onsemi CM1230-J2CP
- Part No.:
- CM1230-J2CP
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 4-WFBGA, WLCSP
- Datasheet:
-
CM1230-J2CP.pdf
- Description:
- TVS DIODE 3.3VWM 9.8VC 4WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:4,023
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Product details
Overview
CM1230-J2CP from onsemi is a 2-channel, low-capacitance ESD protection diode array in a 4-bump WLCSP (0.96 × 0.96 mm) package, designed for high-speed data lines requiring ≤0.8 pF channel capacitance, ±8 kV IEC61000−4−2 contact ESD protection, and rail-to-rail clamping with integrated VCC–GND Zener. It protects LCD/camera serial interfaces in wireless handsets.
For engineers reviewing the CM1230-J2CP datasheet, pinout, applications, or equivalent options, this page delivers verified electrical specs, CSP-4 bump mapping, differential-signal-optimized capacitance matching (0.02 pF), and real-world ESD robustness data for high-speed mobile interface design.
Technical Context
The CM1230-J2CP implements dual-channel bidirectional ESD clamping using paired diodes per I/O line-steering positive transients to VP and negative transients to VN-while an integrated Zener between VP and VN protects the supply rail without external bypass capacitors. Its architecture eliminates need for discrete rail clamp components in space-constrained mobile designs.
Designed specifically for high-speed serial links (e.g., MIPI D-PHY), it maintains <0.8 pF typical input capacitance across voltage (0–3.3 V) and temperature (–40°C to +85°C), with mutual coupling limited to 0.15 pF between adjacent channels-critical for signal integrity in differential pairs like LP-DSI or CSI-2.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channels | 2 independent ESD-protected I/O paths (CH1, CH2) |
| Capacitance (CIN) | 0.8 pF typical per channel at 1 MHz - enables >500 Mbps data rates without signal degradation |
| ESD Rating | ±8 kV contact / ±15 kV air per IEC61000−4−2 Level 4 - meets smartphone I/O port compliance |
| Clamp Voltage (VCL) | +9.8 V (positive) / –1.8 V (negative) at 1 A, 8/20 µs - limits transient overvoltage during ESD events |
| Supply Range (VP–VN) | 3.3 V to 5.5 V operating - compatible with standard mobile I/O voltage domains |
| Leakage Current | ±1.0 µA max at 5 V - ensures minimal standby power impact on battery-powered systems |
| Capacitance Matching | 0.02 pF typical difference between channels - preserves common-mode rejection in differential signaling |
Pinout & Package
CM1230-J2CP uses a 4-bump Wafer-Level Chip Scale Package (WLCSP4, Case 567CS), 0.96 × 0.96 mm body, 0.25 mm pitch, lead-free and RoHS-compliant. Bumps are arranged in 2×2 grid with orientation mark (+) at A1 corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | VN | Negative supply rail connection - reference ground for clamping negative ESD transients |
| B1 | CH2 | Channel 2 I/O terminal - bidirectionally protected signal line (e.g., DATA− in differential pair) |
| A2 | CH1 | Channel 1 I/O terminal - bidirectionally protected signal line (e.g., DATA+ in differential pair) |
| B2 | VP | Positive supply rail connection - reference for clamping positive ESD transients and Zener operation |
Key Features
| Feature | Design Value |
|---|---|
| OptiGuard coating | Enhances solder joint reliability during reflow and thermal cycling in high-volume mobile assembly |
| Rail-to-rail clamping with integrated Zener | Eliminates need for external 0.1 µF VP–GND capacitor - saves PCB area and BOM cost |
| 0.02 pF channel capacitance mismatch | Enables use in high-speed differential interfaces (e.g., MIPI) without skew-induced jitter |
| 0.15 pF mutual capacitance (I/O–I/O) | Minimizes crosstalk between adjacent protected lines in dense flex-cable routing |
| 1000+ ESD strike endurance | Validated for ≥1000 ±12 kV contact discharges - supports full product lifecycle in field-deployed devices |
Applications
| Mobile Display Interface Protection | Camera Serial Interface Protection |
|---|---|
Use Scenario: Protecting MIPI D-PHY lanes between application processor and AMOLED display module in smartphones. IC Role / Device Role / Timing Role: ESD transient suppressor on high-speed differential data pairs (CLK+/CLK−, DATA+/DATA−). Use Value: 0.8 pF capacitance prevents rise-time degradation at 1.5 Gbps, maintaining eye diagram integrity per MIPI specification. | Use Scenario: Shielding CSI-2 data lanes connecting image sensor to baseband SoC in compact camera modules. IC Role / Device Role / Timing Role: Bidirectional ESD clamp on each signal line, referenced to shared VP/VN rails. Use Value: 0.02 pF inter-channel capacitance matching preserves differential timing skew below 1 ps - critical for pixel clock recovery. |
| USB 2.0 OTG Port Protection | High-Speed Memory Card Interface |
Use Scenario: Safeguarding D+ and D− pins of micro-USB receptacles in portable media players and PDAs. IC Role / Device Role / Timing Role: Low-capacitance ESD array placed immediately at connector entry point. Use Value: Sub-1 pF loading avoids USB 2.0 eye mask violations at 480 Mbps while passing ±15 kV air discharge testing. | Use Scenario: Protecting SDIO or eMMC command/data lines in handheld PCs where board space limits discrete protection. IC Role / Device Role / Timing Role: Dual-channel clamp on CMD/DAT0 lines with shared VP/VN supply rails. Use Value: Integrated Zener eliminates need for separate VCC decoupling capacitor - reduces component count by one per protected pair. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CM1211-02CP | Same 2-channel WLCSP-4 package but higher 1.2 pF typical CIN; no integrated Zener diode | Requires external 0.1 µF VP–GND capacitor; less suitable for ultra-dense layouts | Select when lower cost is prioritized over board area savings and supply rail protection |
