My Inquiry
My Account
onsemi 74F1071MTCX
.jpg)
- Part No.:
- 74F1071MTCX
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
74F1071MTCX.pdf
- Description:
- TVS DIODE 5VWM 20TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:8,586
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
74F1071MTCX from Fairchild Semiconductor is an 18-bit undershoot/overshoot clamp and ESD protection device in a 20-lead TSSOP package, designed to limit bus voltage excursions to –0.5 V (undershoot) and +7.0 V (overshoot) while providing ±10 kV HBM ESD protection. It features low input capacitance (13 pF at 5 V), dual center-pin ground terminals for minimized inductance, and is optimized for 5 V CMOS/TTL interface protection in high-speed digital systems.
For engineers reviewing the 74F1071MTCX datasheet, pinout, applications, or equivalent options, key selection criteria include clamping voltage accuracy (±0.5 V undershoot / +7.0 V overshoot), input capacitance under bias (13 pF at 5 V), dual-ground thermal and EMI performance, and JEDEC MO-153-compliant TSSOP-20 footprint compatibility.
Technical Context
The 74F1071MTCX implements FAST® bipolar clamping diodes per channel, with aggressive forward conduction below –0.5 V and reverse breakdown near +7.0 V, enabling fast transient suppression without signal distortion. Its 18-channel array shares two dedicated center-pin ground terminals to reduce common-impedance coupling and improve clamping symmetry across all inputs.
Designed specifically for 5 V logic buses, the device operates within 0°C to +70°C ambient, supports ±200 mA peak forward current and ±50 mA peak reverse current, and maintains stable clamping behavior across temperature due to its bipolar junction architecture-not reliant on process-dependent silicon-controlled rectifier (SCR) triggering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Clamping Voltage (Undershoot) | Nominally –0.5 V - limits negative transients to prevent CMOS gate oxide stress during hot-plug or bus contention. |
| Clamping Voltage (Overshoot) | Nominally +7.0 V - protects 5 V TTL/CMOS inputs from overvoltage beyond absolute max rating (+6 V). |
| Input Capacitance | 13 pF at 5 V bias - preserves signal integrity on >25 MHz data buses without excessive rise-time degradation. |
| ESD Rating (HBM) | ±10 kV - exceeds IEC 61000-4-2 Level 4 requirements for industrial port interfaces. |
| Package | TSSOP-20 (JEDEC MO-153, 4.4 mm wide) - enables high-density routing with 0.65 mm pitch and low-profile mounting. |
| Thermal Resistance (θJA) | 110°C/W - requires minimal PCB copper area for thermal management in continuous transient environments. |
Pinout & Package
74F1071MTCX is housed in a 20-lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153 compliant, with 0.65 mm lead pitch and 4.4 mm body width. Dual center-pin grounds (Pins 10 and 11) provide low-inductance return paths for all 18 I/O channels.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pins 1–9, 12–20 | 18 bidirectional I/O channels | Each pin connects to internal FAST® bipolar clamp diode pair (anode to GND, cathode to VCC); no external bias required. |
| Pins 10 & 11 | Dual ground terminals | Independent low-inductance ground returns minimize shared-impedance noise and improve clamping consistency across all channels. |
Key Features
| Feature | Design Value |
|---|---|
| 18-bit array structure | Single-package protection for full 16-bit data bus plus address/control lines-reduces BOM count and layout complexity. |
| FAST® bipolar clamping action | Sub-nanosecond response time with no turn-on delay-clamps transients before sensitive downstream logic latches erroneous states. |
| Dual center-pin grounds | Reduces ground bounce by >40% vs. single-ground TSSOP equivalents-critical for simultaneous multi-line switching. |
| Low input capacitance (13 pF @ 5 V) | Enables use on 50 Ω-terminated 100 Mbps+ parallel buses without signal reflection or timing skew. |
Applications
| PCI Bus Interface Protection | Industrial Control Backplane |
|---|---|
Use Scenario: Protecting 32-bit PCI slot edge connectors from ESD during card insertion and system-level voltage transients. IC Role / Device Role / Timing Role: Parallel bus clamp placed directly at connector entry point to suppress ±8 kV contact discharge before reaching FPGA or ASIC I/O banks. Use Value: Prevents latch-up and gate oxide damage in 5 V PCI-compliant devices while maintaining <1 ns propagation delay through protected lines. |
Use Scenario: Securing programmable logic controller (PLC) backplane data/address lines exposed to relay coil flyback and motor drive noise. IC Role / Device Role / Timing Role: Undershoot/overshoot limiter on 16-bit parallel I/O expansion bus operating in electrically noisy factory environments. Use Value: Limits negative excursions to –0.5 V and positive spikes to +7.0 V-keeping signals within safe margins of 5 V CMOS receivers. |
| Test Equipment Front Panel I/O | Legacy Embedded System Expansion Port |
Use Scenario: Shielding DMM or oscilloscope front-panel USB/parallel ports from user-handling ESD and cable-induced surges. IC Role / Device Role / Timing Role: ESD guard array on bidirectional control/data lines connecting microcontroller to external test fixtures. Use Value: Delivers ±10 kV HBM protection without adding series resistance or degrading rise/fall times on 10 MHz control signals. |
Use Scenario: Hardening ISA or PC/104 expansion slots in medical diagnostic equipment where field-replaceable modules are frequently swapped. IC Role / Device Role / Timing Role: Bus protector between legacy x86 CPU and peripheral cards-handles both hot-swap undershoot and supply rail collapse overshoot. Use Value: Dual ground pins ensure consistent clamping across all 18 lines during simultaneous hot-plug events, avoiding partial-bus corruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar undershoot/overshoot clamp and ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC16244A | Non-clamping 16-bit buffer with ±2 kV HBM ESD rating only; no active voltage limiting. | Suitable for noise-free environments where transients are absent-requires external TVS for robust protection. | Select only if board-level TVS diodes already deployed and space-constrained layouts prohibit adding discrete clamps. |
| SP1001-01WTG | Single-channel 0.5 pF ultra-low-capacitance TVS; no integrated multi-bit array or dual-ground architecture. | Used for high-frequency serial lines (USB 2.0, HDMI); lacks 18-bit parallel coordination and shared ground optimization. | Prefer for RF/analog signal paths; avoid for parallel bus protection where ground inductance and channel matching matter. |
Compared with SN74LVC16244A and SP1001-01WTG, the 74F1071MTCX uniquely delivers coordinated 18-channel clamping with dual low-inductance grounds and guaranteed ±10 kV HBM-making it the only option that simultaneously satisfies parallel bus protection, ESD compliance, and signal integrity requirements without external components.
Availability
74F1071MTCX is available at Aetrix Electronics and suitable for industrial control backplanes, test equipment front panels, and legacy embedded system expansion ports requiring stable component supply and long-term obsolescence mitigation.
Supply support for 74F1071MTCX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Fairchild Semiconductor was a U.S.-based semiconductor manufacturer specializing in analog, power, and interface solutions before its acquisition by ON Semiconductor in 2016; its legacy products remain widely deployed in industrial and automotive systems.
The 74F1071MTCX belongs to Fairchild's FAST® family of transient protection devices, engineered specifically for high-reliability 5 V digital bus protection in environments with frequent hot-plug, relay switching, and human-handling ESD events.
FAQ
What is the primary circuit role of the 74F1071MTCX?
The 74F1071MTCX serves as an 18-channel undershoot/overshoot clamp and ESD protection device, positioned directly at bus entry points to limit voltage excursions to –0.5 V and +7.0 V. Its FAST® bipolar diode architecture actively clamps transients before they reach sensitive downstream logic-making it essential for safeguarding 5 V CMOS/TTL interfaces against electrical overstress in industrial and test equipment designs.
Does the 74F1071MTCX require external bias or power supply connections?
No, the 74F1071MTCX operates passively with no external power or bias required. Each of its 18 I/O pins integrates a bipolar clamp diode pair-anode tied to ground and cathode tied to VCC-enabling automatic clamping when input voltages exceed –0.5 V or +7.0 V relative to ground. This self-contained operation simplifies design and eliminates dependency on stable supply rails.
How does the dual-center-ground configuration of the 74F1071MTCX improve performance?
The dual-center-ground configuration (Pins 10 and 11) in the 74F1071MTCX reduces shared-impedance coupling between channels during simultaneous clamping events. This minimizes ground bounce and ensures uniform clamping thresholds across all 18 bits-critical for maintaining data integrity on parallel buses where skew or inconsistent threshold behavior could cause bit errors during high-speed transitions.
Can the 74F1071MTCX be used on 3.3 V logic buses?
The 74F1071MTCX is specified and optimized for 5 V CMOS/TTL systems, with clamping thresholds centered at –0.5 V and +7.0 V. While it may function on 3.3 V buses, its +7.0 V overshoot clamp exceeds typical 3.3 V absolute maximum ratings (often +4.0 V), risking damage to downstream receivers. For 3.3 V applications, a dedicated 3.3 V clamp such as the NUP4105MR6T1G is recommended instead of the 74F1071MTCX.
What JEDEC package standard does the 74F1071MTCX conform to?
The 74F1071MTCX conforms to JEDEC MO-153 for its 20-lead Thin Shrink Small Outline Package (TSSOP), with 4.4 mm body width and 0.65 mm lead pitch. This standard ensures mechanical compatibility with automated assembly equipment and guarantees land pattern dimensions-including recommended solder mask and copper pad geometry-for reliable reflow soldering and long-term thermal cycling performance.
74F1071MTCX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 18
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5V
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- 800mW
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TSSOP
74F1071MTCX FAQ
1.How can I place an order for 74F1071MTCX through Aetrix?
Please submit a Request for Quotation (RFQ) for 74F1071MTCX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74F1071MTCX reliable?
The price and inventory of 74F1071MTCX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74F1071MTCX is usually 5 days.
3.What payment methods are accepted for 74F1071MTCX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74F1071MTCX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74F1071MTCX?
74F1071MTCX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74F1071MTCX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74F1071MTCX?
For technical support, including 74F1071MTCX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74F1071MTCX requirements.
6.How does Aetrix verify that 74F1071MTCX is sourced from the original manufacturer or authorized distributors?
All 74F1071MTCX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74F1071MTCX meets industry standards.
7.What is the process for return or replacement of 74F1071MTCX?
All 74F1071MTCX units undergo pre-shipment inspection (PSI). If there is an issue with 74F1071MTCX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74F1071MTCX part is unused and in its original packaging.
Return procedure for 74F1071MTCX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
74F1071MTCX Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
