Microchip Technology 1N8159US/TR
- Part No.:
- 1N8159US/TR
- Manufacturer:
- Microchip Technology
- Category:
- TVS Diodes
- Package:
- SQ-MELF, A
- Datasheet:
-
1N8159US/TR.pdf
- Description:
- LOW CAPACITANCE TVS
- Quantity:
- Payment:

- Shipping:

Inventory:9,589
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Product details
Overview
1N8159US/TR from Microsemi is a unidirectional transient voltage suppressor (TVS) diode designed for high-reliability, high-frequency circuit protection. It delivers 150 W peak pulse power at 10/1000 µs, features 4 pF capacitance, 18.0 V working standoff voltage (VWM), and clamps transients to ≤30.5 V at 11.7 A peak impulse current - ideal for ESD/EFT protection in RF front-ends and aerospace data links.
For engineers reviewing the 1N8159US/TR datasheet, 1N8159US/TR pinout, 1N8159US/TR application, or 1N8159US/TR equivalent, key selection criteria include low-capacitance transient suppression, hermetic glass packaging for radiation-hardened environments, Category 1 metallurgical bonding, IEC61000-4-2/4-4 compliance, and axial-leaded through-hole mounting compatibility.
Technical Context
This TVS employs a unique series-connected rectifier diode in anti-parallel configuration with the avalanche junction to achieve ultra-low 4 pF total capacitance while maintaining unidirectional operation. Its voidless hermetically sealed hard-glass package ensures stable performance across −55 °C to +175 °C junction temperature range and supports MIL-STD-750 Method 1020 ESD immunity.
The device operates with 0.5 µA maximum standby current at 18.0 V VWM, breaks down at 20.9–23.1 V (min/max), and exhibits a +0.092 %/°C temperature coefficient of breakdown voltage - enabling predictable clamping behavior under thermal stress in avionics and satellite subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VWM | 18.0 V - Maximum continuous reverse voltage before leakage exceeds 0.5 µA; sets operating margin for signal line protection. |
| V(BR) min/max | 20.9 / 23.1 V - Breakdown occurs within this range at 1 mA; defines precise overvoltage trip threshold. |
| VC @ IPP | 30.5 V @ 11.7 A - Clamping voltage during 10/1000 µs surge; limits downstream IC stress to safe levels. |
| CT | 4 pF - Total terminal capacitance at 0 V; preserves signal integrity in >1 GHz RF paths and high-speed serial interfaces. |
| PPP | 150 W - Peak pulse power rating per 10/1000 µs waveform; enables robust lightning-level surge handling per IEC61000-4-5. |
| TJ range | −55 to +175 °C - Full operational junction temperature span; qualified for space-grade and engine-control applications. |
| αV(BR) | +0.092 %/°C - Predictable positive drift of breakdown voltage with temperature; simplifies thermal derating in sealed enclosures. |
Pinout & Package
Package: Axial-leaded, voidless hermetically sealed hard-glass case with tungsten slugs; cathode band marked on body; RoHS-compliant matte tin plating over copper leads; weight ≈340 mg.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Transient current sink (reverse-biased path) | Connected to protected line; conducts surge energy to ground when voltage exceeds VWM. |
| Cathode | Reference node (marked band) | Connected to system ground or low-impedance return; establishes polarity-sensitive clamping direction. |
Key Features
| Feature | Design Value |
|---|---|
| Low capacitance architecture | 4 pF achieved via integrated anti-parallel rectifier - preserves bandwidth in 5G RF front-ends and high-speed data lines. |
| Category 1 metallurgical bond | Internal high-reliability bond structure qualified for mission-critical systems including satellites and flight controls. |
| Hermetic glass sealing | Voidless construction prevents moisture ingress and parametric shift over 20+ year field life in harsh environments. |
| IEC61000-4-2/4-4 compliance | Validated ESD (±15 kV air, ±8 kV contact) and EFT (40 A, 5/50 ns) immunity - meets industrial and aerospace immunity standards. |
| Radiation hardness | Inherently resistant to TID and SEE per Microsemi MicroNote 050 - suitable for LEO/MEO orbital electronics without shielding overhead. |
Applications
| RF Transceiver Protection | Aerospace Data Bus |
|---|---|
Use Scenario: Protecting 2.4 GHz Wi-Fi/BLE antenna feedlines from ESD events during handling and deployment. IC Role / Device Role / Timing Role: Unidirectional TVS clamp placed between antenna port and RF switch/LNA input. Use Value: 4 pF capacitance avoids detuning antenna impedance; 30.5 V clamping prevents LNA damage without degrading noise figure. | Use Scenario: Safeguarding ARINC 429 or MIL-STD-1553B data lines against induced surges in aircraft avionics bays. IC Role / Device Role / Timing Role: Line-end transient suppressor on differential data pair, grounded at chassis via low-inductance path. Use Value: 150 W PPP rating handles lightning-induced transients; hermetic seal ensures reliability across 10,000+ thermal cycles. |
| Satellite Command Receiver | Downhole Oilfield Sensor |
Use Scenario: Shielding S-band command receiver inputs from electrostatic discharge during launch vehicle integration. IC Role / Device Role / Timing Role: First-stage protection element ahead of RF filter and demodulator IC. Use Value: Radiation hardness eliminates need for redundant shielding; −55 °C to +175 °C rating covers orbital thermal extremes. | Use Scenario: Protecting RS-485 communication lines in high-temperature oil/gas wellhead controllers (up to 175 °C ambient). IC Role / Device Role / Timing Role: Bidirectional protection implemented using two 1N8159US/TR devices in anti-parallel configuration. Use Value: Dual-device arrangement achieves <8 pF bidirectional capacitance while retaining full 150 W surge capability per polarity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar transient suppression applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMCJ18A | Surface-mount DO-214AB package; 6.5 pF capacitance; 1500 W peak power; 20.0 V VWM; 29.2 V clamping at 51.0 A. | Higher capacitance limits use in >500 MHz circuits; higher power suits industrial AC mains but not RF-sensitive nodes. | Select when board space is constrained and RF bandwidth is below 300 MHz; verify layout parasitics do not degrade clamping speed. |
| 1N6322 | Axial-leaded, 150 W, 18 V VWM, 30.0 V clamping at 12.0 A, but 12 pF capacitance and non-hermetic epoxy package. | Lacks radiation hardness and long-term hermetic stability; unsuitable for space or extended-life military deployments. | Acceptable for commercial-grade telecom infrastructure where cost and availability outweigh reliability requirements. |
Compared with SMCJ18A and 1N6322, the 1N8159US/TR uniquely combines ultra-low 4 pF capacitance, hermetic glass construction, Category 1 bonding, and radiation tolerance - making it the only option qualified for high-frequency, high-reliability, and radiation-intensive applications without design compromises.
Availability
1N8159US/TR is available at Aetrix Electronics and suitable for RF transceiver protection, aerospace data bus safeguarding, satellite command receiver hardening, and downhole sensor interface conditioning requiring stable component supply across extended product lifecycles.
Supply support for 1N8159US/TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability, radiation-hardened, and secure analog/mixed-signal solutions for aerospace, defense, and industrial markets.
The 1N8159US/TR belongs to Microsemi's legacy high-reliability TVS family, engineered specifically for mission-critical transient protection where failure is not an option - emphasizing hermeticity, low capacitance, and environmental survivability over cost or general-purpose utility.
FAQ
What is the clamping voltage of the 1N8159US/TR at its rated peak impulse current?
The 1N8159US/TR clamps to a maximum of 30.5 V when subjected to its rated 11.7 A peak impulse current (IPP) under the standard 10/1000 µs waveform. This value is guaranteed across the full operating temperature range and ensures downstream components remain within safe voltage limits during surge events. The 1N8159US/TR maintains consistent clamping performance due to its stable avalanche characteristics and hermetic construction.
Is the 1N8159US/TR suitable for bidirectional transient protection?
The 1N8159US/TR is inherently unidirectional, but bidirectional protection can be implemented by connecting two 1N8159US/TR devices in anti-parallel configuration - as documented in Microsemi's Figure 5. This arrangement doubles the effective capacitance to 8 pF while preserving 150 W per-polarity surge capability and enabling symmetrical clamping on both signal polarities. No single-device bidirectional variant exists in this series.
Does the 1N8159US/TR meet IEC61000-4-5 for lightning surge immunity?
Yes, the 1N8159US/TR provides secondary lightning surge protection per select levels of IEC61000-4-5, enabled by its 150 W peak pulse power rating at the 10/1000 µs waveform and robust 30.5 V clamping voltage. It is intended for use in conjunction with primary protection stages (e.g., gas discharge tubes) in telecom and avionics interfaces where coordinated staging is required to meet Level 3 or Level 4 test requirements.
What is the thermal resistance and steady-state power rating of the 1N8159US/TR?
The 1N8159US/TR has a thermal resistance of 150 °C/W from junction to ambient and a steady-state average power rating of 1.0 W at 25 °C ambient temperature. This rating assumes adequate PCB thermal management - such as copper pour and thermal vias - to prevent junction temperature from exceeding +175 °C. Derating is required above 25 °C per the published derating curve in the datasheet.
How does the 1N8159US/TR achieve its 4 pF capacitance?
The 1N8159US/TR achieves its ultra-low 4 pF capacitance through a proprietary internal architecture that places a rectifier diode in series and opposite polarity to the main TVS junction. This configuration cancels displacement current during normal operation while preserving fast avalanche response during transients. The result is minimal signal distortion in high-frequency applications - a feature confirmed in Microsemi's T4-LDS-xxxx characterization data.
1N8159US/TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Package/Case:
- SQ-MELF, A
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 1
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 18V
- Voltage - Breakdown (Min):
- 20.9V
- Voltage - Clamping (Max) @ Ipp:
- 30.5V
- Current - Peak Pulse (10/1000µs):
- 4.92A
- Power - Peak Pulse:
- 150W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -55°C ~ 175°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- A, SQ-MELF
1N8159US/TR FAQ
1.How can I place an order for 1N8159US/TR through Aetrix?
Please submit a Request for Quotation (RFQ) for 1N8159US/TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 1N8159US/TR reliable?
The price and inventory of 1N8159US/TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 1N8159US/TR is usually 5 days.
3.What payment methods are accepted for 1N8159US/TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 1N8159US/TR transactions.
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1N8159US/TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 1N8159US/TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 1N8159US/TR?
For technical support, including 1N8159US/TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 1N8159US/TR requirements.
6.How does Aetrix verify that 1N8159US/TR is sourced from the original manufacturer or authorized distributors?
All 1N8159US/TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 1N8159US/TR meets industry standards.
7.What is the process for return or replacement of 1N8159US/TR?
All 1N8159US/TR units undergo pre-shipment inspection (PSI). If there is an issue with 1N8159US/TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 1N8159US/TR part is unused and in its original packaging.
Return procedure for 1N8159US/TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
1N8159US/TR Tags

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ESD9B5.0ST5G
onsemi

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DESD3V3E1BL-7B
Diodes Incorporated

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onsemi

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Diodes Incorporated

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D5V0P1B2LP-7B
Diodes Incorporated

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DESD5V0U1BA-7
Diodes Incorporated

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ESD5Z5.0T1G
onsemi

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DESD5V0U1BB-7
Diodes Incorporated

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D12V0L1B2LP-7B
Diodes Incorporated

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Nexperia USA Inc.

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Toshiba Semiconductor and Storage

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Diodes Incorporated
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