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onsemi CM1771-5006YJQ
- Part No.:
- CM1771-5006YJQ
- Manufacturer:
- onsemi
- Category:
- TVS Diodes
- Package:
- Die
- Datasheet:
-
CM1771-5006YJQ.pdf
- Description:
- TVS DIODE DIE
- Quantity:
- Payment:
- Shipping:
Inventory:3,593
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Product details
Overview
CM1771-5006YJQ from onsemi is a single-channel ESD protection diode in bare-die form, designed for symmetrical AC signal line protection using back-to-back Zener configuration. It delivers ±6 kV contact ESD immunity per MIL-STD-883 HBM, ±3 kV per IEC61000-4-2, with <1.0 µA leakage at +85 V and breakdown voltages of +90 V (positive) and −80 V (negative) at 1.0 mA.
For engineers reviewing the CM1771-5006YJQ datasheet, pinout, applications, or equivalent options, this device serves as a compact, Pb-free ESD clamp for space-constrained LED lighting modules and interface circuits where low-leakage, bidirectional transient suppression is required.
Technical Context
The CM1771-5006YJQ implements a monolithic silicon die with two anti-parallel Zener junctions-enabling symmetrical clamping for AC-coupled nodes without polarity dependence. Its P+ doped silicon substrate and gold top-side pads support wire-bonding directly to PCB or leadframe.
It operates across −40 °C to +150 °C and stores from −55 °C to +150 °C, meeting automotive-grade thermal requirements. The device exhibits no conduction below ±85 V, ensuring minimal signal interference in high-voltage analog or digital interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating (HBM) | ±6 kV - meets MIL-STD-883 Method 3015 for robust handling in assembly and field environments |
| ESD Rating (IEC61000-4-2) | ±3 kV - certified for system-level electrostatic discharge immunity in end equipment |
| Breakdown Voltage (VBD+) | +90 V min - clamps positive transients above this threshold while preserving signal integrity below |
| Breakdown Voltage (VBD−) | −80 V min - provides matched negative-side clamping for balanced AC protection |
| Leakage Current (ILEAK) | <1.0 µA at +85 V - ensures negligible DC loading on protected lines during normal operation |
| Operating Temp Range | −40 °C to +150 °C - supports under-hood automotive, industrial LED drivers, and high-temp module designs |
Pinout & Package
Bare die package: rectangular silicon wafer, 480 µm × 440 µm × 6 mils thick, with two gold-plated top-side pads (356 µm × 117 µm each, spaced 103 µm center-to-center); no back metal - substrate serves as mechanical ground reference.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Top Pad A | Signal Node | Anode of one Zener, cathode of the other - forms bidirectional clamping path with Top Pad B |
| Top Pad B | Reference Node | Cathode of one Zener, anode of the other - completes symmetrical ESD current path during ± transients |
Key Features
| Feature | Design Value |
|---|---|
| Symmetrical Zener architecture | Enables identical clamping behavior for both polarities - critical for AC-coupled data and sensor lines |
| Ultra-low leakage (<1 µA @ +85 V) | Prevents signal distortion or bias shift in high-impedance analog inputs and LED current-sense paths |
| ±6 kV HBM ESD rating | Exceeds standard component-level ESD qualification - reduces need for secondary board-level protection |
| Pb-free, RoHS-compliant construction | Meets global environmental compliance mandates without compromising ESD performance or thermal reliability |
Applications
| LED Lighting Modules | Industrial Interface Circuits |
|---|---|
Use Scenario: Protecting constant-current driver outputs and serial control lines (e.g., DALI, 1-Wire) in outdoor LED luminaires exposed to handling ESD and lightning-induced surges. IC Role / Device Role / Timing Role: ESD transient voltage suppressor placed directly at connector or IC bond pad to shunt fast-rising ESD energy before it reaches sensitive driver ICs. Use Value: Prevents latch-up or gate oxide damage in LED driver MOSFETs and microcontrollers, extending field lifetime in ungrounded installations. | Use Scenario: Safeguarding RS-485, CAN, or I²C bus lines in programmable logic controllers (PLCs) operating in electrically noisy factory environments. IC Role / Device Role / Timing Role: Bidirectional clamping element integrated into PCB-level TVS network to absorb ESD without distorting differential signaling waveforms. Use Value: Maintains signal fidelity up to 10 Mbps while surviving repeated ±6 kV contact discharges - reducing field return rates due to interface failure. |
| Automotive Interior Modules | Consumer Electronics Sensor Interfaces |
Use Scenario: Protecting touch panel I/O, ambient light sensor inputs, and USB-C CC line detection in vehicle infotainment systems. IC Role / Device Role / Timing Role: Low-capacitance ESD clamp co-located with ASIC input pins to minimize stub length and preserve high-frequency response. Use Value: Enables AEC-Q200 alignment via extended temperature operation (−40 °C to +150 °C) and eliminates need for larger discrete TVS diodes. | Use Scenario: Shielding MEMS microphone bias lines and accelerometer interrupt outputs in portable audio devices subjected to user-handling ESD. IC Role / Device Role / Timing Role: Miniature Zener-based protector mounted adjacent to sensor IC die on flex PCB to reduce parasitic inductance in ESD current path. Use Value: Achieves <0.5 pF effective capacitance - avoids attenuation of audio-band signals and preserves SNR in high-gain preamp stages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NUP4105MR6T1G | Quad-channel SOT-563 packaged ESD array; higher capacitance (~15 pF/channel), lower ESD rating (±8 kV HBM, ±15 kV air) | Designed for multi-line protection (USB, HDMI); not suitable for ultra-low-capacitance or bare-die integration | Select when protecting multiple low-speed I/Os with standard surface-mount assembly - not for space-limited or AC-signal-specific use cases |
| Vishay ESD9X5.0ST5G | Single-channel SOD-923 package; ±12 kV HBM/±8 kV IEC rating; higher leakage (~5 µA @ 5 V) | Optimized for low-voltage digital I/O (3.3 V/5 V); unsuitable for >85 V signal rails or high-temp operation | Choose for cost-sensitive consumer ports requiring highest HBM rating - avoid where low leakage or wide temperature range is mandatory |
Compared with NUP4105MR6T1G and ESD9X5.0ST5G, the CM1771-5006YJQ uniquely combines bare-die form factor, symmetrical ±80–90 V breakdown, sub-1 µA leakage, and full automotive temperature range - making it optimal for embedded AC-signal protection where layout area and thermal margin are constrained.
Availability
CM1771-5006YJQ is available at Aetrix Electronics and suitable for LED lighting modules, industrial interface circuits, and automotive interior electronics requiring stable component supply with guaranteed traceability and long-term lifecycle support.
Supply support for CM1771-5006YJQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient power, analog, sensing, and connectivity solutions for automotive, industrial, cloud, medical, and IoT applications.
The CM1771-5006YJQ belongs to onsemi's ESD protection portfolio, engineered specifically for high-reliability, space-constrained applications demanding symmetrical clamping, ultra-low leakage, and extended temperature operation - especially in LED drivers and industrial communication interfaces.
FAQ
What is the exact package type and mounting method for CM1771-5006YJQ?
The CM1771-5006YJQ is supplied as a bare silicon die (480 µm × 440 µm × 6 mils), with two gold-plated top-side pads for wire bonding. It has no molded package or leads. Mounting requires die attach to a substrate followed by aluminum or gold wire bonding to both pads - typical in hybrid modules and high-density LED driver assemblies.
Does CM1771-5006YJQ meet AEC-Q200 stress testing requirements?
The CM1771-5006YJQ is not AEC-Q200 qualified as a standalone component, but its −40 °C to +150 °C operating range, robust ESD ratings, and silicon die construction enable successful integration into AEC-Q200-compliant modules when validated within the full system-level test plan - including temperature cycling and ESD stress on the final assembly.
Can CM1771-5006YJQ be used on DC-biased signal lines?
Yes - the CM1771-5006YJQ remains non-conductive below ±85 V, making it suitable for DC-biased analog or digital lines up to that voltage. Its symmetrical Zener structure ensures equal clamping for positive and negative transients, unlike unidirectional TVS diodes which require careful polarity alignment.
What is the maximum continuous working voltage for CM1771-5006YJQ?
The CM1771-5006YJQ is rated for continuous operation up to +85 V (DC or peak AC), as confirmed by its <1.0 µA leakage specification at that voltage. Exceeding +85 V risks premature conduction and accelerated degradation; design margin should maintain at least 10% derating below the +90 V minimum breakdown threshold.
Is CM1771-5006YJQ compatible with reflow soldering processes?
No - the CM1771-5006YJQ is a bare die and cannot undergo reflow soldering. It must be mounted using die-attach epoxy or solder, then wire-bonded. Reflow is only applicable to packaged variants like the CM1771-5006YL in wafer-jar format - not the YJQ variant.
CM1771-5006YJQ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- onsemi
- Package/Case:
- Die
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- 90V
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- Die
CM1771-5006YJQ FAQ
1.How can I place an order for CM1771-5006YJQ through Aetrix?
Please submit a Request for Quotation (RFQ) for CM1771-5006YJQ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CM1771-5006YJQ reliable?
The price and inventory of CM1771-5006YJQ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CM1771-5006YJQ is usually 5 days.
3.What payment methods are accepted for CM1771-5006YJQ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CM1771-5006YJQ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CM1771-5006YJQ?
CM1771-5006YJQ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CM1771-5006YJQ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CM1771-5006YJQ?
For technical support, including CM1771-5006YJQ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CM1771-5006YJQ requirements.
6.How does Aetrix verify that CM1771-5006YJQ is sourced from the original manufacturer or authorized distributors?
All CM1771-5006YJQ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CM1771-5006YJQ meets industry standards.
7.What is the process for return or replacement of CM1771-5006YJQ?
All CM1771-5006YJQ units undergo pre-shipment inspection (PSI). If there is an issue with CM1771-5006YJQ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CM1771-5006YJQ part is unused and in its original packaging.
Return procedure for CM1771-5006YJQ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CM1771-5006YJQ Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
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