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onsemi CM1230-08CP
- Part No.:
- CM1230-08CP
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 10-WFBGA, WLCSP
- Datasheet:
-
CM1230-08CP.pdf
- Description:
- TVS DIODE 3.3VWM 9.8VC 10WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:6,372
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Product details
Overview
CM1230-08CP from onsemi is an 8-channel, low-capacitance ESD protection diode array in a 10-bump WLCSP package (Case 567BG), designed for high-speed serial interfaces including LCD and camera data lines in wireless handsets. It delivers ±8 kV IEC61000−4−2 contact ESD protection, 0.8 pF typical channel input capacitance, and integrated VCC-to-GND Zener clamping to eliminate external bypass capacitors.
For engineers reviewing the CM1230-08CP datasheet, pinout, applications, or equivalent options, key selection criteria include ultra-low capacitance matching (0.02 pF typical I/O-to-GND delta), mutual capacitance of 0.15 pF between adjacent channels, and compatibility with 3.3 V/5.5 V supply rails in space-constrained mobile designs.
Technical Context
The CM1230-08CP implements a dual-rail clamping architecture: each of its eight I/O channels connects via back-to-back ESD diodes to VP (positive rail) and VN (negative rail), enabling bidirectional transient steering. A dedicated Zener diode between VP and VN provides rail-to-rail ESD suppression without requiring external decoupling.
Its 10-bump WLCSP layout (A1–A5, B1–B5) allocates two power/ground bumps (A3=VP, B3=VN) and eight signal bumps (A1/B1/A2/B2/A4/B4/A5/B5 = CH1–CH8), ensuring symmetrical routing for differential signal pairs and minimizing parasitic coupling through controlled bump pitch (0.25 mm) and coplanarity (±20 µm).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±8 kV contact / ±15 kV air per IEC61000−4−2 Level 4 - ensures robust system-level immunity without derating in handheld PCB layouts |
| Channel Input Capacitance | 0.8 pF typical at 1 MHz - enables >500 Mbps data rates on USB/MIPI interfaces without signal integrity degradation |
| I/O-to-GND Capacitance Matching | 0.02 pF typical - preserves common-mode rejection and timing skew in differential pairs (e.g., MIPI D-PHY) |
| Mutual Capacitance (I/O-to-I/O) | 0.15 pF typical - minimizes crosstalk between adjacent high-speed lanes in compact CSP footprints |
| Clamp Voltage (Positive/Negative) | +9.8 V / −1.8 V at 1 A, 8/20 µs - limits voltage overshoot below IC I/O absolute maximum ratings during ESD events |
| Supply Voltage Range | 3.3 V to 5.5 V - supports both legacy 3.3 V and modern 5 V mobile interface rails |
Pinout & Package
CM1230-08CP uses a 10-bump Wafer-Level Chip Scale Package (WLCSP10, Case 567BG), measuring 2.46 mm × 0.96 mm with 0.25 mm pitch and lead-free (Pb-free) solder balls. The package features non-solder-mask-defined (NSMD) pads and OptiGuard coating for enhanced assembly reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | CH1 | ESD-protected I/O channel 1 - routed directly to high-speed signal trace (e.g., MIPI CLK+) |
| B1 | CH2 | ESD-protected I/O channel 2 - paired with A1 for differential signaling |
| A2 | CH3 | ESD-protected I/O channel 3 - supports second differential pair (e.g., MIPI DATA0+) |
| B2 | CH4 | ESD-protected I/O channel 4 - paired with A2 for balanced impedance |
| A3 | VP | Positive supply rail - connects to local 3.3 V/5 V domain; integrates Zener for rail clamping |
| B3 | VN | Negative supply rail (GND) - reference for all clamp diodes and Zener cathode |
| A4 | CH5 | ESD-protected I/O channel 5 - extends protection to third differential lane |
| B4 | CH6 | ESD-protected I/O channel 6 - maintains capacitance symmetry with A4 |
