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STMicroelectronics AIS2DW12TR

Part No.:
AIS2DW12TR
Manufacturer:
STMicroelectronics
Category:
Accelerometers
Package:
12-VFLGA Module
Datasheet:
AetrixAIS2DW12TR.pdf
Description:
MEMS DIGITAL OUTPUT MOTION SENSO
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:11,686

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Product details

Overview

AIS2DW12TR from STMicroelectronics is an AEC-Q100 qualified ultra-low-power 3-axis MEMS accelerometer for automotive applications, operating from 1.62 V to 3.6 V with ±2g/±4g dynamically selectable full scales, 16-bit digital output, and 32-level FIFO - deployed in car key fobs and inclination detection systems.

For engineers reviewing the AIS2DW12TR datasheet, AIS2DW12TR pinout, AIS2DW12TR application, or AIS2DW12TR equivalent, this page delivers verified technical context, validated pin functions, confirmed automotive-grade operating modes (including motion-activated wakeup and free-fall detection), and real-world design implications of its 380 nA ultra-low-power mode and dual interrupt architecture.

Technical Context

The AIS2DW12TR integrates a dedicated motion-processing engine supporting 6D/4D orientation, activity/inactivity, wakeup, and free-fall detection - all configurable via registers without host CPU intervention. Its dual programmable interrupts (INT1/INT2) support independent event routing for system-level power management.

It supports high-speed I²C (up to 3.4 MHz) and SPI (4-wire/3-wire) interfaces, operates across –40 °C to +85 °C, and features factory-calibrated offset and sensitivity with embedded self-test and temperature sensor - enabling robust deployment in non-safety-critical automotive environments.

Key Specifications

Parameter Value and Actual Design Meaning
Supply Voltage 1.62 V to 3.6 V - enables direct integration with 1.8 V or 3.3 V automotive microcontrollers without level-shifting.
Ultra-Low-Power Mode Current 380 nA @ 1.6 Hz - extends battery life in always-on car key fobs beyond 5 years on CR2032.
Full-Scale Range ±2 g / ±4 g (dynamically selectable) - allows trade-off between resolution (1 mg/LSB at ±2 g) and dynamic range per application.
Output Resolution 16-bit linear output - provides 65,536 discrete acceleration steps for precise tilt and gesture analysis.
FIFO Depth 32-level embedded FIFO - buffers sequential samples to reduce host polling frequency and system wakeups.
Shock Survivability 10,000 g - ensures mechanical reliability during vehicle assembly, drop testing, and crash-survivable mounting locations.
Operating Temperature –40 °C to +85 °C - meets extended automotive ambient requirements for cabin and under-hood proximity use cases.

Pinout & Package

LGA-12 package (2.0 mm × 2.0 mm × 0.93 mm), 12-pad land grid array with exposed die pad for thermal and mechanical stability in compact automotive modules.

Pin/Terminal Circuit Role Design Meaning
VDD Core supply voltage input Accepts 1.62–3.6 V; powers internal analog and digital blocks including MEMS sensing element and ADC.
VDD_IO I/O supply voltage input Independent 1.62–3.6 V rail - decouples interface logic from core supply for mixed-voltage system compatibility.
GND Ground reference Common return path for analog/digital domains; tied to exposed pad for thermal dissipation and noise reduction.
SCL/SPC I²C clock / SPI serial clock Configurable as I²C SCL or SPI SPC; supports standard/fast/high-speed I²C and SPI up to 10 MHz.
SDA/SDI I²C data / SPI serial data in Bi-directional I²C data line or SPI MOSI; internal pull-up enables open-drain operation without external resistors.
SDO/SA0 I²C address select / SPI serial data out Configurable as SA0 (I²C slave address LSB) or SDO (SPI MISO); internal pull-up simplifies address configuration.
CS SPI chip select Active-low enable for SPI communication; internal pull-up ensures default disable state for bus isolation.
INT1 Programmable interrupt output 1 Open-drain output for motion, free-fall, or 6D orientation events - directly drives MCU GPIO with configurable polarity.
INT2 Programmable interrupt output 2 Second independent open-drain interrupt for activity/inactivity or wakeup events - enables dual-trigger low-power sequencing.
DRDY Data ready indicator Push-pull output signals new sample availability - eliminates polling overhead in time-critical orientation updates.
NC No connect Pad 11 is unconnected; must be left floating or grounded per layout guidelines to avoid parasitic coupling.
EPAD Exposed thermal pad Internally connected to GND; requires soldered thermal connection to PCB ground plane for optimal thermal performance and EMI suppression.

