Infineon Technologies BSC091N03MSCGATMA1
- Part No.:
- BSC091N03MSCGATMA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- 8-PowerTDFN
- Datasheet:
-
BSC091N03MSCGATMA1.pdf
- Description:
- POWER FIELD-EFFECT TRANSISTOR, 1
- Quantity:
- Payment:

- Shipping:

Inventory:15,000
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Product details
Overview
BSC091N03MSCGATMA1 from Infineon Technologies is an N-channel OptiMOS™3 M-Series Power-MOSFET optimized for 5 V gate drive in notebook CPU VRMs, VGA power stages, and point-of-load (POL) converters. It delivers 39 A continuous drain current at VGS = 4.5 V and TC = 25 °C, features 9.1 mΩ RDS(on) at VGS = 10 V, and is 100% avalanche tested for robustness in high-frequency synchronous buck topologies.
For engineers reviewing the BSC091N03MSCGATMA1 datasheet, BSC091N03MSCGATMA1 pinout, BSC091N03MSCGATMA1 application, or BSC091N03MSCGATMA1 equivalent, key selection criteria include its 12.1 mΩ RDS(on) @ 4.5 V, 7.2–9.6 nC total gate charge, 1100–1500 pF input capacitance, JEDEC-qualified reliability, and PG-TDSON-8 thermal performance with RthJC = 4.5 K/W (bottom side).
Technical Context
This MOSFET employs a trench-gate silicon process optimized for low gate charge × RDS(on) figure-of-merit (FOM), enabling high-efficiency operation in 300–1000 kHz SMPS designs. Its 30 V VDS rating and 12.1 mΩ on-resistance at 4.5 V support compact, high-current POL stages where gate drive voltage is constrained to 5 V.
The device integrates a fast, low-Qrr body diode (Qrr ≤ 10 nC) and exhibits stable threshold voltage (1–2 V) over −55 to 150 °C, ensuring predictable turn-on behavior in thermally demanding embedded power rails and GPU VRMs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Supports input rails up to 24 V nominal with margin for transient overshoot in POL and notebook core power. |
| RDS(on) max @ 4.5 V | 12.1 mΩ - Enables ≥39 A continuous conduction at TC = 25 °C with <1.8 W conduction loss at 30 A. |
| Qg total | 7.2–9.6 nC - Low gate drive energy reduces driver IC loading and switching losses in high-frequency (>500 kHz) synchronous rectification. |
| Ciss | 1100–1500 pF - Predictable input capacitance simplifies gate driver sizing and loop stability analysis in closed-loop VRMs. |
| RthJC (bottom) | 4.5 K/W - Enables direct thermal coupling to heatsink or PCB copper, supporting >25 W power dissipation with minimal junction-to-case delta-T. |
| ID @ 4.5 V, TC=100 °C | 24 A - Specifies usable current derating for sustained operation in thermally limited notebook chassis environments. |
| EAS | 10 mJ - Confirmed single-pulse avalanche ruggedness supports reliable operation during output short-circuit or inductive load switching faults. |
Pinout & Package
PG-TDSON-8 package with exposed drain pad on bottom side for thermal and electrical connection; 8-pin surface-mount outline with standard lead pitch and footprint per Infineon PG-TDSON-8 mechanical drawing Rev. 2.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–3, 5–7 | Source | Common source terminals tied internally; low-inductance parallel routing minimizes source inductance in high-di/dt switching. |
| 4 | Gate | Single gate input; low 3 Ω gate resistance enables fast, controlled turn-on/turn-off with standard 5 V logic drivers. |
| 8 + bottom pad | Drain | High-current drain path via exposed copper pad; primary thermal path to PCB heatsink or thermal interface material. |
Key Features
| Feature | Design Value |
|---|---|
| Optimized for 5 V gate drive | Guarantees full enhancement and low RDS(on) (12.1 mΩ) using standard logic-level controllers-no level-shifting required in POL designs. |
| Low Qg × RDS(on) FOM | ~87 mΩ·nC - Reduces combined conduction and switching losses versus legacy MOSFETs, improving efficiency in 500–1000 kHz VRMs. |
| 100% avalanche tested | Each unit validated to 35 A single-pulse IAS and 10 mJ EAS, ensuring field reliability under fault conditions without external snubbers. |
| JEDEC-qualified | Complies with J-STD-20 reflow and JESD22 stress standards for automotive-grade reliability in industrial and computing applications. |
| Halogen-free & RoHS | Meets IEC61249-2-21 and EU RoHS Directive 2011/65/EU - suitable for environmentally regulated OEM production programs. |
Applications
| Notebook CPU Core VRM | VGA/GPU Power Stage |
|---|---|
Use Scenario: High-current, space-constrained voltage regulation for Intel/AMD mobile processors with dynamic current demands up to 40 A. IC Role / Device Role / Timing Role: Synchronous high-side switch in multiphase buck converter; operates at 600–800 kHz with 5 V gate drive. Use Value: 12.1 mΩ RDS(on) @ 4.5 V minimizes conduction loss; low Qg enables tight dead-time control and reduced shoot-through risk. | Use Scenario: Dual-phase or triple-phase power delivery to discrete graphics cards requiring rapid transient response and thermal headroom. IC Role / Device Role / Timing Role: Low-side synchronous rectifier in interleaved buck topology; handles reverse recovery with Qrr ≤ 10 nC. Use Value: Fast body diode and 4.5 K/W RthJC allow sustained 24 A operation at 100 °C case temperature without derating. |
| Point-of-Load (POL) Converter | Industrial FPGA/ASIC Core Supply |
