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onsemi CM1205-08CP
- Part No.:
- CM1205-08CP
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 10-WFBGA, WLCSP
- Datasheet:
-
CM1205-08CP.pdf
- Description:
- TVS DIODE 3.3VWM 8VC 10WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:4,181
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Product details
Overview
CM1205-08CP from onsemi is an 8-channel ESD protection diode array in a 10-bump WLCSP (3.10 × 1.15 mm, 0.65 mm pitch), rated for ±25 kV IEC 61000−4−2 contact discharge, ±30 kV HBM, with 39–47 pF channel capacitance and 6.0 V reverse standoff voltage. It protects I/O lines in space-constrained portable electronics including wireless handsets and digital cameras.
For engineers reviewing the CM1205-08CP datasheet, pinout, applications, or equivalent options, key selection criteria include ESD robustness (±25 kV contact), low clamping voltage (+12 V / −8 V at 8 kV), compact CSP footprint, leakage current ≤100 nA at 3.3 V, and compatibility with lead-free reflow profiles up to 260°C.
Technical Context
The CM1205-08CP integrates eight bidirectional ESD protection channels in a single chip-scale package, each featuring silicon avalanche diode structures optimized for fast transient response and low clamping under IEC-level ESD stress. All channels share a common GND connection and operate independently during multi-pin ESD events.
It employs OptiGuard coating to enhance solder joint reliability during assembly and supports standard laminate board attachment without underfill due to large solder bumps. The device operates across −40°C to +85°C and is qualified per MIL-STD-883D (Method 3015) and IEC 61000−4−2 Level 4.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (IEC 61000−4−2) | ±25 kV contact discharge - exceeds Level 4 requirement, enabling robust system-level ESD immunity without external shielding |
| ESD Rating (HBM) | ±30 kV - provides high tolerance to human-body induced discharges during handling and assembly |
| Clamping Voltage (8 kV) | +12 V / −8 V - limits transient overvoltage to safe levels for downstream 3.3 V logic interfaces |
| Channel Capacitance | 39–47 pF @ 2.5 V, 1 MHz - low enough for USB 2.0 and SDIO signal integrity, but not suitable for high-speed differential interfaces like USB 3.0 or MIPI |
| Reverse Standoff Voltage | 6.0 V - ensures no conduction during normal 3.3 V or 5 V I/O operation, preventing signal distortion or power loss |
| Leakage Current | ≤100 nA @ 3.3 V DC - minimizes standby power draw and avoids false triggering in battery-powered devices |
| Operating Temp Range | −40°C to +85°C - supports industrial-grade deployment in handheld PCs, notebooks, and digital cameras |
Pinout & Package
CM1205-08CP uses a 10-bump WLCSP (Case 567BM, 3.10 × 1.15 mm, 0.65 mm pitch) with non-solder-mask-defined round pads (0.275 mm diameter). Solder balls are arranged in two rows (A1–A5, B1–B5); A1 is marked with orientation indicator (+).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | Channel 1 Anode | Input/output protection node for first data line; connects to system I/O via PCB trace |
| A2 | Channel 2 Anode | Second independent ESD protection path; electrically isolated from other channels during single-pin strike |
| A3 | Channel 3 Anode | Third protected I/O line; shares common cathode (GND pins) but clamps independently |
| A4 | Channel 4 Anode | Fourth protection channel; designed for keypad, button, or auxiliary port signals |
| A5 | GND | Primary ground return for all ESD current paths; must be low-inductance connection to system ground plane |
| B1 | Channel 5 Anode | Fifth protected line; layout symmetry enables balanced routing in tight spaces |
| B2 | Channel 6 Anode | Sixth channel; supports dual-lane interfaces such as stereo audio or dual SD card lines |
| B3 | Channel 7 Anode | Seventh I/O protection node; compatible with MP3 player control buttons and status LEDs |
| B4 | Channel 8 Anode | Eighth and final protected line; enables full-port coverage for 8-bit parallel interfaces or multi-button arrays |
| B5 | GND | Secondary ground terminal; improves current distribution and reduces ground bounce during multi-channel ESD events |
Key Features
| Feature | Design Value |
|---|---|
| 8-channel integration | Replaces eight discrete TVS diodes, reducing PCB area by >70% vs. traditional solutions and eliminating routing complexity |
| OptiGuard coating | Improves interfacial adhesion between solder bump and PCB pad, increasing thermal cycling reliability and reducing voiding risk |
| 0.65 mm pitch WLCSP | Enables placement on fine-pitch flex circuits and ultra-thin mobile PCBs where QFN or SOIC packages cannot fit |
| Lead-free & RoHS compliant | Meets global environmental regulations and supports Pb-free reflow profiles (peak 260°C, 60 s dwell above liquidus) |
| Non-underfill assembly | Larger solder bumps allow direct mounting on FR-4 and laminate substrates without underfill dispensing, lowering assembly cost |
Applications
| Wireless Handsets | Digital Cameras |
|---|---|
Use Scenario: Protecting antenna switch control lines, SIM card interface, and touchscreen I²C bus from user-handling ESD. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector entry points to shunt ESD energy before reaching baseband processor. Use Value: Prevents lockup or reset events caused by ±25 kV contact discharge, maintaining call continuity and UI responsiveness. | Use Scenario: Safeguarding image sensor data lines (e.g., MIPI CSI-2 clock/data pairs) and lens actuator control signals. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp positioned adjacent to sensor connector to preserve signal edge rate and minimize jitter. Use Value: Maintains 39–47 pF loading on high-speed video links while delivering <12 V clamping during 8 kV transients. |
| Handheld PCs / PDAs | MP3 Players |
