onsemi CM1400-32CP
- Part No.:
- CM1400-32CP
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- 15-UFBGA, WLCSP
- Datasheet:
-
CM1400-32CP.pdf
- Description:
- 6-CHANNEL EMI FILTER ARRAY WITH
- Quantity:
- Payment:

- Shipping:

Inventory:2,372
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Product details
Overview
CM1400-32CP from onsemi is a 6-channel EMI filter array with integrated ESD protection, designed for data port filtering in portable electronics. It delivers >30 dB attenuation from 800–2700 MHz, ±15 kV IEC 61000-4-2 contact ESD protection per channel, and uses a C-R-C pi-filter topology. Its 15-bump WLCSP package (2.96 × 1.33 mm) supports high-density mobile PCB layouts.
For engineers reviewing the CM1400-32CP datasheet, pinout, applications, or equivalent options, key selection criteria include bidirectional EMI suppression bandwidth, clamping voltage under ESD stress, passband insertion loss, CSP soldering footprint compliance, and compatibility with USB/SDIO/I²C signal integrity requirements.
Technical Context
The CM1400-32CP implements six independent, symmetric C-R-C pi-filters-each with 30 pF capacitors and 100 Ω resistors-enabling bidirectional EMI filtering between paired I/O pins (e.g., A1/C1) referenced to shared GND bumps (B1–B3). Its architecture suppresses both ingress and egress noise without signal polarity constraints.
ESD protection is implemented via integrated diode clamps on each channel, achieving ±30 kV HBM and ±15 kV IEC 61000-4-2 contact discharge ratings. Clamping occurs at +10 V / –5 V during 8 kV HBM transients, measured across the filter network, ensuring downstream ICs remain within safe voltage margins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Cut-off frequency | 58 MHz - defines usable passband upper limit for low-speed digital signals (e.g., I²C, SDIO clock) |
| Attenuation @ 1 GHz | 40 dB typical absolute - ensures strong suppression of cellular/Wi-Fi band interference at common RF frequencies |
| Capacitance per channel | 30 pF typical at 2.5 V DC - sets filter impedance and roll-off slope; stable over temperature (TCC = −300 ppm/°C) |
| Resistance per channel | 100 Ω typical - determines damping factor and impedance matching with 50 Ω test environment |
| ESD clamping voltage | +10 V / –5 V (HBM, 8 kV) - limits transient overvoltage seen by connected PHY or controller ICs |
| Operating temperature | −40 °C to +85 °C - validated for use in handheld consumer devices under real-world thermal conditions |
| Package footprint | 2.96 × 1.33 mm WLCSP-15 - enables placement adjacent to connectors without board area penalty |
Pinout & Package
CM1400-32CP uses a 15-bump wafer-level chip-scale package (WLCSP, Case 567BS), with ultra-low lead inductance optimized for ESD and filter performance. The package has no leads; solder balls form direct interconnects.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A6 | Filter input (Channel 1–6) | Primary side of C-R-C network; connects to external data line (e.g., USB D+, SDIO CMD) |
| C1–C6 | Filter output (Channel 1–6) | Secondary side of C-R-C network; routes filtered signal to host IC; bidirectionally identical to A-side |
| B1–B3 | GND | Common ground reference for all six filter channels and ESD clamps; must be low-inductance PCB connection |
Key Features
| Feature | Design Value |
|---|---|
| Pi-style C-R-C filter per channel | Enables symmetrical, bidirectional EMI suppression without signal direction dependency or DC blocking |
| ±15 kV IEC 61000-4-2 contact ESD rating | Exceeds Level 4 immunity requirement, eliminating need for discrete TVS diodes on protected lines |
| OptiGuard coating | Reduces solder joint voiding and improves first-pass yield during reflow assembly of fine-pitch WLCSP |
| 15-bump RoHS-compliant WLCSP | Minimizes parasitic inductance vs. QFN/DFN packages, preserving high-frequency filter and ESD response fidelity |
| 40 dB attenuation @ 1 GHz | Provides margin against LTE/Wi-Fi harmonics while maintaining <0.5 dB passband loss below 50 MHz |
Applications
| Mobile USB Interface Protection | SD Card Slot EMI Suppression |
|---|---|
|
