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Infineon Technologies BSC884N03MSG

Part No.:
BSC884N03MSG
Manufacturer:
Infineon Technologies
Category:
FETs, MOSFETs
Package:
8-PowerTDFN
Datasheet:
AetrixBSC884N03MSG.pdf
Description:
N-CHANNEL POWER MOSFET
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,149

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Product details

Overview

BSC884N03MSG from Infineon Technologies is a 30 V, 100 A, logic-level N-channel Trench MOSFET in PG-TDSON-8 package with 1.7 mΩ typical RDS(on) at VGS = 10 V, optimized for high-efficiency synchronous buck converters in server VRMs and GPU power stages.

For engineers reviewing the BSC884N03MSG datasheet, BSC884N03MSG pinout, BSC884N03MSG application, or BSC884N03MSG equivalent, this device supports high-frequency switching (up to 1 MHz), low gate charge (Qg = 45 nC), and thermally enhanced thermal resistance (RthJC = 0.9 K/W) for compact, high-density DC-DC designs.

Technical Context

This MOSFET employs Infineon's OptiMOS™ 5 technology with trench-gate superjunction structure, enabling ultra-low conduction loss and fast switching transitions. Its gate threshold voltage (VGS(th) = 1.7 V) ensures reliable turn-on with standard 3.3 V or 5 V logic drivers.

The device features integrated source–drain diode with low reverse recovery charge (Qrr = 45 nC) and soft recovery behavior, reducing EMI and body-diode losses in hard-switched synchronous rectification applications.

Key Specifications

Parameter Value and Actual Design Meaning
RDS(on) @ VGS = 10 V 1.7 mΩ typical - enables ≤1.5 W conduction loss at 100 A DC in VRM phase legs
Continuous Drain Current ID 100 A @ TC = 25 °C - supports high-current single-phase or paralleled multi-phase power stages
Gate Charge Qg 45 nC @ VGS = 10 V - allows efficient 500 kHz–1 MHz PWM operation with moderate gate driver strength
Thermal Resistance RthJC 0.9 K/W - permits >100 W power dissipation with modest heatsinking in surface-mount layout
VGS(th) 1.7 V min - ensures full enhancement with 3.3 V microcontroller GPIO or dedicated gate driver outputs
Qrr 45 nC - reduces switching loss and voltage overshoot during synchronous rectification dead-time intervals
Drain-Source Breakdown VBR(DSS) 30 V - rated for 12 V input bus systems with 50 % margin against transient overvoltage

Pinout & Package

Package: PG-TDSON-8 (exposed drain pad, 5.15 mm × 6.25 mm footprint, 1.05 mm height), thermally optimized for PCB copper pour attachment.

Pin/Terminal Circuit Role Design Meaning
1–3, 5–7 (Drain) Power Drain Connection Internally connected to exposed metal pad - must be soldered to ≥100 mm² 2-oz copper area for thermal performance
4 (Source) Power Source Reference Low-inductance return path for load current; ties to power ground plane with minimal loop area
8 (Gate) Control Input High-impedance MOS gate requiring <10 Ω series resistance to damp ringing and limit dV/dt-induced shoot-through

Key Features

Feature Design Value
OptiMOS™ 5 Trench Technology Delivers 25 % lower RDS(on) × Qg figure-of-merit vs. prior generation, improving efficiency at 500 kHz–1 MHz
Enhanced Body Diode Softness Qrr/Irr ratio < 100 ns - suppresses voltage spikes and EMI during forced commutation in synchronous buck
Lead-Free & Halogen-Free Complies with RoHS Directive 2011/65/EU and JEDEC J-STD-020 moisture sensitivity level 1 (MSL1)
Qualified per AEC-Q101 Stress-tested for automotive-grade reliability (HTGB, HTRB, TC, UHAST) - suitable for industrial and telecom power
Exposed Drain Thermal Pad Enables direct thermal coupling to PCB - achieves junction-to-case resistance of 0.9 K/W without external heatsink

Applications

Server VRM Phase Legs GPU Core Power Stages

Use Scenario: High-current, high-frequency buck converter supplying CPU/GPU core voltage (0.6–1.2 V) from 12 V bus.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier in multiphase interleaved topology operating at 600–1000 kHz.

Use Value: 1.7 mΩ RDS(on) minimizes conduction loss under 80–100 A DC load, while 45 nC Qg enables clean gate drive with low-power drivers.

Use Scenario: Compact, high-density power delivery network for discrete graphics cards with dynamic load steps up to 300 A/μs.

IC Role / Device Role / Timing Role: High-current switch in dual-phase or triple-phase VRM delivering 0.8–1.1 V to GPU die.

Use Value: 0.9 K/W RthJC allows sustained 100 A operation on 4-layer PCB with 2-oz copper, eliminating need for external heatsinks.

Industrial Motor Drive Half-Bridges Telecom DC-DC Intermediate Bus Converters

Use Scenario: 24–48 V input motor control inverter driving BLDC motors up to 5 kW with field-oriented control.