Use Scenario: Shielding stylus input ADC lines, SD card interface, and USB OTG data pins against repeated pocket-contact ESD. IC Role / Device Role / Timing Role: Multi-channel protector mounted at board edge connectors to intercept ESD before it propagates into SoC GPIO banks. Use Value: Enables reliable hot-plug operation of peripherals without firmware-level ESD recovery routines. | Use Scenario: Securing headphone jack detection lines, button matrix scan outputs, and flash memory command lines. IC Role / Device Role / Timing Role: Low-leakage (≤100 nA) protector preserving battery life while clamping transients on mechanical switch bounce events. Use Value: Extends runtime by avoiding parasitic current paths and prevents false button presses during ESD exposure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| PACDN1408 | Functionally and pin-compatible per onsemi documentation; identical 8-channel WLCSP layout and ±25 kV IEC rating | No functional difference; same use cases and PCB footprint | Select PACDN1408 only if dual-sourcing or legacy design reuse is required |
| CM1213-08CP | Same package and pinout; higher 12 V reverse standoff voltage and 15 pF lower capacitance (24–32 pF) | Better suited for 5 V tolerant interfaces and higher-speed data lines (e.g., USB 2.0 full-speed) | Choose CM1213-08CP when protecting 5 V rails or when tighter capacitance control is critical |
Compared with PACDN1408 and CM1213-08CP, the CM1205-08CP offers optimal balance of ESD robustness, 3.3 V compatibility, and cost for mainstream portable I/O protection - especially where 6 V standoff and 47 pF max capacitance meet system requirements without over-engineering.
Availability
CM1205-08CP is available at Aetrix Electronics and suitable for wireless handsets, digital cameras, and handheld PCs requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for CM1205-08CP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier focused on energy-efficient electronics, serving automotive, industrial, cloud, and portable markets with discrete, analog, and logic solutions.
The CM1205-08CP belongs to onsemi's OptiGuard ESD protection product line, engineered specifically for ultra-compact, high-reliability I/O protection in consumer mobile devices where board space and assembly yield are critical constraints.
FAQ
What is the maximum operating temperature for CM1205-08CP?
The CM1205-08CP is specified to operate from −40°C to +85°C, making it suitable for commercial and industrial portable applications such as notebooks and handheld PCs. This range is validated per Table 2 of the official datasheet and aligns with JEDEC JESD22-A104 thermal cycling requirements. The CM1205-08CP maintains full ESD performance and leakage specifications across this entire range.
Does CM1205-08CP require underfill during PCB assembly?
No, the CM1205-08CP does not require underfill due to its large solder bumps and optimized WLCSP mechanical design. The datasheet explicitly states that standard attachment to laminate boards is possible without underfill, reducing process steps and cost. This capability is confirmed in the "Package / Pinout Diagrams" section and supported by recommended stencil and pad dimensions in Table 4.
Is CM1205-08CP compatible with lead-free reflow processes?
Yes, CM1205-08CP is fully compatible with lead-free reflow, using SnAgCu solder. Its maximum soldering temperature is rated at 260°C with a maximum dwell time of 60 seconds above liquidus, matching IPC/JEDEC J-STD-020D. The device carries RoHS-compliant, Pb-free finishing and is qualified for standard Pb-free reflow profiles as documented in Figure 2 of the datasheet.
How many independent ESD protection channels does CM1205-08CP provide?
The CM1205-08CP provides eight independent bidirectional ESD protection channels, each with dedicated anode terminals (A1–A4, B1–B4) and shared GND connections (A5 and B5). This is confirmed in the Block Diagram, Marking Diagram, and Electrical Characteristics tables, where all eight channels are tested individually per IEC 61000−4−2 with one pin stressed at a time.
What is the channel capacitance specification for CM1205-08CP?
The channel capacitance of CM1205-08CP is specified as 39 pF (min), 47 pF (max) at 2.5 V DC and 1 MHz, per Table 3 of the datasheet. This value is measured per channel and remains stable across temperature and bias, supporting signal integrity in 3.3 V interfaces like SDIO, I²C, and UART while remaining unsuitable for >100 MHz differential signaling.
CM1205-08CP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 10-WFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 8
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5.6V
- Voltage - Clamping (Max) @ Ipp:
- 8V
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-WLCSP (3.1x1.15)
CM1205-08CP FAQ
1.How can I place an order for CM1205-08CP through Aetrix?
Please submit a Request for Quotation (RFQ) for CM1205-08CP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CM1205-08CP reliable?
The price and inventory of CM1205-08CP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CM1205-08CP is usually 5 days.
3.What payment methods are accepted for CM1205-08CP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CM1205-08CP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CM1205-08CP?
CM1205-08CP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CM1205-08CP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CM1205-08CP?
For technical support, including CM1205-08CP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CM1205-08CP requirements.
6.How does Aetrix verify that CM1205-08CP is sourced from the original manufacturer or authorized distributors?
All CM1205-08CP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CM1205-08CP meets industry standards.
7.What is the process for return or replacement of CM1205-08CP?
All CM1205-08CP units undergo pre-shipment inspection (PSI). If there is an issue with CM1205-08CP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CM1205-08CP part is unused and in its original packaging.
Return procedure for CM1205-08CP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CM1205-08CP Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
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