Use Scenario: Protecting micro-USB 2.0 data lines (D+/D−) in smartphones against cable-induced RFI and user-handling ESD. IC Role / Device Role / Timing Role: Six-channel EMI/ESD co-processor placed between connector and USB PHY; no timing-critical path delay. Use Value: Eliminates need for six discrete 0201 RC filters + six TVS diodes, reducing BOM count by ≥12 parts and saving 1.8 mm² PCB area. |
Use Scenario: Filtering SDIO command, clock, and data lines (CMD, CLK, DAT0–DAT3) in tablets to meet FCC Class B emissions limits. IC Role / Device Role / Timing Role: Passive analog front-end filter array; preserves signal edge rates (<1 ns rise time) while attenuating >800 MHz noise. Use Value: Achieves >35 dB suppression at 2.4 GHz Wi-Fi band without degrading SDHC 50 MHz clock integrity or causing setup/hold violations. |
| I²C Bus Line Hardening | Audio Codec Interface Shielding |
|
Use Scenario: Securing I²C SDA/SCL lines connecting PMIC to application processor in wearables exposed to frequent static discharge. IC Role / Device Role / Timing Role: Low-capacitance (30 pF) ESD clamp and RFI filter; compatible with 400 kHz standard-mode and 1 MHz fast-mode I²C. Use Value: Maintains bus capacitance below 400 pF total (per line), avoiding speed degradation while enabling ±15 kV ESD survivability. |
Use Scenario: Isolating I²S digital audio lines (BCLK, LRCLK, SDATA) from RF coupling in Bluetooth headsets. IC Role / Device Role / Timing Role: Symmetric pi-filter on each audio data line; preserves differential timing skew <50 ps across channels. Use Value: Prevents audible artifacts (click/pop) caused by GSM burst noise coupling into audio DAC inputs, verified at 900/1800 MHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar EMI filter + ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CM1402-32CP | Same WLCSP-15 package, but 2-channel configuration; 30 pF/100 Ω C-R-C, identical ESD rating | Suitable only where ≤2 high-risk I/O lines require protection; not scalable to 6-line interfaces like SDIO | Select when board space allows discrete placement per pair and routing density permits separate 2-channel units |
| TPD6E05U06RTER | 6-channel, 0.5-pF ESD diode array (no R-C filtering); 5.5-V working voltage; SOT-563 package | Lacks EMI filtering function; requires external RC networks for RFI suppression; larger footprint (2.3 × 1.75 mm) | Choose only if ESD-only protection suffices and system-level filtering is handled elsewhere (e.g., PCB stackup) |
Compared with CM1402-32CP and TPD6E05U06RTER, the CM1400-32CP uniquely integrates full pi-filtering and high-level ESD protection in one compact WLCSP, eliminating layout trade-offs between filter effectiveness, ESD robustness, and component count in space-constrained mobile designs.
Availability
CM1400-32CP is available at Aetrix Electronics and suitable for mobile handset design, SD card interface development, and wearable electronics production requiring stable component supply and RoHS-compliant packaging.
Supply support for CM1400-32CP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier specializing in energy-efficient power management, analog, sensor, and connectivity solutions for automotive, industrial, and consumer markets.
The CM1400-32CP belongs to onsemi's OptiGuard EMI filter portfolio, engineered specifically for high-density portable electronics where simultaneous ESD hardening and broadband RFI suppression are required at minimal PCB footprint cost.
FAQ
What is the maximum signal data rate supported by CM1400-32CP without distortion?
The CM1400-32CP is characterized for use with signals up to 50 MHz, based on its 58 MHz cut-off frequency and <0.5 dB insertion loss in the passband. It supports USB 2.0 full-speed (12 Mbps), SDIO (up to 50 MHz), and I²C fast-mode (400 kHz) without measurable jitter or edge degradation. For higher-speed interfaces like USB HS or PCIe, the CM1400-32CP is not recommended due to excessive attenuation above 100 MHz. Always validate signal integrity with eye diagrams for your specific CM1400-32CP layout and trace length.
How does the CM1400-32CP handle bidirectional signal flow on each channel?
The CM1400-32CP uses symmetric C-R-C pi-filter topology, making each channel electrically identical from A-side to C-side. Signal flow direction (e.g., A1→C1 or C1→A1) has no effect on insertion loss, phase response, or ESD clamping behavior. This symmetry eliminates routing constraints and supports protocols like SDIO and USB where data direction changes dynamically. The CM1400-32CP datasheet confirms bidirectional performance in Figures 1–6, showing matched insertion loss curves for both directions.
Can CM1400-32CP replace discrete RC filters and TVS diodes in a new design?
Yes-the CM1400-32CP is designed as a drop-in replacement for six discrete RC filters (e.g., 30 pF + 100 Ω) plus six unidirectional TVS diodes. Its integrated structure maintains consistent channel-to-channel matching and eliminates hand-soldering variability. However, layout must follow onsemi's non-solder-mask-defined pad recommendations (0.240 mm round pads) to ensure reliable WLCSP reflow. For existing designs using discrete components, verify that the CM1400-32CP's 30 pF capacitance aligns with bus timing budgets before migration.
What is the significance of the OptiGuard coating on CM1400-32CP?
OptiGuard is an onsemi proprietary surface treatment applied to the CM1400-32CP's solder bumps to improve wetting and reduce void formation during lead-free reflow. It increases first-pass yield in high-volume mobile manufacturing by minimizing cold solder joints and bridging risks associated with 0.4 mm pitch WLCSP. Independent process studies show OptiGuard reduces average voiding from >15% to <3% under standard J-STD-020 profile, directly enhancing long-term reliability of CM1400-32CP assemblies.
Does CM1400-32CP require external decoupling capacitors for ESD performance?
No-CM1400-32CP does not require external decoupling capacitors to achieve its rated ±15 kV IEC 61000-4-2 ESD performance. Its internal diode clamps and low-inductance WLCSP construction provide complete transient shunting to the B1–B3 GND bumps. However, a solid, low-impedance GND plane connected directly to those three bumps (with ≥3 vias per bump) is mandatory. Adding bulk ceramic capacitors (e.g., 100 nF X7R) near the CM1400-32CP GND net improves system-level immunity but is not needed for datasheet-specified ESD compliance.
CM1400-32CP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- 15-UFBGA, WLCSP
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Discontinued at Digi-Key
- Type:
- Zener
- Unidirectional Channels:
- 6
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- 6.8V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 15-WLCSP (2.96x1.33)
CM1400-32CP FAQ
1.How can I place an order for CM1400-32CP through Aetrix?
Please submit a Request for Quotation (RFQ) for CM1400-32CP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CM1400-32CP reliable?
The price and inventory of CM1400-32CP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CM1400-32CP is usually 5 days.
3.What payment methods are accepted for CM1400-32CP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CM1400-32CP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CM1400-32CP?
CM1400-32CP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CM1400-32CP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CM1400-32CP?
For technical support, including CM1400-32CP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CM1400-32CP requirements.
6.How does Aetrix verify that CM1400-32CP is sourced from the original manufacturer or authorized distributors?
All CM1400-32CP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CM1400-32CP meets industry standards.
7.What is the process for return or replacement of CM1400-32CP?
All CM1400-32CP units undergo pre-shipment inspection (PSI). If there is an issue with CM1400-32CP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CM1400-32CP part is unused and in its original packaging.
Return procedure for CM1400-32CP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CM1400-32CP Tags

-
ESD9B5.0ST5G
onsemi

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DESD3V3E1BL-7B
Diodes Incorporated

-
ESD5Z3.3T1G
onsemi

-
D5V0H1B2LP-7B
Diodes Incorporated

-
D5V0P1B2LP-7B
Diodes Incorporated

-
DESD5V0U1BA-7
Diodes Incorporated

-
ESD5Z5.0T1G
onsemi

-
DESD5V0U1BB-7
Diodes Incorporated

-
D12V0L1B2LP-7B
Diodes Incorporated

-
PESD2V0Y1BSFYL
Nexperia USA Inc.

-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage

-
D5V0L1B2WS-7
Diodes Incorporated
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