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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies BSP324L6327

Name: BSP324L6327
Brand: Infineon Technologies
SKU: BSP324L6327
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: BSP324L6327

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: TO-261-4, TO-261AA

Datasheet:: BSP324L6327.pdf

Description:: N-CHANNEL POWER MOSFET

Quantity:: RFQ Add To RFQ list

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Inventory:80,249

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Product details

Overview

BSP324L6327 from Infineon Technologies is an N-channel enhancement-mode logic-level SIPMOS™ power transistor in SOT-223 package, rated for 400 V V_DS, 25 Ω R_DS(on) at V_GS = 10 V and I_D = 0.17 A, with 6 kV/µs dv/dt immunity and integrated reverse diode. It serves as a low-power switching element in offline AC-DC auxiliary supplies and LED driver primary-side control circuits.

For engineers reviewing the BSP324L6327 datasheet, BSP324L6327 pinout, BSP324L6327 application, or BSP324L6327 equivalent, key selection criteria include its logic-level gate drive compatibility (V_GS(th) = 1.3–2.3 V), robust dv/dt rating for noisy environments, thermal resistance (R_thJA = 45–115 K/W depending on PCB layout), and AEC-Q101 qualification for automotive-grade reliability.

Technical Context

This discrete MOSFET operates in enhancement mode with a threshold voltage range of 1.3–2.3 V, enabling direct interface with 3.3 V or 5 V microcontrollers without level-shifting. Its 400 V breakdown voltage and 6 kV/µs dv/dt rating support use in flyback and buck-derived topologies with high-voltage transients.

The device integrates a monolithic body diode with 0.8–1.2 V forward voltage at 0.17 A and 85–127 ns reverse recovery time, allowing synchronous rectification in low-frequency (<100 kHz) applications where external diode replacement is acceptable. Thermal performance is defined for both minimal footprint (115 K/W) and 6 cm² copper area (45 K/W) configurations.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	400 V - supports operation across universal AC input (85–265 VAC) with margin for surge and ringing
R_DS(on)	25 Ω max at V_GS = 10 V, I_D = 0.17 A - defines conduction loss in low-current switching nodes
I_D (continuous)	0.17 A at T_A = 25 °C - sets maximum steady-state load current under natural convection
dv/dt immunity	6 kV/µs - prevents false turn-on during fast voltage transients in inductive loads or transformer leakage
V_GS(th)	1.3–2.3 V - ensures reliable turn-on with standard logic-level outputs (e.g., STM32 GPIO, PIC MCU)
P_tot	1.8 W at T_A = 25 °C - determines heatsinking requirement for continuous operation on FR4 PCB
Q_g	5.9 nC max - impacts gate driver power and switching speed in low-duty-cycle applications

Pinout & Package

SOT-223 package with exposed drain pad (Pin 4) for thermal conduction to PCB copper. Standard 4-pin configuration: Pin 1 = Gate, Pin 2 = Source, Pin 3 = Drain (tab), Pin 4 = Drain (soldering point).

Pin/Terminal	Circuit Role	Design Meaning
Pin 1	Gate	Control terminal; accepts logic-level voltage (≥2.3 V) to fully enhance channel
Pin 2	Source	Reference node for gate drive; connected to ground or low-side return path
Pin 3 & 4	Drain	High-side switching node; pins 3 and 4 are internally connected and thermally coupled to PCB copper area

Key Features

Feature	Design Value
N-channel enhancement mode	Zero conduction without gate bias - enables fail-safe off-state in power-loss scenarios
Logic-level gate drive	V_GS(th) ≤ 2.3 V - eliminates need for dedicated gate driver IC in ultra-low-power controllers
dv/dt rated	6 kV/µs immunity - suppresses parasitic turn-on in high-noise SMPS feedback loops or relay drivers
AEC-Q101 qualified	Validated for automotive ambient temperature range (−55 to +150 °C) and humidity exposure
Integrated body diode	V_SD = 0.8–1.2 V at 0.17 A - provides freewheeling path in inductive switching without external component

Applications

AC-DC Auxiliary Supply

LED Driver Primary Side

Use Scenario: Standby power generation in offline SMPS for TV, set-top box, or industrial HMI.

IC Role / Device Role / Timing Role: Low-duty-cycle high-voltage switch controlling energy transfer into auxiliary winding.

Use Value: 400 V rating accommodates reflected flyback voltage spikes up to 320 V while maintaining safety margin.

Use Scenario: Constant-voltage regulation stage in non-isolated LED drivers for signage or architectural lighting.

IC Role / Device Role / Timing Role: PWM-controlled series pass element modulating current through LED string.

Use Value: Logic-level gate allows direct drive from low-power MCU timers, reducing BOM count and board space.

