onsemi CM1204-03CP
- Part No.:
- CM1204-03CP
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 5-WFBGA, WLCSP
- Datasheet:
-
CM1204-03CP.pdf
- Description:
- TVS DIODE 15VC 5WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:7,070
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Product details
Overview
CM1204-03CP from onsemi is a 4-channel ESD protection diode array in a chip-scale package (CSP), designed for I/O port and keypad/button circuitry protection in portable electronics. It delivers ±15 kV IEC 61000-4-2 contact discharge ESD immunity, ±30 kV HBM ESD rating, 22–32 pF diode capacitance at 2.5 V reverse bias, and clamps transients to +15 V / −8 V during 8 kV HBM events - enabling robust signal-line protection in wireless handsets and notebooks.
For engineers reviewing the CM1204-03CP datasheet, pinout, applications, or equivalent options, key selection criteria include channel count (4), low capacitance (27 pF typ), ground-referenced unidirectional clamping architecture, CSP-5 footprint compatibility, and OptiGuard-coated reliability for high-yield SMT assembly in space-constrained consumer devices.
Technical Context
The CM1204-03CP implements four independent, ground-referenced ESD protection diodes in a single WLCSP5 package. Each channel features a low-leakage (100 nA max at 3.3 V) silicon diode with 6.0 V nominal reverse breakdown voltage and tight clamping behavior (+15 V / −8 V under 8 kV HBM stress).
Its 5-bump layout (0.96 mm × 1.33 mm) uses non-solder-mask-defined (NSMD) round pads (0.275 mm), optimized for minimal parasitic inductance to preserve high-frequency ESD response. The device operates across −40°C to +85°C and is rated for 200 mW DC power dissipation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000-4-2) | ±15 kV contact discharge - meets Level 4 immunity for handheld interface ports |
| ESD Rating (HBM) | ±30 kV - exceeds MIL-STD-883 Method 3015 requirement for board-level handling |
| Clamping Voltage (8 kV HBM) | +15 V / −8 V - limits transient overvoltage seen by downstream ICs during ESD events |
| Diode Capacitance | 22–32 pF at 2.5 V reverse bias - preserves signal integrity for USB 2.0, audio, and keypad lines |
| Leakage Current | ≤100 nA at 3.3 V - avoids loading low-power I/O circuits in battery-operated devices |
| Breakdown Voltage | 6.0 V min - ensures reliable conduction only during ESD transients, not normal operation |
Pinout & Package
CM1204-03CP is housed in a 5-bump Wafer-Level Chip-Scale Package (WLCSP5), Case 567AY, measuring 0.96 mm × 1.33 mm with 0.5 mm bump pitch. The package uses Pb-free SnAgCu solder balls and features OptiGuard coating for enhanced assembly reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | ESD_1 | Input terminal for Channel 1 - connects to protected signal line (e.g., keypad row) |
| A3 | ESD_2 | Input terminal for Channel 2 - routes to second I/O line requiring ESD suppression |
| B2 | GND | Common cathode reference - must be connected to low-impedance system ground plane |
| C1 | ESD_3 | Input terminal for Channel 3 - supports third protected interface path |
| C3 | ESD_4 | Input terminal for Channel 4 - enables full quad protection without external routing |
Key Features
| Feature | Design Value |
|---|---|
| Four independent ESD channels | Enables simultaneous protection of multiple low-voltage I/O lines (e.g., keypad matrix, USB D+/D−, audio jack contacts) in one ultra-compact CSP |
| OptiGuard coating | Improves interfacial reliability during reflow and thermal cycling, reducing risk of solder joint fracture in portable devices |
| Low diode capacitance (27 pF typ) | Minimizes signal distortion and insertion loss on high-speed or analog interfaces up to ~200 MHz |
| Ground-referenced unidirectional clamping | Provides asymmetric voltage limiting (+15 V / −8 V) ideal for systems with positive-only supply rails and bidirectional signal swing |
Applications
| Wireless Handsets | Handheld PCs / PDAs |
|---|---|
Use Scenario: Protecting touchscreen controller I/O, SIM card slot, and micro-USB connector pins from user-handling ESD. IC Role / Device Role / Timing Role: ESD transient suppressor placed directly at connector entry points before signal conditioning ICs. Use Value: Prevents latch-up or gate oxide damage in baseband processors and PMICs during ±15 kV contact discharge events. | Use Scenario: Shielding keypad matrix rows/columns and SD card interface lines in compact form-factor mobile computing devices. IC Role / Device Role / Timing Role: Low-capacitance, ground-referenced clamp ensuring no signal degradation on 1–5 MHz digital control lines. Use Value: Maintains functional integrity of mechanical input paths while meeting IEC 61000-4-2 Level 4 compliance without PCB area penalty. |
| Notebooks | MP3 Players & Digital Camcorders |
Use Scenario: Safeguarding HDMI, audio jack, and USB-C port data lines against repeated electrostatic exposure during docking/undocking. IC Role / Device Role / Timing Role: Frontline ESD barrier with <32 pF capacitance preserving signal rise/fall times on differential pairs. Use Value: Enables direct integration adjacent to connectors without equalization or retiming, reducing BOM count and layout complexity. | Use Scenario: Securing headphone jack detection lines, volume button inputs, and microSD interface in ultra-thin consumer audio/video recorders. IC Role / Device Role / Timing Role: Quad-channel discrete protection replacing multiple 0201 TVS diodes, minimizing placement error risk. Use Value: Achieves ±30 kV HBM robustness with 0.96 mm × 1.33 mm footprint - critical for sub-10 mm board edge clearance constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor CSPESD304 | Functionally and pin-compatible per datasheet; identical 5-bump CSP layout and electrical specs (±15 kV IEC, ±30 kV HBM, 27 pF) | No functional difference - direct drop-in replacement with same PCB layout and thermal profile | Select CSPESD304 when sourcing from alternate onsemi production lots or legacy inventory channels |
| Vishay VEML6030X01 | Single-channel, 0402 package; 15 pF typical capacitance but only ±8 kV IEC rating and no HBM spec published | Limited to low-density, low-risk I/O; unsuitable for quad-port protection or high-reliability portable designs | Consider only for cost-sensitive, non-critical single-line protection where footprint flexibility exists |
Compared with CSPESD304, CM1204-03CP offers identical performance and layout compatibility, while VEML6030X01 provides lower capacitance but lacks multi-channel integration and certified ±30 kV HBM robustness - making CM1204-03CP the preferred choice for space-constrained, high-immunity portable I/O protection.
Availability
CM1204-03CP is available at Aetrix Electronics and suitable for wireless handsets, handheld PCs/PDAs, and notebook computers requiring stable component supply, RoHS-compliant packaging, and verified ESD immunity for consumer-grade production programs.
Supply support for CM1204-03CP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient, high-performance silicon solutions for automotive, industrial, cloud, medical, and consumer electronics markets.
The CM1204-03CP belongs to onsemi's OptiGuard-enabled ESD protection product line, engineered specifically for miniaturized portable electronics where ultra-low capacitance, quad-channel integration, and CSP manufacturability are essential design requirements.
FAQ
What is the maximum operating temperature range for CM1204-03CP?
The CM1204-03CP is specified to operate reliably from −40°C to +85°C, matching the thermal envelope of most portable consumer electronics. This range is validated per Table 3 of the official datasheet and supports continuous use in handheld devices exposed to ambient conditions such as indoor office environments or brief outdoor exposure. The device's WLCSP5 package maintains thermal stability within this range due to its low mass and direct silicon-to-PCB coupling.
Does CM1204-03CP support both positive and negative ESD transients?
Yes, CM1204-03CP supports bidirectional ESD suppression: it clamps positive transients to +15 V and negative transients to −8 V during 8 kV HBM testing (per Table 4). Its ground-referenced unidirectional diode structure conducts only when the input voltage exceeds VBR (~6.0 V) or falls below GND by ~0.4 V, providing asymmetric but effective protection for systems with single-supply I/O rails.
Is CM1204-03CP compatible with lead-free reflow processes?
Yes, CM1204-03CP uses Pb-free SnAgCu solder balls and is qualified for standard lead-free reflow profiles, including peak temperatures up to 260°C and maximum dwell time above liquidus of 60 seconds (per Package Dimensions document 98AON49808E). Its OptiGuard coating further enhances resistance to intermetallic compound formation during thermal cycling.
What is the recommended PCB pad size for CM1204-03CP?
The recommended non-solder-mask-defined (NSMD) PCB pad size for CM1204-03CP is 0.275 mm in diameter, with a round shape and 0.325 mm solder mask opening (per Table 5). This geometry ensures optimal solder joint formation and coplanarity control for the 5-bump WLCSP5 package, minimizing risk of head-in-pillow defects or voiding during reflow.
Can CM1204-03CP replace discrete 0201 TVS diodes in high-density layouts?
Yes, CM1204-03CP replaces up to four discrete 0201 TVS diodes with a single 0.96 mm × 1.33 mm footprint, reducing PCB real estate by >60% and eliminating placement alignment errors. Its 27 pF typical capacitance and ±15 kV IEC rating meet or exceed common 0201 TVS performance, while the integrated quad structure simplifies routing and improves ESD current sharing uniformity across channels.
CM1204-03CP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 5-WFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- 6V (Typ)
- Voltage - Clamping (Max) @ Ipp:
- 15V
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-WLCSP (0.96x1.33)
CM1204-03CP FAQ
1.How can I place an order for CM1204-03CP through Aetrix?
Please submit a Request for Quotation (RFQ) for CM1204-03CP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CM1204-03CP reliable?
The price and inventory of CM1204-03CP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CM1204-03CP is usually 5 days.
3.What payment methods are accepted for CM1204-03CP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CM1204-03CP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CM1204-03CP?
CM1204-03CP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CM1204-03CP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CM1204-03CP?
For technical support, including CM1204-03CP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CM1204-03CP requirements.
6.How does Aetrix verify that CM1204-03CP is sourced from the original manufacturer or authorized distributors?
All CM1204-03CP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CM1204-03CP meets industry standards.
7.What is the process for return or replacement of CM1204-03CP?
All CM1204-03CP units undergo pre-shipment inspection (PSI). If there is an issue with CM1204-03CP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CM1204-03CP part is unused and in its original packaging.
Return procedure for CM1204-03CP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CM1204-03CP Tags

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ESD9B5.0ST5G
onsemi

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DESD3V3E1BL-7B
Diodes Incorporated

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ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
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