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Diodes Incorporated ZXTP56060FDBQ-7
- Part No.:
- ZXTP56060FDBQ-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Bipolar Transistor Arrays
- Package:
- 6-UDFN Exposed Pad
- Datasheet:
-
ZXTP56060FDBQ-7.pdf
- Description:
- TRANS 2PNP 60V 2A U-DFN2020-6
- Quantity:
- Payment:
- Shipping:
Inventory:5,700
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Product details
Overview
ZXTP56060FDBQ-7 from Diodes Incorporated is a dual PNP bipolar junction transistor (BJT) rated for -60V VCEO, -2A continuous collector current per channel, and 250 mΩ equivalent on-resistance (RCE(sat)). It features AEC-Q101 qualification, wettable flank plating for AOI inspection, and a low-profile U-DFN2020-6 (SWP) package-designed for automotive matrix LED lighting and power management systems where space, thermal performance, and reliability are critical.
For engineers reviewing the ZXTP56060FDBQ-7 datasheet, ZXTP56060FDBQ-7 pinout, ZXTP56060FDBQ-7 application, or ZXTP56060FDBQ-7 equivalent, this page delivers verified electrical parameters, validated dual-channel pin mapping, automotive-grade qualification status, thermal derating curves, and direct alternatives with documented functional trade-offs.
Technical Context
This dual PNP BJT integrates two matched high-voltage, low-saturation transistors in a single U-DFN2020-6 (SWP) package with exposed collector pads for enhanced thermal conduction. Each channel supports -60V breakdown, -2A DC current, and achieves VCE(sat) ≤ -450 mV at IC = -2A / IB = -200mA under pulsed conditions.
The device uses sidewall tin plating to enable automated optical inspection of solder joints and complies with AEC-Q101 stress testing, IATF16949 manufacturing, and RoHS 3/Halogen-free requirements. Thermal resistance to ambient ranges from 51°C/W (with 28 mm × 28 mm 2 oz copper) to 308°C/W (single-sided FR-4), depending on PCB layout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | -60 V - Maximum reverse voltage across collector-emitter before breakdown; enables use in 48V automotive power rails. |
| IC (continuous) | -2 A per channel - Sustains full load current without derating at TA ≤ +70°C with proper PCB copper area. |
| RCE(sat) | 250 mΩ - Equivalent on-resistance at IE = -1A / IB = -50mA; minimizes conduction loss in switching applications. |
| VCE(sat) | -450 mV max at IC = -2A / IB = -200mA - Confirmed saturation voltage under high-current drive; ensures efficient low-side switching. |
| hFE | 50 min at IC = -2A - Minimum DC current gain at full rated current; supports stable base drive design with margin. |
| TJ range | -55°C to +150°C - Full operational junction temperature range; qualified for under-hood automotive environments. |
| ESD HBM | 4000 V - Human Body Model rating per JEDEC JESD22-A114; reduces risk of assembly-line ESD damage. |
Pinout & Package
Package: U-DFN2020-6 (SWP), Type A - 2.0 mm × 2.0 mm × 0.6 mm low-profile, lead-free, halogen-free molded plastic package with wettable flanks and exposed collector pads on bottom side for thermal and mechanical robustness.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (C1) | Collector of Q1 | Exposed pad connection; must be soldered to large copper pour for thermal dissipation and electrical return path. |
| 2 (B2) | Base of Q2 | Control input for second transistor; requires current-limited drive to ensure hFE-based saturation. |
| 3 (E2) | Emitter of Q2 | Common emitter node for Q2; tied to system ground or bias rail depending on switching topology. |
| 4 (E1) | Emitter of Q1 | Common emitter node for Q1; electrically isolated from E2 unless externally connected. |
| 5 (B1) | Base of Q1 | Control input for first transistor; shares no internal connection with B2-supports independent dual-channel operation. |
| 6 (C2) | Collector of Q2 | Second exposed collector pad; thermally and electrically identical to C1; requires symmetric PCB layout. |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualified | Validated for automotive use including temperature cycling, HTRB, and ESD stress-enables direct deployment in PPAP-controlled programs. |
| Wettable flank plating | Sidewall tin finish enables reliable automated optical inspection (AOI) of solder fillets-critical for zero-defect automotive manufacturing. |
| Dual-channel isolation | Electrically independent Q1 and Q2 with separate base/emitter/collector terminals-supports asymmetric drive and fault containment. |
| Low RCE(sat) | 250 mΩ measured at IE = -1A / IB = -50mA-reduces power loss by >30% vs. standard PNP BJTs in LED current sink applications. |
| Thermal-enhanced layout | Two exposed collector pads (C1/C2) allow ≥2.47 W total power dissipation with 28 mm × 28 mm 2 oz copper-enables compact high-power designs. |
Applications
| Automotive Matrix LED Headlamps | DC-DC Converter Bias Control |
|---|---|
|
Use Scenario: Dynamic pixel-level dimming in adaptive driving beam (ADB) headlamps using segmented LED arrays. IC Role / Device Role / Timing Role: Dual PNP current sink switch controlling individual LED strings; each channel independently modulated via PWM. Use Value: Low VCE(sat) minimizes heat generation in confined headlamp housings; AEC-Q101 compliance ensures 15-year field reliability. |
Use Scenario: Precision bias current sourcing for error amplifiers and reference circuits in automotive buck converters. IC Role / Device Role / Timing Role: High-stability PNP pair providing matched, temperature-compensated bias currents to op-amp inputs. Use Value: Tight hFE matching and -55°C to +150°C operation maintain regulation accuracy across engine bay thermal extremes. |
| Body Control Module Load Switching | Industrial LED Signage Drivers |
|
Use Scenario: Driving resistive and inductive loads (e.g., solenoids, relays, HVAC actuators) in centralized body control units. IC Role / Device Role / Timing Role: Dual high-voltage PNP switch enabling redundant or parallel load control with integrated protection. Use Value: -60V VCEO withstands load-dump transients up to ISO 7637-2 Pulse 5a; RCE(sat) < 250 mΩ limits self-heating during sustained 2A operation. |
