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onsemi CM1220-08CP
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- Part No.:
- CM1220-08CP
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 10-WFBGA, WLCSP
- Datasheet:
-
CM1220-08CP.pdf
- Description:
- TVS DIODE 9VC 10CSP
- Quantity:
- Payment:
- Shipping:
Inventory:4,359
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Product details
Overview
CM1220-08CP from onsemi is an 8-channel ESD protection array in a 10-bump WLCSP package (1.96 mm × 1.33 mm), featuring 14 pF nominal diode capacitance per channel, ±15 kV IEC 61000-4-2 contact discharge rating, and ±30 kV HBM ESD protection. It integrates avalanche-type ESD diodes with 6.0 V standoff voltage and low dynamic resistance (≤2.3 Ω positive, ≤0.9 Ω negative) for high-speed data line protection in mobile handset LCD and camera interfaces.
For engineers reviewing the CM1220-08CP datasheet, pinout, applications, or equivalent options, key selection criteria include channel count, CSP footprint compatibility, signal integrity impact (capacitance <17 pF), IEC/HBM compliance level, and OptiGuard-coated reliability for reflow-soldered portable electronics designs.
Technical Context
The CM1220-08CP implements eight independent bidirectional avalanche diodes between I/O lines and ground, each with defined clamp voltages (5.6–9.0 V positive, −1.5 to −0.4 V negative at 10 mA) and sub-1 μA leakage at 3.3 V reverse bias. Its WLCSP-10 package uses solder bumps with non-solder-mask-defined pads and 0.25 mm pitch for minimal parasitic inductance.
OptiGuard coating enhances assembly reliability under thermal stress, while the device operates across −40 °C to +85 °C and stores from −65 °C to +150 °C. All channels meet IEC 61000-4-2 Level 4 (±15 kV contact) and MIL-STD-883 Method 3015 (±30 kV HBM), with no internal series resistance or integrated TVS topology beyond discrete diode clamping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | 8 independent ESD protection paths, enabling full interface line coverage (e.g., 8-bit camera bus or dual 4-bit LCD data lanes) |
| Capacitance (per channel) | 14 pF typical at 2.5 V/1 MHz - preserves signal integrity on >100 Mbps digital lines without excessive rise-time degradation |
| ESD Rating (IEC 61000-4-2) | ±15 kV contact discharge - exceeds Level 4 requirement for handheld end-equipment immunity certification |
| ESD Rating (HBM) | ±30 kV - supports robust handling during PCB assembly and field service without gate oxide damage |
| Standoff Voltage | 6.0 V - ensures no conduction during normal 3.3 V or 5 V I/O operation, preventing false triggering |
| Clamp Voltage (positive) | 6.8 V max at 10 mA - limits transient overvoltage to safe levels for downstream 3.3 V logic inputs |
| Leakage Current | 1 μA max at +3.3 V reverse bias - avoids DC loading of high-impedance sensor or reference lines |
Pinout & Package
CM1220-08CP uses a 10-bump Wafer-Level Chip Scale Package (WLCSP10, Case 567BL), measuring 1.96 mm × 1.33 mm with 0.25 mm bump pitch and non-solder-mask-defined round pads (0.240 mm diameter). OptiGuard coating improves solder joint reliability during lead-free reflow.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | ESD1 | Input/output protection path for first data line - connects directly to protected trace and GND via internal diode |
| A3 | ESD2 | Second independent ESD channel - electrically isolated from other channels for multi-line isolation |
| A5 | ESD3 | Third ESD protection node - supports daisy-chained or parallel routing without crosstalk coupling |
| A7 | ESD4 | Fourth channel input - positioned for symmetric layout with A1–A7 row alignment on PCB |
| C1 | ESD5 | Fifth ESD path - mirrors A1 placement on opposite row for balanced signal routing |
| C3 | ESD6 | Sixth channel - enables full 8-line coverage when used with C1/C3/C5/C7 column |
| C5 | ESD7 | Seventh protection node - maintains consistent 0.25 mm pitch for impedance-controlled layout |
| C7 | ESD8 | Eighth and final channel - completes octal protection set for parallel camera or display buses |
