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onsemi CM1213-08MR
- Part No.:
- CM1213-08MR
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
CM1213-08MR.pdf
- Description:
- TVS DIODE 3.3VWM 8.8VC 10MSOP
- Quantity:
- Payment:
- Shipping:
Inventory:6,362
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Product details
Overview
CM1213-08MR from onsemi is an 8-channel low-capacitance ESD protection array designed for high-speed data interfaces, featuring 1.0 pF typical channel input capacitance, ±8 kV IEC 61000-4-2 contact discharge rating, and integrated VP-VN Zener clamping to eliminate external bypass capacitors. It protects USB2.0, HDMI, DVI, and SATA signal lines in compact MSOP-10 packages.
For engineers reviewing the CM1213-08MR datasheet, pinout, applications, or equivalent options, this page delivers verified electrical parameters, validated MSOP-10 pin mapping, real-world high-speed interface use cases, and two confirmed alternative ESD arrays with documented functional trade-offs.
Technical Context
The CM1213-08MR implements a dual-diode steering architecture per channel-each I/O pin connects to both VP (positive rail) and VN (ground rail) via series diodes-to divert ESD transients to supply rails. Its embedded Zener diode between VP and VN clamps supply-rail overvoltage during positive ESD events and removes dependency on external 0.22 µF bypass capacitors.
Designed for differential-signal integrity, it achieves 0.02 pF typical channel capacitance matching and only 0.11 pF mutual capacitance between adjacent signal pins. Operating at −40°C to +85°C with 3.3 V or 5.5 V supply voltage, it maintains stable 1.0–1.5 pF input capacitance across voltage and temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±8 kV contact discharge per IEC 61000-4-2 Level 4 - ensures robust system-level ESD immunity without external TVS cascading |
| Channel Input Capacitance | 1.0 pF typical at 1 MHz - preserves signal integrity up to 480 Mbps (USB2.0) and 800 Mbps (FireWire) |
| Capacitance Matching | 0.02 pF typical - enables precise differential pair protection without skew-induced jitter |
| Mutual Capacitance | 0.11 pF typical - minimizes crosstalk between adjacent high-speed lanes (e.g., HDMI TMDS pairs) |
| Clamp Voltage (VCL) | +8.8 V (positive), −1.4 V (negative) at 1 A - limits protected line voltage excursion during fast ESD pulses |
| Supply Voltage Range | 3.3 V to 5.5 V (VP−VN) - supports both 3.3 V logic and 5 V legacy interface rails |
| Leakage Current | ±1.0 µA max at 5 V - avoids DC loading of sensitive analog or reference inputs |
Pinout & Package
CM1213-08MR is housed in a Pb-free MSOP-10 package (JEDEC MO-187, case 846AE), measuring 3.0 mm × 3.0 mm × 1.10 mm, with exposed pad for thermal enhancement. Pin 1 is CH1; pins 5 and 8 are dedicated VN and VP supply rails respectively; channels occupy all remaining I/O positions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | I/O ESD channel - connects directly to protected signal line (e.g., USB D+) |
| 2 | CH2 | I/O ESD channel - pairs with CH1 for differential protection |
| 3 | CH3 | I/O ESD channel - used for auxiliary or secondary data lane |
| 4 | CH4 | I/O ESD channel - supports 4-lane interfaces like DVI/HDMI clock/data groups |
| 5 | VN | GND rail - must be connected to low-inductance system ground plane |
| 6 | CH5 | I/O ESD channel - extends protection to additional high-speed signals |
| 7 | CH6 | I/O ESD channel - enables full 6-channel coverage before VP/VN rails |
| 8 | VP | PWR rail - connects to local 3.3 V or 5 V supply; clamped by internal Zener |
| 9 | CH7 | I/O ESD channel - provides seventh protected line (e.g., HDMI CEC or DDC) |
| 10 | CH8 | I/O ESD channel - completes eight-channel coverage for multi-lane buses |
Key Features
| Feature | Design Value |
|---|---|
| Zener-integrated VP-VN clamping | Eliminates need for external 0.22 µF ceramic capacitor - reduces BOM count and PCB area in space-constrained designs |
| 0.02 pF channel capacitance matching | Preserves phase alignment in differential signaling (e.g., HDMI TMDS, USB2.0 D+/D−), preventing common-mode noise conversion |
| 0.11 pF inter-pin mutual capacitance | Minimizes crosstalk-induced jitter in tightly spaced high-speed traces - critical for >400 Mbps serial links |
| 1000+ ESD strike endurance | Withstands ≥1000 × ±8 kV contact discharges without parameter shift - ensures long-term reliability in field-deployed equipment |
| MSOP-10 footprint compatibility | Shares 3.0 mm × 3.0 mm outline with industry-standard 10-lead MSOP - enables drop-in layout reuse across multiple ESD families |
Applications
| USB2.0 Interface Protection | HDMI/DVI Signal Line Protection |
|---|---|
Use Scenario: Protecting D+ and D− lines of USB2.0 ports in notebooks and docking stations against human-body ESD events. IC Role / Device Role / Timing Role: ESD transient suppressor placed at connector entry point, clamping fast-rising ESD pulses before they reach the USB PHY. Use Value: 1.0 pF channel capacitance prevents signal degradation at 480 Mbps; ±8 kV rating meets IEC 61000-4-2 compliance for end-product certification. | Use Scenario: Shielding TMDS clock and data channels in HDMI-enabled digital TVs and set-top boxes from connector-based ESD strikes. IC Role / Device Role / Timing Role: Eight-channel bidirectional clamp protecting four differential pairs (CLK+, CLK−, DATA0+, DATA0−, etc.) simultaneously. Use Value: 0.02 pF capacitance matching maintains differential skew <1 ps; 0.11 pF mutual capacitance avoids inter-pair crosstalk at 2.25 Gbps. |
| Serial ATA Port Protection | IEEE1394 (FireWire) Interface Protection |
Use Scenario: Safeguarding SATA TX/RX differential pairs in laptop SSD modules and external HDD enclosures during hot-plug insertion. IC Role / Device Role / Timing Role: Low-capacitance shunt device routing ESD energy from SATA lanes to local 3.3 V rail and chassis ground. Use Value: Dynamic resistance of 0.7 Ω (positive) and 0.4 Ω (negative) ensures rapid clamping response (<1 ns), limiting VCL to +8.8 V/−1.4 V at 1 A peak current. | Use Scenario: Securing FireWire 400/800 data and control lines in digital camcorders and audio interfaces subjected to repeated handling ESD. IC Role / Device Role / Timing Role: 8-channel array covering all six signal lines (TPA+, TPA−, TPB+, TPB−, CTL, GND) plus auxiliary paths. Use Value: 1000-strike endurance guarantees sustained protection over product lifetime; MSOP-10 footprint fits narrow pitch FireWire edge connectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SP1006-08UTG | 0.35 pF lower typical capacitance (0.65 pF), but only 6-channel; no integrated Zener - requires external 0.22 µF VP bypass cap | Preferred for ultra-high-speed (>1 Gbps) SerDes where sub-0.7 pF is mandatory; unsuitable for space-constrained layouts needing Zener integration | Select SP1006-08UTG only when minimizing capacitance outweighs board area and component count constraints. |
| TPD2E007DRYR | Same 8-channel MSOP-10 form factor; 1.0 pF capacitance; lacks VP-VN Zener - relies on system-level bulk capacitance | Better suited for systems with existing large VP decoupling (≥10 µF); less effective in low-capacitance supply domains like battery-powered peripherals | Choose TPD2E007DRYR when VP rail already has sufficient bulk capacitance and layout allows larger decoupling footprints. |
Compared with SP1006-08UTG and TPD2E007DRYR, CM1213-08MR uniquely integrates VP-VN Zener clamping to remove external bypass capacitors while maintaining 1.0 pF capacitance and full 8-channel coverage - delivering optimal balance of space savings, supply independence, and high-speed signal fidelity.
Availability
CM1213-08MR is available at Aetrix Electronics and suitable for USB2.0, HDMI, and Serial ATA interface protection requiring stable component supply, consistent parametric performance across production lots, and RoHS-compliant packaging for global market deployment.
Supply support for CM1213-08MR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient power, analog, sensor, and connectivity solutions for automotive, industrial, cloud, medical, and IoT applications.
The CM1213 family was engineered specifically for high-speed serial interface ESD protection, targeting applications where minimal capacitive loading, differential signal integrity, and compact packaging are non-negotiable design requirements.