| TPD2E001DRYR | 2-channel SOT-5X3 package (1.0 × 1.0 mm); 1.0 pF CIN; no Zener; ±8 kV contact rating only | Larger footprint and higher parasitic inductance limit use to sub-400 Mbps interfaces | Choose when legacy SMT process compatibility outweighs performance and size advantages of WLCSP |
Compared with CM1211-02CP and TPD2E001DRYR, the CM1230-J2CP delivers superior high-speed signal integrity via lower capacitance (0.8 pF), tighter matching (0.02 pF), and integrated rail protection-enabling smaller PCB area, fewer components, and compliance with next-gen mobile interface standards.
Availability
CM1230-J2CP is available at Aetrix Electronics and suitable for mobile handset display interfaces, camera serial links, and USB 2.0 OTG ports requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for CM1230-J2CP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient, intelligent power and sensing solutions for automotive, industrial, cloud, medical, and mobile end-markets.
The CM1230-J2CP belongs to onsemi's OptiGuard-enabled ESD protection portfolio, engineered specifically for high-speed mobile interfaces where minimal capacitance, rail-integrated clamping, and ultra-small WLCSP packaging are mandatory.
FAQ
What is the exact package type and dimensions of the CM1230-J2CP?
The CM1230-J2CP uses a 4-bump Wafer-Level Chip Scale Package (WLCSP4, Case 567CS) measuring 0.96 mm × 0.96 mm with 0.25 mm ball pitch. It features non-solder-mask-defined round pads (0.275 mm diameter) and is lead-free/RoHS-compliant. The orientation mark (+) is located at bump A1, distinguishing it from CM1230-02CP solely by tape-and-reel marking position.
Does the CM1230-J2CP require external capacitors for ESD protection functionality?
No, the CM1230-J2CP does not require external bypass capacitors for ESD protection. Its integrated Zener diode between VP and VN actively clamps supply-rail transients, eliminating the need for a discrete 0.1 µF capacitor typically used in similar arrays. This integration reduces PCB area and component count while maintaining ±8 kV IEC61000−4−2 compliance.
How does the CM1230-J2CP support differential high-speed interfaces like MIPI D-PHY?
The CM1230-J2CP supports MIPI D-PHY by delivering 0.8 pF typical channel capacitance and only 0.02 pF capacitance mismatch between CH1 and CH2 - preserving signal symmetry and minimizing skew-induced jitter. Its 0.15 pF mutual capacitance between I/O pins further reduces crosstalk, enabling reliable operation at 1.5 Gbps without eye diagram degradation.
What is the maximum operating voltage range for the CM1230-J2CP?
The CM1230-J2CP operates across a supply voltage range of 3.3 V to 5.5 V (VP − VN), with absolute maximum ratings up to 6.0 V. It functions reliably from –40°C to +85°C ambient temperature and supports DC input voltages from (VN − 0.5 V) to (VP + 0.5 V) on any channel - making it compatible with standard mobile I/O voltage domains including 3.3 V and 5 V logic systems.
Is the CM1230-J2CP qualified for automotive applications?
No, the CM1230-J2CP is not AEC-Q200 qualified and is specified only for commercial temperature range (–40°C to +85°C). While its ESD robustness (±8 kV contact) exceeds many automotive requirements, onsemi positions this device explicitly for mobile handset, notebook, and consumer electronics applications-not automotive-grade systems requiring extended temperature, humidity, or vibration qualification.
CM1230-J2CP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 4-WFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 2
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 9.8V (Typ)
- Current - Peak Pulse (10/1000µs):
- 1A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-WLCSP (0.96x0.96)
CM1230-J2CP FAQ
1.How can I place an order for CM1230-J2CP through Aetrix?
Please submit a Request for Quotation (RFQ) for CM1230-J2CP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CM1230-J2CP reliable?
The price and inventory of CM1230-J2CP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CM1230-J2CP is usually 5 days.
3.What payment methods are accepted for CM1230-J2CP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CM1230-J2CP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CM1230-J2CP?
CM1230-J2CP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CM1230-J2CP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CM1230-J2CP?
For technical support, including CM1230-J2CP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CM1230-J2CP requirements.
6.How does Aetrix verify that CM1230-J2CP is sourced from the original manufacturer or authorized distributors?
All CM1230-J2CP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CM1230-J2CP meets industry standards.
7.What is the process for return or replacement of CM1230-J2CP?
All CM1230-J2CP units undergo pre-shipment inspection (PSI). If there is an issue with CM1230-J2CP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CM1230-J2CP part is unused and in its original packaging.
Return procedure for CM1230-J2CP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CM1230-J2CP Tags

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ESD9B5.0ST5G
onsemi

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DESD3V3E1BL-7B
Diodes Incorporated

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ESD5Z3.3T1G
onsemi

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D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
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