| B2 | GND | Primary ground connection - low-inductance return path shared by all eight diodes |
| B6 | GND | Secondary ground terminal - reduces ground loop inductance and improves high-frequency ESD dissipation |
Key Features
| Feature | Design Value |
|---|---|
| 8-channel ESD protection | Enables single-device protection of full 8-bit parallel interfaces (e.g., MIPI D-PHY data lanes or RGB666 display bus) without external routing complexity |
| 14 pF typical capacitance | Minimizes signal distortion on high-speed lines up to 200 Mbps, avoiding timing skew or amplitude loss in mobile video paths |
| ±15 kV IEC 61000-4-2 compliance | Meets highest industrial and consumer ESD immunity requirement for direct user-contact ports in certified handheld devices |
| OptiGuard coating | Increases intermetallic compound stability during Pb-free reflow, reducing voiding risk and improving long-term solder joint integrity |
| WLCSP-10 package | Reduces board area by >60% vs. SOIC-8 alternatives and eliminates bond wire inductance for faster transient response (<1 ns) |
Applications
| Mobile Handset LCD Interface | Mobile Handset Camera Interface |
|---|---|
Use Scenario: Protecting RGB/TTL or MIPI D-PHY data lines between application processor and LCD module in smartphones. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed inline on each data line, clamping ESD events before reaching display driver IC inputs. Use Value: Prevents display artifacts, latch-up, or permanent pixel driver damage during user handling or bench testing with ±15 kV contact discharge. | Use Scenario: Shielding parallel or serial camera data and clock lines (e.g., 8-bit YUV or MIPI CSI-2) in compact camera modules. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp on each signal path, preserving edge rate and jitter margin for image capture timing accuracy. Use Value: Maintains <100 ps timing skew across all 8 data lines while surviving >30 kV HBM events during automated test and drop testing. |
| Notebook Computer I/O Ports | Wireless Handset Keypad/Button Lines |
Use Scenario: Guarding USB 2.0 D+/D−, HDMI CEC, or SD card interface lines on ultraportable notebook motherboards. IC Role / Device Role / Timing Role: High-speed ESD shunt connected between signal pair and chassis ground, with matched capacitance to preserve differential impedance. Use Value: Enables 480 Mbps USB 2.0 operation without eye diagram closure, verified per USB-IF compliance test plans. | Use Scenario: Protecting mechanical keypad scan lines and capacitive touch button sense traces in LTE handsets. IC Role / Device Role / Timing Role: Low-leakage (≤1 μA) clamp on high-impedance GPIO lines, preventing false keypress detection during ESD events. Use Value: Eliminates firmware-level debounce overhead and ensures reliable wake-from-sleep functionality after ±15 kV contact discharge. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NUP4201MR6T1G | 4-channel, SOT-563 package (2.1 mm × 1.25 mm), 12 pF capacitance, ±12 kV IEC, ±30 kV HBM | Limited to 4 lines; larger footprint; lower IEC rating requires additional system-level design margin | Select when board space allows larger package and 4-line protection suffices |
| TPD4E001DQAR | 4-channel, X2SON-8 package (1.0 mm × 1.0 mm), 3.5 pF capacitance, ±8 kV IEC, ±15 kV HBM | Lower capacitance but reduced ESD rating; not suitable for IEC Level 4 compliance-critical designs | Choose only for low-speed, non-certified interfaces where ultra-low capacitance outweighs immunity requirements |
Compared with NUP4201MR6T1G and TPD4E001DQAR, the CM1220-08CP uniquely delivers 8-channel protection in a 1.96 mm × 1.33 mm WLCSP with full IEC Level 4 compliance - enabling single-device coverage of high-pin-count mobile interfaces without sacrificing board area or certification margin.
Availability
CM1220-08CP is available at Aetrix Electronics and suitable for mobile handset LCD interfaces, camera data lines, and notebook computer I/O ports requiring stable component supply, RoHS-compliant packaging, and production-ready WLCSP assembly support.
Supply support for CM1220-08CP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensors, and ESD protection solutions for automotive, industrial, and portable electronics.
The CM1220-08CP belongs to onsemi's OptiGuard ESD protection product line, engineered specifically for high-density, high-reliability protection of high-speed digital interfaces in space-constrained portable devices.
FAQ
What is the operating temperature range for the CM1220-08CP?
The CM1220-08CP is rated for continuous operation from −40 °C to +85 °C, matching standard commercial and industrial ambient conditions found in mobile handsets and portable computing equipment. This range is validated per onsemi's Standard Operating Conditions specification and supports reliable performance in battery-powered devices exposed to variable environmental conditions. The CM1220-08CP maintains specified ESD clamping behavior and leakage current limits across this full range.
Does the CM1220-08CP require external components for basic ESD protection?
No, the CM1220-08CP operates as a standalone ESD protection device with no external resistors, capacitors, or bias networks required. Each of its eight channels integrates a complete bidirectional avalanche diode structure between I/O and ground. The CM1220-08CP is designed for direct in-line placement on PCB traces, with only proper PCB pad layout (non-solder-mask-defined, 0.240 mm round) needed for optimal solder joint reliability and thermal performance.
How does the OptiGuard coating on the CM1220-08CP improve manufacturing yield?
The OptiGuard coating on the CM1220-08CP enhances interfacial stability between copper under-bump metallization and SnAgCu solder during Pb-free reflow, reducing intermetallic void formation and improving coplanarity retention. This directly increases first-pass yield in high-volume SMT lines processing mobile PCBs. The CM1220-08CP's OptiGuard layer is qualified for peak reflow temperatures up to 260 °C and dwell times ≤60 seconds above liquidus, aligning with IPC-J-STD-020 moisture sensitivity level 1 requirements.
Can the CM1220-08CP be used for protecting 5 V logic interfaces?
Yes, the CM1220-08CP has a 6.0 V diode standoff voltage and maximum positive clamp voltage of 9.0 V at 10 mA, making it compatible with 5 V tolerant I/O structures. Its leakage remains below 1 μA at 5 V reverse bias, ensuring negligible DC loading. However, system-level validation is required to confirm that the 9.0 V clamp level remains within the absolute maximum rating of the protected IC - the CM1220-08CP itself does not limit or regulate voltage beyond its intrinsic diode characteristics.
What is the significance of the two GND pins (B2 and B6) on the CM1220-08CP?
The dual GND pins (B2 and B6) on the CM1220-08CP provide parallel low-inductance return paths for all eight ESD channels, reducing overall ground loop inductance and improving high-frequency transient dissipation. This configuration lowers dynamic impedance during fast-rising ESD events (<1 ns), enhancing clamping effectiveness. Layout best practice requires connecting both GND bumps directly to a solid ground plane using short, wide traces - the CM1220-08CP's mechanical outline and soldering recommendations specify this dual-ground topology for optimal performance.
CM1220-08CP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 10-WFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 8
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- 9V
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-WLCSP (1.96x1.33)
CM1220-08CP FAQ
1.How can I place an order for CM1220-08CP through Aetrix?
Please submit a Request for Quotation (RFQ) for CM1220-08CP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CM1220-08CP reliable?
The price and inventory of CM1220-08CP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CM1220-08CP is usually 5 days.
3.What payment methods are accepted for CM1220-08CP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CM1220-08CP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CM1220-08CP?
CM1220-08CP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CM1220-08CP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CM1220-08CP?
For technical support, including CM1220-08CP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CM1220-08CP requirements.
6.How does Aetrix verify that CM1220-08CP is sourced from the original manufacturer or authorized distributors?
All CM1220-08CP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CM1220-08CP meets industry standards.
7.What is the process for return or replacement of CM1220-08CP?
All CM1220-08CP units undergo pre-shipment inspection (PSI). If there is an issue with CM1220-08CP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CM1220-08CP part is unused and in its original packaging.
Return procedure for CM1220-08CP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CM1220-08CP Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
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