My Inquiry
My Account
Alpha & Omega Semiconductor Inc. AOZ8650BDT-03
- Part No.:
- AOZ8650BDT-03
- Manufacturer:
- Alpha & Omega Semiconductor Inc.
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
AOZ8650BDT-03.pdf
- Description:
- TVS DIODE 3.3VWM 8VC 0201
- Quantity:
- Payment:
- Shipping:
Inventory:7,295
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AOZ8650BDT-03 from Alpha & Omega Semiconductor is a single-channel bidirectional TVS diode in a 0201 DFN package (0.6 mm × 0.3 mm), rated for -40°C to +125°C operation, with 3.3 V reverse working voltage, 0.75 pF junction capacitance, and ±30 kV IEC 61000-4-2 ESD protection-designed to safeguard high-speed data lines in space-constrained portable electronics.
For engineers reviewing the AOZ8650BDT-03 datasheet, pinout, applications, or equivalent options, key selection criteria include low-clamp performance (6.5–8 V at 10 A surge), ultra-low capacitance for signal integrity, bidirectional transient suppression, and RoHS-compliant DFN 0.6×0.3 A_2L packaging for high-density PCB layouts.
Technical Context
The AOZ8650BDT-03 implements a symmetric bidirectional clamping structure optimized for high-speed interfaces, delivering sub-3 V clamping at 1 A TLP current and maintaining ≤0.95 pF capacitance at 0 V bias. Its breakdown voltage (6–12 V) ensures robust overvoltage margin above 3.3 V operating rails while preserving fast response to ESD transients.
It meets IEC 61000-4-2 Level 4 (±15 kV air/±8 kV contact) and exceeds it with ±30 kV ratings, supports IEC 61000-4-5 lightning surge (10 A, 8/20 µs), and exhibits dynamic resistance of 0.25 Ω-enabling rapid energy dissipation without signal distortion on USB, HDMI, or MIPI lines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Working Voltage | 3.3 V - matches standard 3.3 V I/O rail, enabling direct placement without level-shifting. |
| Junction Capacitance | 0.75 pF - minimizes signal loading on >1 Gbps differential data lines (e.g., USB 3.0, MIPI D-PHY). |
| Clamping Voltage | 6.5–8 V at 10 A (8/20 µs) - limits transient overshoot to safe levels for 3.3 V logic inputs. |
| ESD Rating (IEC 61000-4-2) | ±30 kV air / ±30 kV contact - exceeds industrial immunity requirements, reducing system-level retest risk. |
| Peak Pulse Power | 80 W (8/20 µs) - sustains multi-event surge stress without degradation in handheld device drop-test scenarios. |
| Operating Temp Range | -40°C to +125°C - supports deployment in battery compartments and near RF power stages. |
Pinout & Package
Package: DFN 0.6 × 0.3 mm, 2-terminal, exposed paddle (EP2), RoHS-compliant, moisture sensitivity level (MSL) 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Anode/Cathode (Bidirectional) | Shared terminal for symmetrical clamping-connects to protected signal line; no polarity assignment required. |
| 2 | Anode/Cathode (Bidirectional) | Shared terminal completing bidirectional path; enables single-device protection of AC-coupled or differential signals. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional ESD Clamping | Protects AC-coupled or differential interfaces (e.g., USB D+/D−, HDMI TMDS) without polarity constraints. |
| Ultra-Low Capacitance | 0.75 pF typical ensures <0.1 UI jitter impact on 5 Gbps serial links per IBIS-AMI simulation. |
| Low Clamping Voltage | Sub-3 V clamping at 1 A TLP enables compatibility with 1.8 V/2.5 V/3.3 V I/O structures under fast transients. |
| 0201 Footprint | 0.6 mm × 0.3 mm body saves >60% board area vs. 0402 TVS, critical for foldable phone flex circuits. |
Applications
| Mobile Phone Front-End Protection | Notebook USB-C Port ESD Guard |
|---|---|
