Infineon Technologies BSL716SNH6327XTSA1
- Part No.:
- BSL716SNH6327XTSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- SOT-23-6 Thin, TSOT-23-6
- Datasheet:
-
BSL716SNH6327XTSA1.pdf
- Description:
- MOSFET N-CH 75V 2.5A TSOP-6
- Quantity:
- Payment:

- Shipping:

Inventory:2,876
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
BSL716SNH6327XTSA1 from Infineon Technologies is an N-channel logic-level enhancement-mode MOSFET in TSOP6 package, rated for 75 V VDS, 2.5 A continuous drain current at 25 °C, and 0.15 Ω RDS(on) at VGS = 10 V. It is AEC-Q101 qualified, avalanche-rated, and optimized for high-efficiency DC-DC converters and automotive body control modules.
For engineers reviewing the BSL716SNH6327XTSA1 datasheet, BSL716SNH6327XTSA1 pinout, BSL716SNH6327XTSA1 application, or BSL716SNH6327XTSA1 equivalent, key selection criteria include its 4.5 V logic-level gate drive compatibility, 33 mJ single-pulse avalanche energy, 2.5 A ID rating with derating above 70 °C, and integrated freewheeling diode with 29 ns trr.
Technical Context
This OptiMOS™ small-signal transistor uses trench-based silicon technology to achieve low RDS(on) and fast switching with controlled Qg (8.7–13.1 nC) and low Crss (19–29 pF). Its gate threshold voltage (0.8–1.8 V) ensures reliable turn-on with standard logic drivers.
The device integrates a robust body diode with 2.1 A continuous forward current and 58–73 nC Qrr, enabling efficient synchronous rectification and flyback operation without external diode supplementation in space-constrained designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 75 V - Maximum blocking voltage compatible with 48 V automotive and industrial bus systems |
| RDS(on) @ VGS=10 V | 150 mΩ max - Enables <150 mW conduction loss at 2.5 A, critical for thermal management on compact PCBs |
| ID continuous @ TA=25 °C | 2.5 A - Supports medium-power load switching in fan drivers and LED matrix controls |
| EAS | 33 mJ - Withstands inductive energy spikes in relay and solenoid drive circuits without failure |
| trr | 29–36 ns - Minimizes reverse recovery losses in high-frequency (>500 kHz) buck converters |
| Qg | 8.7–13.1 nC - Enables fast, low-loss switching with ≤6 Ω gate resistor and standard microcontroller GPIO |
| VGS(th) | 0.8–1.8 V - Ensures full enhancement at 3.3 V/5 V logic levels, eliminating need for level shifters |
Pinout & Package
TSOP6 (Thin Small Outline Package, 6-pin, 1.6 mm × 2.9 mm footprint) with exposed drain pad for thermal dissipation. Pin 1 marked by notch or dot; leads are gull-wing, surface-mount compatible.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Source) | Power return path for channel current | Connected to ground or low-side reference; ties directly to PCB copper pour for thermal relief |
| 2 (Gate) | Control terminal for channel modulation | High-impedance input requiring ESD protection; routed away from noisy traces to prevent false turn-on |
| 3 (Drain) | Main power output node | Internally connected to exposed pad; must be soldered to ≥6 cm² copper area for RthJA = 62.5 K/W |
| 4 (Source) | Redundant source connection | Parallel path to Pin 1 to reduce source inductance and improve switching stability |
| 5 (Drain) | Redundant drain connection | Second drain terminal sharing same internal die node; improves current sharing and thermal spreading |
| 6 (Gate) | Secondary gate terminal | Not used; internally tied to Pin 2 - must be left floating or grounded per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| AEC-Q101 qualification | Validated for automotive under-hood applications including temperature cycling, humidity, and mechanical shock |
| Logic-level gate drive (4.5 V) | Operates fully enhanced with 3.3 V or 5 V MCU outputs - eliminates gate driver IC in cost-sensitive designs |
| Avalanche-rated | Guarantees ruggedness against inductive kickback in motor and relay loads without external snubbers |
| Halogen-free & RoHS compliant | Meets IPC-J-STD-020 moisture sensitivity level 1 (MSL-1), enabling standard reflow without baking |
| Low Crss (19–29 pF) | Reduces Miller-induced shoot-through risk in half-bridge configurations and improves dv/dt immunity |
Applications
| Automotive Body Control Module | Industrial DC-DC Converter |
|---|---|
Use Scenario: Driving 12 V solenoids and window lift motors in door modules. IC Role / Device Role / Timing Role: Low-side switch controlling inductive loads with integrated freewheeling diode. Use Value: 33 mJ EAS withstands repeated inductive transients; 2.5 A rating supports peak currents up to 10 A pulsed. | Use Scenario: Synchronous rectifier in 48 V → 12 V isolated buck converter for telecom power supplies. IC Role / Device Role / Timing Role: Secondary-side power switch with fast trr and low Qg for >500 kHz operation. Use Value: 29 ns trr and 13.1 nC Qg minimize switching losses and enable high efficiency at light loads. |
| LED Matrix Driver | Smart Home Relay Interface |
Use Scenario: Row/column switching of high-brightness LED arrays in architectural lighting panels. IC Role / Device Role / Timing Role: Constant-current sink switch with PWM-compatible gate drive. Use Value: 0.15 Ω RDS(on) limits conduction loss to <100 mW per channel at 2.5 A, reducing thermal design burden. | Use Scenario: Solid-state replacement for electromechanical relays in HVAC zone controllers. IC Role / Device Role / Timing Role: Load-switching element interfacing microcontroller GPIO to 24 V AC/DC loads. Use Value: Logic-level VGS(th) ensures clean turn-on with 3.3 V MCU; halogen-free construction meets building safety codes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel logic-level MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3026LSD-13 | RDS(on) = 26 mΩ @ VGS = 10 V (lower), but VDS = 30 V only | Restricted to ≤30 V systems; unsuitable for 48 V automotive or industrial buses | Select only when voltage stress is ≤30 V and ultra-low RDS(on) is prioritized over ruggedness |
| IPD25N04S4-05 | VDS = 40 V, RDS(on) = 4.5 mΩ @ 10 V, TO-252 package | Larger footprint and higher thermal resistance; not TSOP6 drop-in compatible | Choose for higher current (25 A) needs where board space allows DPAK and thermal mass is available |
Compared with DMN3026LSD-13 and IPD25N04S4-05, BSL716SNH6327XTSA1 uniquely balances 75 V rating, TSOP6 compactness, AEC-Q101 compliance, and logic-level drive - making it optimal for space-constrained, automotive-grade 48 V load switches where reliability and footprint matter more than ultra-low RDS(on).
Availability
BSL716SNH6327XTSA1 is available at Aetrix Electronics and suitable for automotive body electronics, industrial DC-DC converters, LED matrix drivers, and smart home relay interfaces requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for BSL716SNH6327XTSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs, with global manufacturing and quality certification to ISO/TS 16949 and IATF 16949.
The OptiMOS™ small-signal transistor product line targets high-efficiency, space-constrained switching applications in automotive, industrial, and consumer systems - emphasizing logic-level drivability, ruggedness, and thermally optimized packaging.
FAQ
What is the maximum junction temperature and how does it affect continuous current rating?
The BSL716SNH6327XTSA1 has a maximum junction temperature of 150 °C. At ambient temperatures above 70 °C, the continuous drain current derates linearly from 2.5 A to 2.0 A due to thermal limitations of the TSOP6 package and PCB copper area. Derating curves are provided in Figure 1 of the datasheet Rev. 2.0.
Is this MOSFET suitable for use in a half-bridge configuration?
Yes - its low Crss (19–29 pF) and fast switching (td(off) = 50–75.5 ns) make it viable in half-bridge topologies. However, careful gate drive design and layout are required to suppress shoot-through; the device lacks integrated bootstrap diode or level-shifting, so external high-side gate driver support is necessary.
Does the integrated body diode support synchronous rectification?
Yes - the body diode has 2.1 A continuous forward current, 29–36 ns reverse recovery time, and 58–73 nC Qrr, enabling use in synchronous rectification for buck and flyback converters up to ~1 MHz. Its soft recovery characteristic reduces EMI compared to discrete Schottky alternatives.
What is the significance of the "H6327" marking on the device?
The "H6327" marking indicates Infineon's tape-and-reel packaging code: 3000 pieces per reel, non-dry pack, halogen-free, and compliant with JESD22-A114 Class 0 ESD handling. It is not a functional variant identifier - electrical specs match the base BSL716SN part number.
BSL716SNH6327XTSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- OptiMOS™
- Package/Case:
- SOT-23-6 Thin, TSOT-23-6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 75 V
- Current - Continuous Drain (Id) @ 25°C:
- 2.5A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 150mOhm @ 2.5A, 10V
- Vgs(th) (Max) @ Id:
- 1.8V @ 218µA
- Gate Charge (Qg) (Max) @ Vgs:
- 13.1 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 315 pF @ 25 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PG-TSOP6-6
BSL716SNH6327XTSA1 FAQ
1.How can I place an order for BSL716SNH6327XTSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for BSL716SNH6327XTSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for BSL716SNH6327XTSA1 reliable?
The price and inventory of BSL716SNH6327XTSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSL716SNH6327XTSA1 is usually 5 days.
3.What payment methods are accepted for BSL716SNH6327XTSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSL716SNH6327XTSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for BSL716SNH6327XTSA1?
BSL716SNH6327XTSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your BSL716SNH6327XTSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for BSL716SNH6327XTSA1?
For technical support, including BSL716SNH6327XTSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSL716SNH6327XTSA1 requirements.
6.How does Aetrix verify that BSL716SNH6327XTSA1 is sourced from the original manufacturer or authorized distributors?
All BSL716SNH6327XTSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSL716SNH6327XTSA1 meets industry standards.
7.What is the process for return or replacement of BSL716SNH6327XTSA1?
All BSL716SNH6327XTSA1 units undergo pre-shipment inspection (PSI). If there is an issue with BSL716SNH6327XTSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The BSL716SNH6327XTSA1 part is unused and in its original packaging.
Return procedure for BSL716SNH6327XTSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
BSL716SNH6327XTSA1 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …

