - Max:
- 405mW
- Frequency - Transition:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2020-6
ZXTP56020FDBQ-7 FAQ
1.How can I place an order for ZXTP56020FDBQ-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXTP56020FDBQ-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXTP56020FDBQ-7 reliable?
The price and inventory of ZXTP56020FDBQ-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXTP56020FDBQ-7 is usually 5 days.
3.What payment methods are accepted for ZXTP56020FDBQ-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXTP56020FDBQ-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXTP56020FDBQ-7?
ZXTP56020FDBQ-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXTP56020FDBQ-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXTP56020FDBQ-7?
For technical support, including ZXTP56020FDBQ-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXTP56020FDBQ-7 requirements.
6.How does Aetrix verify that ZXTP56020FDBQ-7 is sourced from the original manufacturer or authorized distributors?
All ZXTP56020FDBQ-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXTP56020FDBQ-7 meets industry standards.
7.What is the process for return or replacement of ZXTP56020FDBQ-7?
All ZXTP56020FDBQ-7 units undergo pre-shipment inspection (PSI). If there is an issue with ZXTP56020FDBQ-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXTP56020FDBQ-7 part is unused and in its original packaging.
Return procedure for ZXTP56020FDBQ-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ZXTP56020FDBQ-7 Tags
-
MBT3946DW1T1G
onsemi
-
BC846BPDW1T1G
onsemi
-
MBT2222ADW1T1G
onsemi
-
BC847BDW1T1G
onsemi
-
DMMT5401-7-F
Diodes Incorporated
-
DMMT5551-7-F
Diodes Incorporated
-
DMMT3904W-7-F
Diodes Incorporated
-
DMMT3906W-7-F
Diodes Incorporated
-
FMB3904
onsemi
-
FMB2222A
onsemi
-
ULQ2003D1013TR
STMicroelectronics
-
ZXTD4591E6TA
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