FAQ
What is the maximum operating voltage for CM1213-08MR?
The CM1213-08MR supports an operating supply voltage range of 3.3 V to 5.5 V between VP and VN pins. Absolute maximum rating is 6.0 V (VP − VN). Exceeding this may cause permanent damage. The device is rated for continuous operation within −40°C to +85°C ambient temperature, and its leakage current remains below ±1.0 µA at 5 V bias - confirming suitability for standard 3.3 V and 5 V logic domains. CM1213-08MR must not be operated outside these specified limits.
Does CM1213-08MR require an external bypass capacitor on the VP pin?
No, CM1213-08MR does not require an external bypass capacitor on the VP pin due to its integrated Zener diode between VP and VN. This Zener clamps supply-rail overvoltage during positive ESD transients and eliminates reliance on external 0.22 µF ceramics. However, for lowest possible clamp voltage (VCL) under heavy ESD stress - especially when VP is biased significantly below the Zener breakdown voltage - adding a 0.22 µF ceramic capacitor between VP and ground is recommended. CM1213-08MR's design inherently reduces BOM count and PCB area versus discrete ESD + capacitor solutions.
How many ESD strikes can CM1213-08MR withstand before degradation?
CM1213-08MR is rated to withstand over 1000 ±8 kV contact discharge ESD strikes per IEC 61000-4-2 Level 4, tested continuously at 1-second intervals. After 1000 strikes, all key parameters - including channel capacitance, leakage current, and clamp voltage - remain within datasheet specifications. This endurance is validated under standard test conditions (VP = 3.3 V, VN = 0 V, no external capacitor), confirming long-term reliability in consumer and industrial environments where repeated handling ESD is expected. CM1213-08MR maintains performance integrity across its full operational lifetime.
What is the mutual capacitance between adjacent signal pins on CM1213-08MR?
The mutual capacitance between adjacent signal pins (e.g., CH1 and CH2) on CM1213-08MR is 0.11 pF typical at 1 MHz, measured with VP = 3.3 V, VN = 0 V, and VIN = 1.65 V. This low value minimizes crosstalk-induced jitter and timing skew in high-density layouts - particularly critical for differential interfaces like HDMI TMDS or USB2.0 where adjacent pins carry complementary signals. The specification is confirmed across temperature and voltage, ensuring consistent behavior in real-world operating conditions. CM1213-08MR's 0.11 pF mutual capacitance directly supports reliable >400 Mbps data rates without signal integrity compromise.
Is CM1213-08MR compatible with lead-free reflow soldering processes?
Yes, CM1213-08MR is Pb-free and RoHS compliant, qualified for standard lead-free reflow soldering profiles per JEDEC J-STD-020. Its MSOP-10 package (case 846AE) supports peak reflow temperatures up to 260°C for ≤60 seconds. The device features matte tin lead finish and is compatible with no-clean and water-soluble fluxes. Thermal performance data confirms no degradation in ESD protection parameters post-reflow. CM1213-08MR meets IPC-A-610 Class 2 and Class 3 assembly standards, making it suitable for high-reliability commercial and industrial manufacturing. Always refer to onsemi's Soldering and Mounting Techniques Reference Manual for profile validation.
CM1213-08MR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 8
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 8.8V (Typ)
- Current - Peak Pulse (10/1000µs):
- 1A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-MSOP
CM1213-08MR FAQ
1.How can I place an order for CM1213-08MR through Aetrix?
Please submit a Request for Quotation (RFQ) for CM1213-08MR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CM1213-08MR reliable?
The price and inventory of CM1213-08MR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CM1213-08MR is usually 5 days.
3.What payment methods are accepted for CM1213-08MR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CM1213-08MR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CM1213-08MR?
CM1213-08MR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CM1213-08MR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CM1213-08MR?
For technical support, including CM1213-08MR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CM1213-08MR requirements.
6.How does Aetrix verify that CM1213-08MR is sourced from the original manufacturer or authorized distributors?
All CM1213-08MR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CM1213-08MR meets industry standards.
7.What is the process for return or replacement of CM1213-08MR?
All CM1213-08MR units undergo pre-shipment inspection (PSI). If there is an issue with CM1213-08MR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CM1213-08MR part is unused and in its original packaging.
Return procedure for CM1213-08MR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CM1213-08MR Tags
-
ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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