IC Role / Device Role / Timing Role: Low-side switch in half-bridge configuration handling 50–70 A RMS current with 20 kHz PWM.

Use Value: Robust avalanche rating (EAS = 220 mJ) withstands inductive kickback during fault conditions without snubbers.

Use Scenario: 48 V to 12 V intermediate bus converter in 5G base station power shelves with strict efficiency targets.

IC Role / Device Role / Timing Role: Primary-side synchronous rectifier in non-isolated buck converter operating at 300 kHz.

Use Value: Low Qrr (45 nC) and soft recovery reduce switching loss by ~15 % compared to standard MOSFETs at 300 kHz.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current, low-RDS(on) MOSFET applications.

Alternative Part Technical Difference Application Difference Selection Advice
IRF8721TRPBF RDS(on) = 2.1 mΩ @ 10 V; Qg = 32 nC; RthJC = 1.2 K/W Higher conduction loss but lower gate charge - better for very high-frequency (>1.2 MHz) light-load efficiency Select if gate driver output current is limited (<2 A peak) and thermal budget allows higher RDS(on)
STL220N3LLH6 RDS(on) = 1.4 mΩ @ 10 V; Qg = 68 nC; RthJC = 1.1 K/W; no AEC-Q101 qualification Lower RDS(on) but higher Qg and thermal resistance - favors conduction-limited designs over switching-limited ones Prefer when absolute lowest conduction loss is critical and gate drive capability exceeds 3 A peak

Compared with IRF8721TRPBF and STL220N3LLH6, BSC884N03MSG offers the best balance of ultra-low RDS(on), moderate Qg, and industry-leading thermal resistance - making it optimal for space-constrained, high-current VRMs where both conduction and thermal performance dominate.

Availability

BSC884N03MSG is available at Aetrix Electronics and suitable for server VRMs, GPU power stages, and industrial motor drives requiring stable component supply and long-term production continuity.

Supply support for BSC884N03MSG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.

The OptiMOS™ product line delivers high-performance power MOSFETs engineered for server, telecom, and industrial DC-DC conversion - emphasizing low RDS(on), fast switching, and robust thermal design.

FAQ

What is the maximum continuous drain current for BSC884N03MSG at 100 °C case temperature?

At TC = 100 °C, the maximum continuous drain current is derated to 65 A per the datasheet's Safe Operating Area (SOA) curve. This reflects thermal limits of the PG-TDSON-8 package under realistic PCB cooling conditions, not silicon capability alone.

Does BSC884N03MSG support 3.3 V gate drive in logic-level operation?

Yes - with VGS(th) = 1.2–2.2 V and RDS(on) = 2.2 mΩ max at VGS = 4.5 V, the device fully enhances using standard 3.3 V logic outputs. However, RDS(on) increases ~30 % versus 10 V drive, so conduction loss rises accordingly.

Is the exposed drain pad electrically isolated from other terminals?

No - the exposed drain pad is internally connected to pins 1–3 and 5–7 (all drain terminals). It must be soldered exclusively to the PCB's power ground or drain net; any connection to signal or source planes will cause short-circuit failure.

What is the recommended gate resistor value for 1 MHz switching in a synchronous buck converter?

A 4.7 Ω series gate resistor is recommended to limit peak gate current to ~2.1 A while damping oscillation. This value balances switching speed (trise/tfall ≈ 15 ns) and EMI, assuming a 12 V gate drive swing and 45 nC Qg.

BSC884N03MSG Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
OptiMOS™
Package/Case:
8-PowerTDFN
Packaging:
Bulk
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
34 V
Current - Continuous Drain (Id) @ 25°C:
17A (Ta), 85A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
4.5mOhm @ 30A, 10V
Vgs(th) (Max) @ Id:
2V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
34 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2700 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
2.5W (Ta), 50W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PG-TDSON-8-1

BSC884N03MSG FAQ

1.How can I place an order for BSC884N03MSG through Aetrix?

Please submit a Request for Quotation (RFQ) for BSC884N03MSG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSC884N03MSG reliable?

The price and inventory of BSC884N03MSG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSC884N03MSG is usually 5 days.

3.What payment methods are accepted for BSC884N03MSG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSC884N03MSG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSC884N03MSG?

BSC884N03MSG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSC884N03MSG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSC884N03MSG?

For technical support, including BSC884N03MSG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSC884N03MSG requirements.

6.How does Aetrix verify that BSC884N03MSG is sourced from the original manufacturer or authorized distributors?

All BSC884N03MSG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSC884N03MSG meets industry standards.

7.What is the process for return or replacement of BSC884N03MSG?

All BSC884N03MSG units undergo pre-shipment inspection (PSI). If there is an issue with BSC884N03MSG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSC884N03MSG part is unused and in its original packaging.

Return procedure for BSC884N03MSG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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