Automotive Body Control Module

Industrial Sensor Interface

Use Scenario: Driving small solenoids or relays in door lock actuators or HVAC dampers.

IC Role / Device Role / Timing Role: High-side or low-side load switch controlled by CAN/LIN subsystem MCU.

Use Value: AEC-Q101 qualification and −55 to +150 °C operation ensure reliability in under-hood environments.

Use Scenario: Isolation and protection of analog sensor inputs exposed to field wiring transients.

IC Role / Device Role / Timing Role: Transient-suppressing switch decoupling sensor supply rail during ESD events.

Use Value: 6 kV/µs dv/dt rating prevents latch-up during fast-rising EFT bursts per IEC 61000-4-4.

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-current high-voltage switching applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STP3NK60ZFP	600 V V_DS, 4.5 Ω R_DS(on), TO-220FP package, higher current (3 A)	Requires heatsink; unsuitable for SMT-only designs or space-constrained layouts	Choose when higher power handling and lower R_DS(on) outweigh SMT compatibility needs
DMN3028LFG-7	30 V V_DS, 28 mΩ R_DS(on), SOT-23 package, logic-level, no AEC-Q101	Limited to low-voltage DC systems; lacks dv/dt rating and high-temp capability	Prefer only for battery-powered 3.3/5 V embedded peripherals with no transient stress

Compared with STP3NK60ZFP and DMN3028LFG-7, BSP324L6327 uniquely balances SOT-223 surface-mount compatibility, 400 V capability, AEC-Q101 qualification, and logic-level drive-making it optimal for cost-sensitive, space-limited automotive and industrial auxiliary power stages.

Availability

BSP324L6327 is available at Aetrix Electronics and suitable for AC-DC auxiliary supplies, LED driver primary-side control, automotive body electronics, and industrial sensor interface circuits requiring stable component supply and long-term manufacturability.

Supply support for BSP324L6327 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and industrial control ICs and discrete devices.

The BSP324 belongs to Infineon's SIPMOS™ family of low-voltage and medium-voltage power MOSFETs designed specifically for logic-level-driven, high-reliability switching in automotive and industrial auxiliary power applications.

FAQ

What is the maximum junction temperature for BSP324L6327?

The absolute maximum junction temperature is +150 °C, with continuous operation supported from −55 °C to +150 °C ambient per AEC-Q101 qualification. Derating curves show power dissipation drops to zero at +120 °C ambient on minimal footprint, confirming thermal limits must be respected in layout design.

Does BSP324L6327 have a built-in ESD protection diode?

Yes - it is rated Class 1A per JESD22-A114-HBM with ESD withstand voltage between >250 V and <500 V. This internal protection suffices for handling during assembly but does not replace system-level I/O ESD clamps for field-exposed interfaces.

Can BSP324L6327 be used in linear (analog) regulation mode?

No - it is optimized for switching operation only. Its R_DS(on) variation over temperature (up to 130 Ω at 180 °C) and limited Safe Operating Area (SOA) curve above 100 V make it unsuitable for sustained linear-mode biasing or constant-current source applications.

Is the drain tab electrically isolated from the PCB copper pour?

No - Pin 3 (drain tab) and Pin 4 (soldering point) are internally shorted and directly connected to the MOSFET's drain. When soldered to a PCB copper area, the drain becomes electrically and thermally coupled to that plane; isolation requires insulated mounting hardware or non-conductive thermal interface material.

BSP324L6327 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: SIPMOS®

Package/Case:: TO-261-4, TO-261AA

Packaging:: Bulk

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 400 V

Current - Continuous Drain (Id) @ 25°C:: 170mA (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 25Ohm @ 170mA, 10V

Vgs(th) (Max) @ Id:: 2.3V @ 94µA

Gate Charge (Qg) (Max) @ Vgs:: 5.9 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 154 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 1.8W (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-SOT223-4-21

BSP324L6327 FAQ

1.How can I place an order for BSP324L6327 through Aetrix?

Please submit a Request for Quotation (RFQ) for BSP324L6327 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSP324L6327 reliable?

The price and inventory of BSP324L6327 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP324L6327 is usually 5 days.

3.What payment methods are accepted for BSP324L6327?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP324L6327 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSP324L6327?

BSP324L6327 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSP324L6327 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSP324L6327?

For technical support, including BSP324L6327 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP324L6327 requirements.

6.How does Aetrix verify that BSP324L6327 is sourced from the original manufacturer or authorized distributors?

All BSP324L6327 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP324L6327 meets industry standards.

7.What is the process for return or replacement of BSP324L6327?

All BSP324L6327 units undergo pre-shipment inspection (PSI). If there is an issue with BSP324L6327, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSP324L6327 part is unused and in its original packaging.

Return procedure for BSP324L6327:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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