| A5 | CH7 | ESD-protected I/O channel 7 - supports fourth differential pair or single-ended signals |
| B5 | CH8 | ESD-protected I/O channel 8 - completes 8-channel coverage for full MIPI DSI/CSI bus protection |
Key Features
| Feature | Design Value |
|---|---|
| OptiGuard coating | Reduces solder joint voiding and interfacial delamination during reflow, improving first-pass yield in fine-pitch WLCSP assembly |
| Zener-based VCC rail protection | Eliminates need for external 100 nF bypass capacitor on VP, saving 0.5 mm² PCB area and reducing BOM count |
| 0.02 pF I/O-to-GND capacitance matching | Ensures <±1 ps skew between differential lanes under ESD stress, preserving eye diagram integrity |
| 0.15 pF mutual capacitance | Limits crosstalk-induced jitter to <0.5% UI in 1 Gbps serial links, meeting MIPI D-PHY v2.1 requirements |
| 1000+ ESD strike endurance | Supports full production test cycles (e.g., 100% system-level ESD screening) without parameter drift or failure |
Applications
| Mobile Display Interface Protection | High-Speed Camera Data Lines |
|---|---|
Use Scenario: Protecting MIPI DSI lanes between application processor and AMOLED display in smartphones. IC Role / Device Role / Timing Role: ESD clamp placed within 3 mm of display connector to suppress ±8 kV contact discharges before they reach display driver IC inputs. Use Value: 0.8 pF capacitance prevents rise-time degradation (>10% margin vs. 1.5 pF limit), maintaining 2.5 Gbps DSI bandwidth. | Use Scenario: Shielding MIPI CSI-2 data pairs connecting image sensor to baseband SoC in flagship mobile cameras. IC Role / Device Role / Timing Role: Eight-channel array protects four differential lanes (CLK+/−, DATA0+/−, DATA1+/−, DATA2+/−) with matched capacitance. Use Value: 0.02 pF I/O-to-GND delta ensures <0.3 ps inter-lane skew, critical for pixel clock recovery at 1.5 Gbps/lane. |
| USB 2.0 OTG Port Protection | Serial ATA (SATA) Interface Guarding |
Use Scenario: Safeguarding D+/D− pins of micro-AB USB receptacles in portable media players and tablets. IC Role / Device Role / Timing Role: Dual-channel configuration (CH1/CH2) placed at port entry point to clamp ESD transients before USB transceiver. Use Value: 0.15 pF mutual capacitance avoids signal integrity loss in 480 Mbps full-speed mode, passing USB-IF compliance testing. | Use Scenario: Protecting SATA TX/RX differential pairs in ultrabook storage modules where board space is constrained. IC Role / Device Role / Timing Role: Two CM1230-08CP devices (16 channels total) guard four SATA lanes (TX0+/−, RX0+/−, TX1+/−, RX1+/−). Use Value: Integrated VP-VN Zener eliminates discrete 100 nF capacitor per rail, reducing component count by 4× versus discrete TVS solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E05U06DQAR | 4-channel, 0.5 pF typical capacitance, SOT-563 package (2.1 mm × 1.35 mm) | Lower channel count requires two devices for 8-line coverage; larger footprint increases trace length and parasitics | Select when board layout allows SOT packaging and ultra-low 0.5 pF capacitance is prioritized over integration density |
| ESD7L5.0ST5G | Single-channel, 0.35 pF capacitance, SOD-523 package; no integrated rail clamp | Requires external 100 nF capacitor per rail and eight discrete placements - higher assembly cost and layout complexity | Select only for legacy designs using discrete protection or where 0.35 pF is mandatory for >10 Gbps interfaces |
Compared with TPD4E05U06DQAR and ESD7L5.0ST5G, the CM1230-08CP delivers higher integration (8 channels in 2.46 mm × 0.96 mm), eliminates rail bypass capacitors via internal Zener, and maintains tighter capacitance matching-critical for MIPI compliance-while supporting the same ±8 kV IEC61000−4−2 rating.
Availability
CM1230-08CP is available at Aetrix Electronics and suitable for mobile handset design, high-speed camera module integration, and MIPI interface protection requiring stable component supply across extended production lifecycles.
Supply support for CM1230-08CP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient silicon solutions for automotive, industrial, cloud, medical, and mobile applications.
The CM1230 family belongs to onsemi's ESD protection portfolio, engineered specifically for high-data-rate mobile interfaces where sub-1 pF capacitance, rail-integrated clamping, and WLCSP miniaturization are mandatory design constraints.
FAQ
What is the maximum operating voltage for the CM1230-08CP?
The CM1230-08CP supports an operating supply voltage range of 3.3 V to 5.5 V between VP and VN pins. Its absolute maximum rating is 6.0 V, but sustained operation above 5.5 V risks exceeding thermal limits and degrading ESD performance. All electrical characteristics-including clamp voltage and leakage-are validated within the 3.3 V to 5.5 V range specified in Table 4 of the CM1230-08CP datasheet.
Does the CM1230-08CP require external bypass capacitors on the VP rail?
No, the CM1230-08CP does not require external bypass capacitors on the VP rail. It integrates a Zener diode between VP and VN that clamps positive ESD transients directly to ground, absorbing energy without relying on external capacitance. This feature is explicitly confirmed in the Product Description section and Electrical Schematic of the CM1230-08CP datasheet, eliminating the need for discrete 100 nF capacitors typically used with other ESD arrays.
How many ESD strikes can the CM1230-08CP withstand before performance degradation?
The CM1230-08CP is rated to withstand over 1000 ±12 kV contact ESD strikes under IEC61000−4−2 Level 4 test conditions, with pulses applied at 1-second intervals in a continuous test run. This endurance is verified per Note * on page 1 of the CM1230-08CP datasheet and reflects real-world reliability during manufacturing handling and end-user operation without measurable parameter shift.
What is the significance of the 0.02 pF I/O-to-GND capacitance matching spec for the CM1230-08CP?
The 0.02 pF typical I/O-to-GND capacitance matching ensures minimal skew between differential signal paths-critical for MIPI D-PHY and CSI-2 interfaces. In the CM1230-08CP, this tight matching directly translates to <±1 ps timing mismatch under ESD stress, preserving eye opening and jitter budgets. This value is measured per Table 4 conditions (1 MHz, VP = 3.3 V, VN = 0 V) and is a key differentiator versus competing arrays with >0.1 pF mismatch.
Is the CM1230-08CP compatible with lead-free reflow profiles?
Yes, the CM1230-08CP is fully compatible with lead-free reflow profiles. Its WLCSP10 package uses SnAgCu solder balls and is qualified for peak temperatures up to 260°C, with maximum dwell time above liquidus limited to 60 seconds. These parameters align with JEDEC J-STD-020 and are detailed in Figure 6 (Lead-free Solder Ball Reflow Profile) of the CM1230-08CP datasheet.
CM1230-08CP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 10-WFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 8
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 9.8V (Typ)
- Current - Peak Pulse (10/1000µs):
- 1A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-WLCSP (2.46x0.96)
CM1230-08CP FAQ
1.How can I place an order for CM1230-08CP through Aetrix?
Please submit a Request for Quotation (RFQ) for CM1230-08CP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CM1230-08CP reliable?
The price and inventory of CM1230-08CP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CM1230-08CP is usually 5 days.
3.What payment methods are accepted for CM1230-08CP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CM1230-08CP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CM1230-08CP?
CM1230-08CP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CM1230-08CP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CM1230-08CP?
For technical support, including CM1230-08CP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CM1230-08CP requirements.
6.How does Aetrix verify that CM1230-08CP is sourced from the original manufacturer or authorized distributors?
All CM1230-08CP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CM1230-08CP meets industry standards.
7.What is the process for return or replacement of CM1230-08CP?
All CM1230-08CP units undergo pre-shipment inspection (PSI). If there is an issue with CM1230-08CP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CM1230-08CP part is unused and in its original packaging.
Return procedure for CM1230-08CP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CM1230-08CP Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
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