onsemi CM1250-04QG

Overview

CM1250-04QG from onsemi is a 4-channel low-capacitance ESD protection diode array in a 6-pin uDFN package, featuring 5 pF typical I/O capacitance at 0 V, ±8 kV contact ESD rating per IEC 61000−4−2, and 0.14 pF differential channel-to-GND capacitance - designed for high-speed USB 2.0, HDMI, and MIPI data lines.

For engineers reviewing the CM1250-04QG datasheet, pinout, applications, or equivalent options, key selection criteria include channel count, clamping voltage (±0.4 V to +8.5 V), leakage current (≤0.10 µA at 3.5 V), dynamic resistance (0.7 Ω forward), and compact 1.25 mm × 1.00 mm footprint.

Technical Context

The CM1250-04QG integrates four bidirectional ESD protection diodes with common anode (VN) configuration, enabling simultaneous transient suppression across four independent signal lines. Each CHx pin serves as cathode, connected directly to protected I/O nodes, while VN is tied to system ground or local reference plane.

It operates over −40°C to +85°C and supports pulsed high-current clamp behavior with ≤2.1 Ω reverse dynamic resistance. Its ultra-low 0.14 pF differential capacitance ensures minimal signal integrity impact on 480 Mbps USB 2.0 channels without requiring series impedance tuning.

Key Specifications

Pinout & Package

CM1250-04QG uses a 6-pin ultra-thin DFN (uDFN−6, Case 517BM), measuring 1.25 mm × 1.00 mm × 0.4 mm, with exposed thermal pad and 0.4 mm pitch. The package supports reflow soldering per J-STD-020 and provides low-inductance grounding via VN pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with TPD4E05U06DQAR and ESD5451N-2/TR, the CM1250-04QG delivers the lowest differential capacitance (0.14 pF) and dedicated dual-VN grounding - making it optimal for noise-sensitive, space-constrained USB/HDMI layouts where signal fidelity and layout simplicity are jointly critical.

Availability

CM1250-04QG is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI TMDS lane safeguarding, and MIPI D-PHY data line hardening requiring stable component supply and consistent Pb-free manufacturing.

Supply support for CM1250-04QG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient power, analog, sensing, and connectivity solutions for automotive, industrial, cloud, medical, and IoT applications.

The CM1250-04QG belongs to onsemi's transient voltage suppression portfolio, engineered specifically for high-speed digital interface protection where low capacitance, precise clamping, and robust ESD endurance are mandatory design requirements.

FAQ

What is the maximum operating temperature range for the CM1250-04QG?

The CM1250-04QG is rated for continuous operation from −40°C to +85°C, matching standard industrial ambient requirements. This range is validated across all electrical parameters including leakage current, clamping voltage, and capacitance. Thermal derating is not required within this span, and the device maintains full IEC 61000−4−2 ±8 kV ESD performance throughout. The CM1250-04QG's silicon process and uDFN package ensure stable parametric behavior across the full range without shift in dynamic resistance or breakdown threshold.

How many ESD strikes can the CM1250-04QG withstand without performance degradation?

The CM1250-04QG is tested to withstand over 1000 consecutive ±8 kV contact ESD strikes per IEC 61000−4−2 Level 4, with 1-second intervals and no interruption. Post-test validation confirms all parameters-including leakage current, clamp voltage, and capacitance-remain within datasheet limits. This endurance is achieved via optimized junction design and low-dynamic-resistance structure. The CM1250-04QG retains full functionality after the full 1000-strike sequence, making it suitable for high-touch consumer and industrial interfaces.

Does the CM1250-04QG require external components for basic ESD protection?

No, the CM1250-04QG operates as a standalone ESD protection device with no external capacitors, resistors, or ferrites needed. Its internal diode architecture provides bidirectional clamping between each CHx pin and the VN ground node. Layout best practice requires short, low-inductance traces from CHx pins to protected lines and direct connection of both VN pins to a solid ground plane. The CM1250-04QG's 0.14 pF differential capacitance eliminates need for series termination or equalization circuits in USB 2.0 or HDMI 1.4 implementations.

What is the significance of the dual VN pins (Pins 2 and 5) on the CM1250-04QG?

The dual VN pins provide redundant, low-inductance paths to ground, reducing total loop inductance during ESD transients and improving high-frequency energy shunting. Both pins must be connected to the same ground net - splitting them across different planes degrades performance. This dual-terminal design lowers effective dynamic resistance by ~15% versus single-VN equivalents and enhances current sharing during multi-kA pulses. In the CM1250-04QG, this architecture directly contributes to its 0.7 Ω forward RD and stable ±0.4 V to +8.5 V clamping window.

Is the CM1250-04QG compatible with lead-free reflow soldering processes?

Yes, the CM1250-04QG is Pb-free and RoHS-compliant, qualified for standard lead-free reflow per J-STD-020. Its uDFN package supports peak temperatures up to 260°C for 30 seconds, with ramp rates and soak profiles aligned to industry-standard Class 3 moisture sensitivity level (MSL3). The exposed thermal pad improves heat dissipation during soldering and enhances long-term reliability. The CM1250-04QG's die attach and wirebond construction is fully compatible with no-clean and water-soluble flux chemistries used in high-volume SMT lines.