Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies BSP603S2LNT

Name: BSP603S2LNT
Brand: Infineon Technologies
SKU: BSP603S2LNT
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: BSP603S2LNT

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: TO-261-4, TO-261AA

Datasheet:: BSP603S2LNT.pdf

Description:: N-CHANNEL POWER MOSFET

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:30,123

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

BSP603S2LNT from Infineon Technologies is an AEC-Q101 qualified N-channel enhancement-mode MOSFET in SOT-223 package, rated for 60 V V_DS, 3.5 A I_D (T_C = 25°C), and R_DS(on) ≤ 120 mΩ at V_GS = 10 V. It serves as a low-side load switch in automotive body electronics, including door module actuators and LED lighting drivers.

For engineers reviewing the BSP603S2LNT datasheet, BSP603S2LNT pinout, BSP603S2LNT application, or BSP603S2LNT equivalent, key selection criteria include its AEC-Q101 qualification, 120 mΩ on-resistance at 10 V gate drive, 60 V blocking voltage, and SOT-223 thermal performance in constrained automotive PCB layouts.

Technical Context

This MOSFET employs planar silicon technology with optimized channel geometry to achieve stable R_DS(on) across temperature and gate voltage. Its threshold voltage V_GS(th) ranges from 1.0 V to 2.5 V, enabling compatibility with 3.3 V and 5 V logic-level microcontrollers.

The device features integrated ESD protection (HBM > 2 kV) and is characterized for operation from –40°C to +150°C junction temperature, supporting under-hood and interior automotive environments where transient immunity and thermal robustness are critical.

Key Specifications

Parameter	Value and Actual Design Meaning
V_DS	60 V - Maximum drain-source blocking voltage for 12 V automotive systems with load dump transients.
I_D (T_C = 25°C)	3.5 A - Continuous drain current rating at case temperature 25°C; derates to 2.2 A at 100°C.
R_DS(on) max @ V_GS = 10 V	120 mΩ - Ensures <1.5 W conduction loss at 3.5 A, suitable for thermally limited SOT-223 footprints.
V_GS(th)	1.0–2.5 V - Enables direct drive from standard MCU GPIO without level-shifting circuitry.
Q_g typ	7.5 nC - Low gate charge supports efficient PWM switching up to 100 kHz in LED dimming applications.
E_AS	120 mJ - Rated single-pulse avalanche energy enables robustness against inductive kickback in solenoid/relay driving.

Pinout & Package

Package: SOT-223 (TO-261AA), RoHS-compliant, Pb-free finish, qualified per IPC/JEDEC J-STD-020 for lead-free reflow.

Pin/Terminal	Circuit Role	Design Meaning
Pin 1 (Drain)	Main current path output	Internally connected to tab; requires thermal pad soldering for heatsinking in high-duty-cycle use.
Pin 2 (Gate)	Control input	High-impedance MOS gate; requires 100 Ω series resistor near driver to suppress ringing during fast switching.
Pin 3 (Source)	Reference node / return path	Common reference for gate drive and load current; must be routed with low-inductance trace to minimize shoot-through risk.
Tab (Drain)	Thermal & electrical connection	Exposed metal tab is electrically tied to Drain; provides primary thermal path to PCB copper pour.

Key Features

Feature	Design Value
AEC-Q101 qualified	Validated for automotive applications per stress test requirements including HTOL, TC, HTRB, and UHAST.
Low R_DS(on) at 4.5 V	190 mΩ max - Enables partial logic-level operation with 5 V microcontrollers without external gate drivers.
Enhancement-mode only	No inherent conduction at V_GS = 0 V - Eliminates need for pull-down resistors in fail-safe off-state designs.
Green product (RoHS)	Pb-free terminations and halogen-free mold compound - Complies with EU RoHS Directive 2011/65/EU and ELV requirements.

Applications

Automotive Door Module

LED Headlamp Dimming

Use Scenario: Driving window lift motors, mirror adjusters, and lock actuators in centralized door control units.

IC Role / Device Role: Low-side power switch controlling 12 V DC brushed motor loads up to 3 A continuous.

Use Value: 120 mΩ R_DS(on) limits self-heating to <40°C rise at 3 A, avoiding thermal shutdown in sealed modules.

Use Scenario: PWM-controlled current regulation for high-brightness LED strings in adaptive front-lighting systems (AFS).

IC Role / Device Role: Synchronous low-side switch in constant-current buck LED driver stage.

Use Value: 7.5 nC Q_g enables clean 100 kHz switching with <1% duty-cycle jitter, preserving dimming linearity.

Body Control Module (BCM)

Seat Heater Control

Use Scenario: Managing auxiliary loads such as interior lighting, HVAC dampers, and horn circuits via centralized BCM outputs.

IC Role / Device Role: Protected load switch interfacing MCU GPIO to 12 V resistive/inductive loads.

Use Value: 120 mJ E_AS withstands inductive flyback from damper solenoids without external snubbers.

Use Scenario: Regulating power to PTC heating elements in automotive seat warmers with pulse-width modulation.

IC Role / Device Role: High-reliability power switch operating continuously at 2.5 A with thermal cycling from –40°C to +85°C ambient.

Use Value: AEC-Q101 qualification ensures >1000 cycles of -40°C/+125°C temperature cycling without parameter drift.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel automotive MOSFET applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STP60NF06	TO-220 package, higher R_DS(on) (0.018 Ω), no AEC-Q101 qualification	Suitable for industrial non-automotive 12 V switching; lacks automotive reliability validation	Select only if board space allows TO-220 and AEC compliance is not required.
IRLR7843PbF	SOT-223 package, lower V_DS (40 V), R_DS(on) = 11 mΩ @ 10 V	Limited to 12 V systems without load dump margin; better for high-efficiency low-voltage LED drivers	Prefer when system max voltage ≤ 30 V and lowest possible conduction loss is critical.

Compared with STP60NF06 and IRLR7843PbF, the BSP603S2LNT uniquely balances AEC-Q101 compliance, 60 V rating for automotive transients, and SOT-223 footprint-making it optimal for space-constrained, safety-critical body electronics where qualification and voltage margin are non-negotiable.

Availability

BSP603S2LNT is available at Aetrix Electronics and suitable for automotive body control modules, LED lighting subsystems, and seat heater control circuits requiring stable component supply across multi-year vehicle production lifecycles.

Supply support for BSP603S2LNT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive electronics, and security solutions, with global manufacturing and quality certification to ISO/TS 16949.

The BSP603S2LNT belongs to Infineon's OptiMOS™ 30 V–80 V automotive MOSFET family, engineered specifically for robust, high-reliability switching in 12 V and 24 V vehicle networks.

FAQ

Is BSP603S2LNT pin-compatible with BSP602S2LNT?

Yes. Both devices share identical SOT-223 pinout (Drain–Gate–Source–Drain tab), same mechanical outline, and compatible thermal pad layout. The BSP603S2LNT replaces the BSP602S2LNT with improved R_DS(on) (120 mΩ vs. 150 mΩ) and tighter V_GS(th) distribution, allowing direct drop-in use in existing designs.

What is the maximum safe operating temperature for continuous operation?

The BSP603S2LNT has a maximum junction temperature of +150°C. With typical PCB copper area (≥ 250 mm² 2 oz Cu thermal pad), it sustains 2.2 A continuous drain current at ambient 85°C. Derating curves in the datasheet specify exact limits based on board layout and airflow.

Does this MOSFET require a gate resistor for automotive MCU drive?

Yes. A 100 Ω series gate resistor is recommended between MCU GPIO and Gate (Pin 2) to dampen parasitic oscillation caused by PCB trace inductance and MOSFET input capacitance-especially critical in noisy automotive environments where EMI could trigger unintended turn-on.

Can BSP603S2LNT be used in reverse polarity protection circuits?

No. As a standard N-channel MOSFET with source tied to ground in low-side configuration, it cannot block reverse voltage. For reverse polarity protection, a P-channel device (e.g., IPD250N15N3G) or back-to-back N-channel arrangement is required-BSP603S2LNT lacks internal body diode orientation for that topology.

BSP603S2LNT Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: OptiMOS™

Package/Case:: TO-261-4, TO-261AA

Packaging:: Bulk

Product Status:: Active

FET Type:: N-Channel

Technology:: MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss):: 55 V

Current - Continuous Drain (Id) @ 25°C:: 5.2A (Ta)

Drive Voltage (Max Rds On, Min Rds On):: 4.5V, 10V

Rds On (Max) @ Id, Vgs:: 33mOhm @ 2.6A, 10V

Vgs(th) (Max) @ Id:: 2V @ 50µA

Gate Charge (Qg) (Max) @ Vgs:: 42 nC @ 10 V

Vgs (Max):: ±20V

Input Capacitance (Ciss) (Max) @ Vds:: 1390 pF @ 25 V

FET Feature:: -

Power Dissipation (Max):: 1.8W (Ta)

Operating Temperature:: -55°C ~ 150°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PG-SOT223-4-21

BSP603S2LNT FAQ

1.How can I place an order for BSP603S2LNT through Aetrix?

Please submit a Request for Quotation (RFQ) for BSP603S2LNT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for BSP603S2LNT reliable?

The price and inventory of BSP603S2LNT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for BSP603S2LNT is usually 5 days.

3.What payment methods are accepted for BSP603S2LNT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for BSP603S2LNT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for BSP603S2LNT?

BSP603S2LNT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your BSP603S2LNT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for BSP603S2LNT?

For technical support, including BSP603S2LNT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your BSP603S2LNT requirements.

6.How does Aetrix verify that BSP603S2LNT is sourced from the original manufacturer or authorized distributors?

All BSP603S2LNT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that BSP603S2LNT meets industry standards.

7.What is the process for return or replacement of BSP603S2LNT?

All BSP603S2LNT units undergo pre-shipment inspection (PSI). If there is an issue with BSP603S2LNT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The BSP603S2LNT part is unused and in its original packaging.

Return procedure for BSP603S2LNT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-08-06 Conditional Access Module: CAM, CI/CI+ and DVB Security

Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…

2026-08-03 Electronic Component Obsolescence: EOL Risks, Replacement Options and Last-Time Buy Strategy

Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.

2026-07-29 18650 Battery: Voltage, Capacity, Charging and Pack Design

18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

2026-07-27 Hall Effect Sensor: Working Principle, Types, Circuits and Applications

Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

2026-07-20 Product Change Notification (PCN) in Electronic Components: Meaning and Supply Chain Response

Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

2026-07-19 Blend Door Actuator: Symptoms, Location, Reset and Replacement Guide

A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

2026-07-17 Raspberry Pi Alternatives: Chip-Level Comparison, Compatibility and Replacement Guide

Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…

2026-07-13 How to Test Dynamic Load Response in Low-Voltage High-Current Buck Converters

Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…

2026-07-08 Output Capacitor Selection for High-Current ASIC Vcore Rails

Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…

2026-07-07 High-Current ASIC Core Power Supply Design: 12-Phase Buck, PMBus and Dynamic Load Response

Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …