My Inquiry
My Account
onsemi CM1242-33CP
- Part No.:
- CM1242-33CP
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 2-XFBGA, WLCSP
- Datasheet:
-
CM1242-33CP.pdf
- Description:
- TVS DIODE 5VWM 8.6VC 2WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:4,719
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CM1242-33CP from onsemi is a single-channel ESD protection diode in 0201 Chip Scale Package (CSP), rated for ±30 kV IEC 61000-4-2 contact/air discharge, with 45–66 pF channel capacitance, ±5.5 V maximum input voltage, and clamp voltage of +8.6 V / −8.6 V at 1 A transient current - deployed in high-density mobile interface lines.
For engineers reviewing the CM1242-33CP datasheet, pinout, applications, or equivalent options, key selection criteria include ultra-low capacitance for high-speed data lines, sub-1 Ω dynamic resistance for fast clamping, RoHS II compliance, pure tin finish, and WLCSP2 mechanical compatibility with fine-pitch PCB assembly.
Technical Context
The CM1242-33CP implements a bidirectional TVS structure optimized for low-capacitance ESD suppression on signal paths such as USB 2.0, HDMI, and MIPI D-PHY interfaces. It operates across −40 °C to +85 °C and features symmetric breakdown voltage (±6.0 to ±9.0 V) and leakage current ≤ ±0.5 µA at ±3.3 V.
Its 0.60 mm × 0.30 mm × 0.275 mm WLCSP2 package uses two solder bumps (A and B) with no internal passive components - relying solely on silicon junction characteristics for transient response. The device meets IEC 61000-4-2 Level 4 without external series impedance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±30 kV per IEC 61000-4-2 (contact & air discharge) - ensures robust system-level ESD immunity without additional circuitry |
| Channel Capacitance | 45–66 pF at 1 MHz - preserves signal integrity on 480 Mbps USB 2.0 and 1.5 Gbps MIPI lanes |
| Clamp Voltage | +8.6 V / −8.6 V at 1 A, 8/20 µs - limits transient overvoltage below IC I/O absolute maximum ratings |
| Dynamic Resistance | 0.4–1.0 Ω - enables rapid energy shunting during nanosecond-scale ESD events |
| Operating Temp | −40 °C to +85 °C - supports consumer and industrial portable electronics environments |
| Leakage Current | ≤ ±0.5 µA at ±3.3 V - avoids DC loading on low-power sensor or audio bias networks |
Pinout & Package
CM1242-33CP is housed in a 2-bump WLCSP2 package (Case 567AV), measuring 0.60 mm × 0.30 mm × 0.275 mm, with bottom-side solder bumps for direct PCB mounting. No exposed pad or ground terminal - fully integrated two-terminal configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A | ESD Channel Pin 1 | Anode of bidirectional TVS junction - connects to protected signal line (e.g., USB D+) |
| B | ESD Channel Pin 2 | Cathode of bidirectional TVS junction - connects to reference plane (e.g., ground or VBUS return) |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 45–66 pF enables use on 480 Mbps USB 2.0 and MIPI D-PHY v1.2 differential pairs without signal degradation |
| IEC 61000-4-2 Level 4 compliance | ±30 kV contact discharge rating eliminates need for secondary board-level protection in handheld designs |
| Pure tin finish | RoHS II-compliant surface finish compatible with lead-free reflow profiles and mitigates whisker risk |
| 0201-equivalent footprint | 0.60 mm × 0.30 mm CSP size allows placement in space-constrained mobile PCB layouts where 0201 passives are used |
Applications
| USB 2.0 Data Lines | HDMI Hot-Plug Detect |
|---|---|
Use Scenario: Protecting D+ and D− lines in smartphone USB OTG ports against repeated electrostatic discharge during cable insertion. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed directly at connector entry point, clamping transients before reaching USB PHY. Use Value: 45–66 pF capacitance prevents eye diagram closure at 480 Mbps; ±30 kV rating ensures >10,000 plug/unplug cycles without performance drift. | Use Scenario: Safeguarding HDMI HPD (Hot-Plug Detect) pin in tablets and docking stations from ESD during display connection/disconnection. IC Role / Device Role / Timing Role: Standalone ESD shunt between HPD line and chassis ground, activated only during transient events. Use Value: Sub-1 Ω dynamic resistance achieves <1 ns response time; low leakage avoids false HPD assertion under DC bias. |
| MIPI D-PHY Clock Lanes | Audio Jack Microphone Bias |
Use Scenario: Protecting 1.5 Gbps MIPI D-PHY clock differential pair in camera modules against ESD from flex cable handling during assembly. IC Role / Device Role / Timing Role: Low-capacitance TVS pair placed adjacent to image sensor connector, preserving 1.5 GHz bandwidth. Use Value: 66 pF max capacitance maintains >10 dB return loss up to 1.5 GHz; symmetric clamp ensures balanced common-mode rejection. | Use Scenario: Shielding electret microphone bias line in wireless earbuds from user-hand ESD during jack insertion or touch events. IC Role / Device Role / Timing Role: Single-ended ESD clamp between MIC_BIAS rail and ground, operating within ±5.5 V supply envelope. Use Value: ≤0.5 µA leakage prevents DC offset shift in analog mic amplifier; 0.6 mm × 0.3 mm size fits behind 3.5 mm jack cutout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | 0.65 pF typical capacitance (lower), but dual-channel; 12 V clamp voltage at 1 A | Requires separate placement per line; better for >1 Gbps interfaces but higher cost per channel | Select when protecting multiple independent high-speed lines with tighter capacitance budget |
| ESD5Z3.3T5G | Higher 100 pF capacitance; SOD-523 package (1.2 mm × 0.8 mm), larger footprint | Less suitable for MIPI/USB 2.0 due to bandwidth limitation; preferred for lower-speed GPIO or power rails | Choose when board space permits larger package and ESD threat level is moderate (±15 kV) |
Compared with TPD2E001DRYR and ESD5Z3.3T5G, the CM1242-33CP delivers optimal balance of ultra-small footprint (0.6 × 0.3 mm), mid-range capacitance (45–66 pF), and industry-leading ±30 kV ESD rating - making it the preferred choice for space-constrained, high-data-rate mobile interfaces where single-line protection suffices.
Availability
CM1242-33CP is available at Aetrix Electronics and suitable for USB 2.0 interface protection, MIPI D-PHY camera modules, and HDMI hot-plug detect circuits requiring stable component supply and consistent WLCSP2 packaging.
Supply support for CM1242-33CP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier focused on energy-efficient technologies for automotive, industrial, cloud, and mobile applications.
The CM1242-33CP belongs to onsemi's ESD protection portfolio designed specifically for ultra-compact, high-speed data line protection in portable electronics - emphasizing minimal parasitic capacitance and IEC-compliant transient suppression in chip-scale form factors.
FAQ
What is the exact package type and dimensions of the CM1242-33CP?
The CM1242-33CP uses a 2-bump WLCSP2 package (Case 567AV) with dimensions 0.60 mm × 0.30 mm × 0.275 mm. It has no leads or wire bonds - solder bumps A and B are located on the bottom surface per the mechanical drawing in Rev. 6 datasheet. This matches standard 0201 PCB land patterns with adjusted pad geometry for bump attachment.
Does the CM1242-33CP support bidirectional ESD protection?
Yes, the CM1242-33CP provides symmetrical bidirectional protection with breakdown voltages of +6.0 to +9.0 V (positive) and −6.0 to −9.0 V (negative) at 10 mA, and identical ±30 kV IEC 61000-4-2 ratings for both polarities - enabling use on AC-coupled or floating signal lines like USB D+/D− without polarity concerns.
What is the maximum allowable operating voltage for the CM1242-33CP?
The CM1242-33CP has a maximum input voltage rating of ±5.5 V, meaning it can safely protect signal lines operating within that DC voltage envelope - including 3.3 V, 2.5 V, and 1.8 V I/O standards. Exceeding ±5.5 V risks permanent junction damage even without ESD events.
How does the CM1242-33CP compare to discrete Zener-based ESD solutions?
Unlike discrete Zener diodes, the CM1242-33CP uses optimized silicon junction design for lower dynamic resistance (0.4–1.0 Ω) and tighter capacitance control (45–66 pF). It achieves faster response (<1 ns), lower clamping voltage (+8.6 V / −8.6 V), and guaranteed IEC 61000-4-2 compliance - whereas discrete Zeners often require external RC filtering and lack standardized ESD certification.
Is the CM1242-33CP compatible with lead-free reflow processes?
Yes, the CM1242-33CP features a pure tin finish and is qualified for standard lead-free reflow profiles (J-STD-020, peak 260 °C). Its WLCSP2 package withstands thermal cycling without bump fracture or intermetallic growth issues, and the device meets RoHS II Directive 2011/65/EU requirements.
CM1242-33CP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 2-XFBGA, WLCSP
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 5V
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 8.6V (Typ)
- Current - Peak Pulse (10/1000µs):
- 1A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 2-WLCSP (0.6x0.3)
CM1242-33CP FAQ
1.How can I place an order for CM1242-33CP through Aetrix?
Please submit a Request for Quotation (RFQ) for CM1242-33CP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CM1242-33CP reliable?
The price and inventory of CM1242-33CP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CM1242-33CP is usually 5 days.
3.What payment methods are accepted for CM1242-33CP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CM1242-33CP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CM1242-33CP?
CM1242-33CP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CM1242-33CP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CM1242-33CP?
For technical support, including CM1242-33CP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CM1242-33CP requirements.
6.How does Aetrix verify that CM1242-33CP is sourced from the original manufacturer or authorized distributors?
All CM1242-33CP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CM1242-33CP meets industry standards.
7.What is the process for return or replacement of CM1242-33CP?
All CM1242-33CP units undergo pre-shipment inspection (PSI). If there is an issue with CM1242-33CP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CM1242-33CP part is unused and in its original packaging.
Return procedure for CM1242-33CP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CM1242-33CP Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