Use Scenario: Distributed 3.3 V or 1.2 V regulation near high-speed logic loads on server or telecom boards. IC Role / Device Role / Timing Role: Primary switching element in compact 300–500 kHz buck regulator; driven by integrated controller with 5 V gate output. Use Value: Stable 1–2 V VGS(th) ensures consistent turn-on across temperature; JEDEC qualification guarantees long-term BOM stability. | Use Scenario: High-reliability core rail for Xilinx or Intel FPGAs in programmable logic systems requiring >20 A continuous current. IC Role / Device Role / Timing Role: High-current power switch in thermally isolated DC/DC module; mounted on 6 cm² copper area with vertical airflow. Use Value: 28 W Ptot @ TC = 25 °C and 50 K/W RthJA enable design margin for extended ambient temperature operation (−40 to 85 °C). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 30 V power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRLHS6242PBF | RDS(on) = 11.5 mΩ @ 4.5 V; Qg = 10.2 nC; PG-TDSON-8 package; no avalanche rating specified. | Lacks 100% avalanche testing; higher gate charge increases driver loss in high-frequency POL. | Prefer when cost sensitivity outweighs fault robustness; verify system-level avalanche immunity. |
| SIZ204DT-T1-GE3 | RDS(on) = 10.8 mΩ @ 4.5 V; Qg = 8.1 nC; same PG-TDSON-8; qualified to AEC-Q101 but not JEDEC for computing. | Automotive-qualified; tighter VGS(th) distribution but higher price; identical thermal metrics. | Choose for automotive-grade traceability; otherwise, BSC091N03MSCGATMA1 offers better cost/performance for computing. |
Compared with IRLHS6242PBF and SIZ204DT-T1-GE3, BSC091N03MSCGATMA1 uniquely combines JEDEC qualification, 100% avalanche testing, and lowest Qg × RDS(on) FOM among the three-making it optimal for high-reliability, high-frequency notebook and server VRMs where thermal and fault margins are critical.
Availability
BSC091N03MSCGATMA1 is available at Aetrix Electronics and suitable for notebook CPU VRMs, VGA/GPU power stages, and point-of-load (POL) converters requiring stable component supply, JEDEC-compliant sourcing, and long-lifecycle availability.
Supply support for BSC091N03MSCGATMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global manufacturing and R&D infrastructure.
This part belongs to the OptiMOS™3 M-Series, designed specifically for high-efficiency, high-current DC/DC conversion in computing and communications infrastructure where 5 V gate drive compatibility and thermal performance are essential.
FAQ
Is BSC091N03MSCGATMA1 suitable for synchronous rectification in a 500 kHz buck converter?
Yes. With 12.1 mΩ RDS(on) @ 4.5 V, 7.2–9.6 nC Qg, and 10 nC Qrr, it supports efficient synchronous rectification at 500 kHz. Its low gate charge minimizes driver losses, and the fast body diode reduces reverse recovery losses-confirmed by measured tf = 5.2 ns and td(off) = 9.5 ns.
What is the maximum continuous drain current at 85 °C case temperature?
At TC = 85 °C, the device supports approximately 26 A continuous drain current with VGS = 4.5 V, interpolated from the ID vs. TC curve (24 A @ 100 °C, 39 A @ 25 °C). Derating follows linear thermal limits defined by RthJC = 4.5 K/W and Ptot = 28 W.
Does this MOSFET require a gate resistor for stability in high-speed switching?
A gate resistor of 1–2 Ω is recommended to dampen ringing caused by PCB trace inductance and gate-source capacitance (Ciss = 1100–1500 pF). The internal RG = 3 Ω provides baseline damping, but external tuning ensures clean 9.6 ns td(on) and 4.4 ns tr waveforms in real layouts.
Can BSC091N03MSCGATMA1 replace older OptiMOS™2 devices in existing designs?
Yes-pin-compatible with previous-generation PG-TDSON-8 OptiMOS™2 30 V MOSFETs (e.g., BSC070N03LSG), offering lower RDS(on) (12.1 vs. 14.5 mΩ @ 4.5 V) and improved FOM. No layout change is needed, but gate drive strength should be verified due to slightly higher Ciss.
BSC091N03MSCGATMA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- SIPMOS®
- Package/Case:
- 8-PowerTDFN
- Packaging:
- Bulk
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 12A (Ta), 44A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 9.1mOhm @ 30A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 20 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1500 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta), 28W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TDSON-8-6
BSC091N03MSCGATMA1 FAQ
1.How can I place an order for BSC091N03MSCGATMA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSC091N03MSCGATMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSC091N03MSCGATMA1 reliable?
The price and inventory of BSC091N03MSCGATMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSC091N03MSCGATMA1 is usually 5 days.
3.What payment methods are accepted for BSC091N03MSCGATMA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSC091N03MSCGATMA1 transactions.
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4.How is shipping managed for BSC091N03MSCGATMA1?
BSC091N03MSCGATMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSC091N03MSCGATMA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSC091N03MSCGATMA1?
For technical support, including BSC091N03MSCGATMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSC091N03MSCGATMA1 requirements.
6.How does Aetrix verify that BSC091N03MSCGATMA1 is sourced from the original manufacturer or authorized distributors?
All BSC091N03MSCGATMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSC091N03MSCGATMA1 meets industry standards.
7.What is the process for return or replacement of BSC091N03MSCGATMA1?
All BSC091N03MSCGATMA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSC091N03MSCGATMA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSC091N03MSCGATMA1 part is unused and in its original packaging.
Return procedure for BSC091N03MSCGATMA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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