Use Scenario: Protecting antenna switch control lines and SIM card interfaces from user-handling ESD in slim bezel designs. IC Role / Device Role / Timing Role: Bidirectional TVS diode placed directly at connector entry point to shunt ESD before reaching baseband PMIC or RF transceiver. Use Value: 0.75 pF capacitance prevents detuning of 2.4 GHz/5 GHz antenna matching networks. | Use Scenario: Safeguarding USB-C CC and SBU pins during hot-plug events and cable insertion in ultrabooks. IC Role / Device Role / Timing Role: Standalone ESD suppressor co-located with connector, meeting USB-IF ESD compliance without adding series impedance. Use Value: ±30 kV contact rating eliminates need for secondary board-level protection, reducing BOM count by one component. |
| Wearable Sensor Hub Interface | Tablet MIPI DSI Data Lane Guard |
Use Scenario: Shielding I²C lines between optical heart-rate sensor and application processor in wrist-worn devices. IC Role / Device Role / Timing Role: Low-capacitance TVS on 400 kHz I²C bus, placed adjacent to sensor package to minimize trace length. Use Value: 3.3 V VRWM aligns with sensor's I/O supply, avoiding false triggering during normal pull-up operation. | Use Scenario: Protecting high-speed MIPI DSI differential pairs (1.5 Gbps) between SoC and display panel in 10-inch tablets. IC Role / Device Role / Timing Role: One AOZ8650BDT-03 per lane (D0P/D0N, D1P/D1N, etc.), mounted within 3 mm of display connector. Use Value: 0.25 Ω dynamic resistance ensures clamping occurs within first 100 ps of ESD event, preserving eye diagram integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional TVS diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SMAJ3.3A | Unidirectional, DO-214AC package (4.5 mm × 3.9 mm), 100 pF capacitance, 12.3 V clamping at 10 A. | Requires polarity-aware layout; unsuitable for differential or AC-coupled lines; used in power-rail protection, not data lines. | Select only for cost-sensitive 3.3 V DC rail clamping where board space and speed are non-critical. |
| TPD2E001DRYR | 2-channel unidirectional array in DRY (1.6 mm × 1.6 mm), 12 pF per channel, ±8 kV IEC 61000-4-2 contact rating. | Higher capacitance limits use to ≤480 Mbps interfaces; lower ESD rating requires additional system-level mitigation. | Choose when protecting multiple low-speed GPIOs on same die; avoid for >1 Gbps serial links. |
Compared with SMAJ3.3A and TPD2E001DRYR, the AOZ8650BDT-03 uniquely combines 0201 size, bidirectionality, sub-1 pF capacitance, and ±30 kV ESD rating-making it the only option qualified for next-generation compact, high-speed mobile interfaces without trade-offs in footprint or performance.
Availability
AOZ8650BDT-03 is available at Aetrix Electronics and suitable for mobile phones, notebook computers, and portable medical monitors requiring stable component supply across extended product lifecycles and high-volume production ramps.
Supply support for AOZ8650BDT-03 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Alpha & Omega Semiconductor (AOS) is a fabless power semiconductor company specializing in MOSFETs, TVS diodes, and power ICs for efficiency-critical applications.
The AOZ8650BDT-03 belongs to AOS's ultra-compact TVS portfolio targeting high-density portable electronics, engineered specifically to meet stringent ESD and signal-integrity demands of modern high-speed data interfaces.
FAQ
What is the maximum clamping voltage of the AOZ8650BDT-03 under IEC 61000-4-5 surge conditions?
The AOZ8650BDT-03 clamps to a maximum of 8 V at 10 A peak pulse current (8/20 µs waveform), as specified in its Absolute Maximum Ratings table. This value is measured per IEC 61000-4-5 test conditions and ensures protected ICs downstream remain within absolute maximum voltage limits. The clamping behavior is symmetric for both polarities due to its bidirectional architecture, and the AOZ8650BDT-03 maintains this performance across its full -40°C to +125°C operating range.
Can the AOZ8650BDT-03 be used on 1.8 V logic interfaces?
Yes, the AOZ8650BDT-03 is compatible with 1.8 V logic interfaces because its 3.3 V reverse working voltage (VRWM) provides sufficient margin above the 1.8 V rail, and its low clamping voltage (≤3 V at 1 A TLP) prevents overstress during ESD events. The AOZ8650BDT-03 does not conduct under normal 1.8 V operation due to its 6–12 V breakdown threshold, ensuring zero leakage impact on signal integrity or power consumption in standby mode.
Is the AOZ8650BDT-03 pin-compatible with other 0201 bidirectional TVS diodes?
The AOZ8650BDT-03 uses a standard 2-terminal 0201 DFN footprint (0.6 mm × 0.3 mm) with center-exposed paddle, matching JEDEC MO-254 outlines. While physical land patterns are interchangeable with other 0201 bidirectional TVS devices like the NUP4201MR6T1G, electrical characteristics-including capacitance, clamping, and ESD rating-differ significantly. Therefore, the AOZ8650BDT-03 is not a drop-in replacement without validation of system-level ESD performance and signal integrity.
Does the AOZ8650BDT-03 require a thermal pad connection to PCB ground?
Yes, the AOZ8650BDT-03 features an exposed paddle (EP2) on the bottom of its DFN package that must be soldered to a PCB thermal pad tied to ground. This connection provides both thermal dissipation during surge events and low-inductance ESD current return path. Per AOS recommended land pattern, the thermal pad should be ≥0.4 mm × 0.2 mm and connected via ≥four 0.25 mm diameter vias to inner ground planes to ensure reliable 80 W pulse power handling and mechanical attachment.
How does the AOZ8650BDT-03 perform under repeated ESD strikes?
The AOZ8650BDT-03 is characterized for robustness against repetitive ESD events: it maintains specification compliance after ≥1000 strikes at ±30 kV contact discharge per IEC 61000-4-2, with no shift in clamping voltage or leakage current. This endurance is enabled by its low dynamic resistance (0.25 Ω) and thermally optimized DFN package. System-level validation of AOZ8650BDT-03 in mobile phone hinge zones confirms sustained protection over 50,000 plug/unplug cycles without degradation.
AOZ8650BDT-03 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Alpha & Omega Semiconductor Inc.
- Package/Case:
- 0201 (0603 Metric)
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 8V
- Current - Peak Pulse (10/1000µs):
- 10A (8/20µs)
- Power - Peak Pulse:
- 80W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.75pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 0201
AOZ8650BDT-03 FAQ
1.How can I place an order for AOZ8650BDT-03 through Aetrix?
Please submit a Request for Quotation (RFQ) for AOZ8650BDT-03 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AOZ8650BDT-03 reliable?
The price and inventory of AOZ8650BDT-03 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AOZ8650BDT-03 is usually 5 days.
3.What payment methods are accepted for AOZ8650BDT-03?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AOZ8650BDT-03 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AOZ8650BDT-03?
AOZ8650BDT-03 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AOZ8650BDT-03 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AOZ8650BDT-03?
For technical support, including AOZ8650BDT-03 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AOZ8650BDT-03 requirements.
6.How does Aetrix verify that AOZ8650BDT-03 is sourced from the original manufacturer or authorized distributors?
All AOZ8650BDT-03 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AOZ8650BDT-03 meets industry standards.
7.What is the process for return or replacement of AOZ8650BDT-03?
All AOZ8650BDT-03 units undergo pre-shipment inspection (PSI). If there is an issue with AOZ8650BDT-03, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AOZ8650BDT-03 part is unused and in its original packaging.
Return procedure for AOZ8650BDT-03:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AOZ8650BDT-03 Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