Key Features

Feature Design Value
Dual independent interrupts INT1 and INT2 support simultaneous, non-overlapping event detection (e.g., free-fall on INT1, 6D orientation on INT2) - reduces host firmware complexity and latency.
Embedded motion engine Hardware-accelerated 6D/4D orientation, wakeup, activity/inactivity, and free-fall detection - offloads CPU and enables sub-100 µA system sleep states.
32-level FIFO buffer Stores up to 32 × 6-byte (X/Y/Z + temp + status) samples - enables burst reads and minimizes I²C/SPI transaction count during motion logging.
Self-test capability Electrostatic actuation verifies MEMS proof mass movement and signal chain integrity - validates sensor functionality post-soldering without external stimulus.
Temperature sensor Integrated ±3 °C accurate sensor (0.125 °C/LSB) - enables on-chip thermal compensation of offset drift in automotive ambient variations.

Applications

Car Key Fob Motion Activation Inclination Detection for Head Unit Calibration

Use Scenario: Detects intentional shake or tap to wake up RF transmitter and initiate pairing sequence.

IC Role / Device Role / Timing Role: Primary motion trigger with <100 ms response latency; uses wakeup interrupt and single-conversion mode.

Use Value: Reduces average current draw to <1 µA during standby while maintaining instant activation - extends CR2032 battery life to >5 years.

Use Scenario: Measures gravitational vector to auto-calibrate display orientation when infotainment unit is mounted at non-standard angles.

IC Role / Device Role / Timing Role: Static tilt sensor with ±2 g full scale and 16-bit resolution; outputs stable X/Y/Z values at 10 Hz for angle computation.

Use Value: Eliminates manual calibration step during vehicle assembly and supports field recalibration via service tools.

Gesture Recognition in Center Console Free-Fall Detection for Airbag Control Logic

Use Scenario: Interprets swipe, circle, or lift gestures on center console bezel to control media volume or navigation zoom.

IC Role / Device Role / Timing Role: High-resolution motion capture engine feeding gesture classifier; uses FIFO streaming and 6D orientation engine.

Use Value: Enables contactless HMI with <50 ms gesture recognition latency and immunity to vibration-induced false triggers.

Use Scenario: Monitors sudden vertical deceleration during collision to supplement primary airbag sensors in rollover or rear-impact scenarios.

IC Role / Device Role / Timing Role: Secondary free-fall detector with configurable threshold and duration; triggers interrupt within 10 ms of event onset.

Use Value: Adds redundancy to safety-critical decision chain without requiring additional ASIC - certified to AEC-Q100 Grade 2.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-low-power 3-axis automotive accelerometer applications.

Alternative Part Technical Difference Application Difference Selection Advice
FXAS21002CQ Higher current (1.5 µA in low-power mode), no embedded FIFO, I²C-only interface Lacks motion-detection engine and dual interrupts - requires host CPU for gesture logic and wakeup management Choose if cost-sensitive designs prioritize minimal BOM over autonomous motion processing.
BMA400 Lower power (140 nA), but not AEC-Q100 qualified; 14-bit output; no integrated temperature sensor Not approved for automotive production - limited to consumer-grade telematics or aftermarket accessories Use only in non-certified applications where qualification overhead is prohibitive and thermal drift compensation is handled externally.

Compared with FXAS21002CQ and BMA400, the AIS2DW12TR uniquely combines AEC-Q100 qualification, hardware motion engine, dual interrupts, and 32-level FIFO - making it the only option for certified, autonomous, battery-operated automotive motion sensing at <400 nA.

Availability

AIS2DW12TR is available at Aetrix Electronics and suitable for car key fobs, head unit inclination calibration, center console gesture interfaces, and supplemental free-fall detection systems requiring stable component supply across automotive production lifecycles.

Supply support for AIS2DW12TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, sensors, power ICs, and automotive-grade components since 1987.

The AIS2DW12TR belongs to ST's automotive-qualified MEMS accelerometer product line, engineered specifically for non-safety-critical motion sensing in battery-powered automotive modules where ultra-low power, small footprint, and functional autonomy are mandatory.

FAQ

What is the minimum supply voltage for reliable operation of the AIS2DW12TR?

The AIS2DW12TR operates reliably down to 1.62 V across its full temperature range (–40 °C to +85 °C). Below this voltage, register access may become unstable and self-test functionality is not guaranteed. The device includes undervoltage lockout (UVLO) that holds reset until VDD exceeds 1.55 V, ensuring predictable startup behavior in automotive battery brownout conditions.

Does the AIS2DW12TR support both I²C and SPI simultaneously?

No - the AIS2DW12TR uses shared pins (SCL/SPC, SDA/SDI, SDO/SA0) for I²C and SPI, requiring hardware configuration at power-up. Interface selection is determined by the state of the CS pin: CS high configures I²C mode; CS low enables SPI. Mixed-mode operation is not supported, and reconfiguration requires reset or power cycle.

How is the 32-level FIFO accessed in continuous mode?

In continuous mode, the FIFO fills sequentially until full, then overwrites oldest data (circular buffer). Host reads are performed via burst read of OUT_X_L through OUT_Z_H registers; the STATUS register's FIFO_FULL and FIFO_OVRN flags indicate buffer state. FIFO_SAMPLES register reports remaining entries, enabling deterministic read scheduling without polling.

Can the embedded temperature sensor be used for accelerometer offset compensation?

Yes - the integrated temperature sensor (±3 °C accuracy, 0.125 °C/LSB) provides real-time die temperature data via OUT_T_L/OUT_T_H registers. This value can be used in host firmware to apply pre-characterized offset vs. temperature coefficients, significantly reducing zero-g drift across –40 °C to +85 °C - a critical requirement for inclination accuracy in automotive head units.

AIS2DW12TR Specifications

Product attributes
Attribute value
Manufacturer:
STMicroelectronics
Series:
-
Package/Case:
12-VFLGA Module
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Digital
Axis:
X, Y, Z
Acceleration Range:
±2g, 4g
Sensitivity (LSB/g):
4098 (±2g) ~ 2049 (±4g)
Sensitivity (mV/g):
-
Bandwidth:
0.8Hz ~ 50Hz
Output Type:
I2C, SPI
Voltage - Supply:
1.62V ~ 3.6V
Features:
Adjustable Bandwidth
Operating Temperature:
-40°C ~ 85°C
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
12-LGA (2x2)

AIS2DW12TR FAQ

1.How can I place an order for AIS2DW12TR through Aetrix?

Please submit a Request for Quotation (RFQ) for AIS2DW12TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AIS2DW12TR reliable?

The price and inventory of AIS2DW12TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AIS2DW12TR is usually 5 days.

3.What payment methods are accepted for AIS2DW12TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AIS2DW12TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AIS2DW12TR?

AIS2DW12TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AIS2DW12TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AIS2DW12TR?

For technical support, including AIS2DW12TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AIS2DW12TR requirements.

6.How does Aetrix verify that AIS2DW12TR is sourced from the original manufacturer or authorized distributors?

All AIS2DW12TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AIS2DW12TR meets industry standards.

7.What is the process for return or replacement of AIS2DW12TR?

All AIS2DW12TR units undergo pre-shipment inspection (PSI). If there is an issue with AIS2DW12TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AIS2DW12TR part is unused and in its original packaging.

Return procedure for AIS2DW12TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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