Use Scenario: High-density outdoor LED signage requiring uniform brightness and long service life in variable ambient temperatures. IC Role / Device Role / Timing Role: Constant-current sink for RGB LED clusters, with independent channel control for color balancing. Use Value: Wettable flanks ensure solder joint integrity over 100,000 thermal cycles; halogen-free "Green" compound meets UL94V-0 and RoHS 3 mandates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual PNP switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ZXTP56020FDBQ-7 | -20V VCEO, same U-DFN2020-6 package, lower RCE(sat) (180 mΩ), reduced voltage margin | Restricted to 12V/24V systems only; unsuitable for 48V or load-dump tolerant designs | Select when operating voltage ≤ 20V and lowest possible conduction loss is prioritized over surge resilience. |
| DMT6009LPS-13 | Single-channel P-channel MOSFET, -60V VDS, 4.5 mΩ RDS(on), gate-driven instead of current-driven | Requires level-shifted gate drive; lacks inherent current gain; superior efficiency above 500 mA but higher complexity | Choose for high-frequency PWM (>100 kHz) or ultra-low-loss operation where gate driver integration is feasible. |
Compared with ZXTP56060FDBQ-7, ZXTP56020FDBQ-7 trades voltage headroom for lower on-resistance in low-voltage systems, while DMT6009LPS-13 replaces bipolar current drive with MOSFET voltage control-offering lower conduction loss but demanding additional gate bias circuitry and losing inherent current amplification.
Availability
ZXTP56060FDBQ-7 is available at Aetrix Electronics and suitable for automotive lighting control, body electronics load switching, and industrial LED driver designs requiring stable component supply, AEC-Q101 traceability, and RoHS 3 compliance.
Supply support for ZXTP56060FDBQ-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability components for automotive, industrial, and computing markets.
The ZXTP56060FDBQ-7 belongs to Diodes' AEC-Q101-qualified bipolar transistor family, engineered specifically for automotive power switching applications demanding high voltage tolerance, low saturation loss, and robust thermal performance in compact packages.
FAQ
What is the maximum allowable continuous power dissipation for ZXTP56060FDBQ-7 in a standard PCB layout?
At TA = +25°C with minimum recommended pad layout on single-sided 1.6 mm FR-4, the device dissipates up to 405 mW per channel (810 mW total) before exceeding its 150°C junction limit. With 28 mm × 28 mm 2 oz copper, it supports 2.47 W total-confirmed in Notes 6 & 8 of DS39605 Rev. 2–2.
Does ZXTP56060FDBQ-7 support independent biasing of each PNP channel?
Yes. Pins 1 (C1), 2 (B2), 3 (E2), 4 (E1), 5 (B1), and 6 (C2) are fully isolated-no internal connection exists between Q1 and Q2 bases or emitters. This allows separate base resistors, independent PWM signals, and fault isolation per channel as confirmed in the bottom-view pinout and absolute maximum ratings table.
Is the U-DFN2020-6 (SWP) package compatible with standard reflow profiles for lead-free soldering?
Yes. The device is fully RoHS 3 compliant and qualified for JEDEC J-STD-020 moisture sensitivity Level 1. Its matte tin terminals meet MIL-STD-202 Method 208 solderability requirements, and the 0.6 mm profile supports standard Pb-free reflow profiles with peak temperatures up to 260°C, as validated in Diodes' packaging documentation.
How does the -4000 V HBM ESD rating impact board-level design?
The 4000 V HBM rating (per JEDEC JESD22-A114) means the device withstands typical handling and assembly ESD events without external protection. No series resistors or TVS diodes are required on base lines for ESD hardening-reducing BOM count and layout area, as confirmed in the Absolute Maximum Ratings table and quality definitions page.
ZXTP56060FDBQ-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 6-UDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- 2 PNP (Dual)
- Current - Collector (Ic) (Max):
- 2A
- Voltage - Collector Emitter Breakdown (Max):
- 60V
- Vce Saturation (Max) @ Ib, Ic:
- 450mV @ 200mA, 2A
- Current - Collector Cutoff (Max):
- 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 170 @ 100mA, 2V
- Power - Max:
- 510mW
- Frequency - Transition:
- -
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- U-DFN2020-6
ZXTP56060FDBQ-7 FAQ
1.How can I place an order for ZXTP56060FDBQ-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for ZXTP56060FDBQ-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ZXTP56060FDBQ-7 reliable?
The price and inventory of ZXTP56060FDBQ-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ZXTP56060FDBQ-7 is usually 5 days.
3.What payment methods are accepted for ZXTP56060FDBQ-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ZXTP56060FDBQ-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ZXTP56060FDBQ-7?
ZXTP56060FDBQ-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ZXTP56060FDBQ-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ZXTP56060FDBQ-7?
For technical support, including ZXTP56060FDBQ-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ZXTP56060FDBQ-7 requirements.
6.How does Aetrix verify that ZXTP56060FDBQ-7 is sourced from the original manufacturer or authorized distributors?
All ZXTP56060FDBQ-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ZXTP56060FDBQ-7 meets industry standards.
7.What is the process for return or replacement of ZXTP56060FDBQ-7?
All ZXTP56060FDBQ-7 units undergo pre-shipment inspection (PSI). If there is an issue with ZXTP56060FDBQ-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ZXTP56060FDBQ-7 part is unused and in its original packaging.
Return procedure for ZXTP56060FDBQ-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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